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    • 52. 发明申请
    • Allocating processing units to processing clusters to generate simulated diffraction signals
    • 将处理单元分配到处理簇以产生模拟衍射信号
    • US20080115140A1
    • 2008-05-15
    • US11525793
    • 2006-09-22
    • Hemalatha ErvaHong QiuJunwei BaoVi Vuong
    • Hemalatha ErvaHong QiuJunwei BaoVi Vuong
    • G06F9/50
    • G06F9/505
    • In allocating processing units, first and second requests for jobs are obtained. First and second numbers of processing units requested are determined. First and second numbers of available processing units are determined. When the first number of available processing units is non-zero, the first number of available number of processing units or the first number of processing units requested is assigned to a first processing cluster. A first processing unit in the first processing cluster is designated as a master node. When the second number of available processing units is non-zero, the second number of available number of processing units or the second number of processing units requested is assigned to a second processing cluster. The first processing unit in the second processing cluster is designated as a slave node. The first and second jobs are assigned to the first and second processing clusters, respectively.
    • 在分配处理单元时,获得第一和第二个作业请求。 确定请求的第一和第二数量的处理单元。 确定可用处理单元的第一和第二数量。 当第一数量的可用处理单元不为零时,将第一数量的可用处理单元数量或所请求的第一数量的处理单元分配给第一处理簇。 第一处理簇中的第一处理单元被指定为主节点。 当第二数量的可用处理单元是非零时,将第二数量的可用数量的处理单元或第二数量的处理单元分配给第二处理簇。 第二处理簇中的第一处理单元被指定为从节点。 第一和第二作业分别分配给第一和第二处理簇。
    • 53. 发明申请
    • Consecutive measurement of structures formed on a semiconductor wafer using a polarized reflectometer
    • 使用偏振反射计连续测量在半导体晶片上形成的结构
    • US20080106728A1
    • 2008-05-08
    • US11594497
    • 2006-11-07
    • Vi VuongJunwei BaoManuel Madriaga
    • Vi VuongJunwei BaoManuel Madriaga
    • G01N21/00
    • G01N21/4788G01N21/95607G01N2021/8416G01N2021/95615
    • Structures formed on a semiconductor wafer are consecutively measured by obtaining first and second measured diffraction signals of a first structure and a second structure formed abutting the first structure. The first and second measured diffraction signals were consecutively measured using a polarized reflectometer. The first measured diffraction signal is compared to a first simulated diffraction signal generated using a profile model of the first structure. The profile model has profile parameters that characterize geometries of the first structure. One or more features of the first structure are determined based on the comparison. The second measured diffraction signal is converted to a converted diffraction signal. The converted diffraction signal is compared to the first simulated diffraction signal or a second simulated diffraction signal generated using the same profile model as the first simulated diffraction signal. One or more features of the second structure are determined based on the comparison.
    • 通过获得与第一结构邻接形成的第一结构和第二结构的第一和第二测量的衍射信号,连续测量形成在半导体晶片上的结构。 使用偏振反射计连续测量第一和第二测量的衍射信号。 将第一测量的衍射信号与使用第一结构的轮廓模型产生的第一模拟衍射信号进行比较。 轮廓模型具有表征第一结构的几何形状的轮廓参数。 基于比较确定第一结构的一个或多个特征。 第二测量的衍射信号被转换成转换的衍射信号。 将转换的衍射信号与第一模拟衍射信号或使用与第一模拟衍射信号相同的轮廓模型产生的第二模拟衍射信号进行比较。 基于比较来确定第二结构的一个或多个特征。
    • 56. 发明授权
    • Matching optical metrology tools using spectra enhancement
    • 使用光谱增强匹配光学测量工具
    • US07505148B2
    • 2009-03-17
    • US11601351
    • 2006-11-16
    • Vi VuongYan ChenHolger Tuitje
    • Vi VuongYan ChenHolger Tuitje
    • G01N21/00
    • G01N21/956G01N21/274G01N21/4788G01N21/93
    • Optical metrology tools are matched by obtaining a first set of measured diffraction signals, which was measured using a first optical metrology tool, and a second set of measured diffraction signals, which was measured using a second optical metrology tool. A first spectra-shift offset is generated based on the difference between the first set of measured diffraction signals and the second set of measured diffraction signals. A first noise weighting function for the first optical metrology tool is generated based on measured diffraction signals measured using the first optical metrology tool. A first measured diffraction signal measured using the first optical metrology tool is obtained. A first adjusted diffraction signal is generated by adjusting the first measured diffraction signal using the first spectra-shift offset and the first noise weighting function.
    • 通过获得使用第一光学测量工具测量的第一组测量的衍射信号和使用第二光学测量工具测量的第二组测量的衍射信号来匹配光学测量工具。 基于第一组测量的衍射信号和第二组测量的衍射信号之间的差产生第一光谱偏移偏移。 基于使用第一光学测量工具测量的测量的衍射信号,产生用于第一光学测量工具的第一噪声加权函数。 获得使用第一光学测量工具测量的第一测量衍射信号。 通过使用第一光谱移位偏移和第一噪声加权函数调整第一测量的衍射信号来产生第一调节的衍射信号。
    • 57. 发明授权
    • Measuring a process parameter of a semiconductor fabrication process using optical metrology
    • 使用光学测量法测量半导体制造工艺的工艺参数
    • US07522294B2
    • 2009-04-21
    • US12026485
    • 2008-02-05
    • Hanyou ChuVi VuongYan Chen
    • Hanyou ChuVi VuongYan Chen
    • G06F19/00H01L21/66
    • H01L22/20
    • To measure a process parameter of a semiconductor fabrication process, the fabrication process is performed on a first area using a first value of the process parameter. The fabrication process is performed on a second area using a second value of the process parameter. A first measurement of the first area is obtained using an optical metrology tool. A second measurement of the second area is obtained using the optical metrology tool. One or more optical properties of the first area are determined based on the first measurement. One or more optical properties of the second area are determined based on the second measurement. The fabrication process is performed on a third area. A third measurement of the third area is obtained using the optical metrology tool. A third value of the process parameter is determined based on the third measurement and a relationship between the determined optical properties of the first and second areas.
    • 为了测量半导体制造工艺的工艺参数,使用工艺参数的第一值在第一区域上执行制造工艺。 使用过程参数的第二值在第二区域上执行制造过程。 使用光学测量工具获得第一区域的第一测量。 使用光学测量工具获得第二区域的第二测量。 基于第一测量确定第一区域的一个或多个光学性质。 基于第二测量来确定第二区域的一个或多个光学特性。 制造工艺在第三区域进行。 使用光学测量工具获得第三个区域的第三个测量值。 基于第三测量和所确定的第一和第二区域的光学特性之间的关系确定过程参数的第三值。
    • 58. 发明申请
    • DETERMINATION OF TRAINING SET SIZE FOR A MACHINE LEARNING SYSTEM
    • 确定机器学习系统的训练尺寸
    • US20110307424A1
    • 2011-12-15
    • US12813431
    • 2010-06-10
    • Wen JinVi VuongWalter Dean Mieher
    • Wen JinVi VuongWalter Dean Mieher
    • G06F15/18
    • G06N99/005
    • Automated determination of a number of profiles for a training data set to be used in training a machine learning system for generating target function information from modeled profile parameters. In one embodiment, a first principal component analysis (PCA) is performed on a training data set, and a second PCA is performed on a combined data set which includes the training data set and a test data set. A test data set estimate is generated based on the first PCA transform and the second PCA matrix. The size of error between the test data set and the test data set estimate is used to determine whether a number of profiles associated with the training data set is sufficiently large for training a machine learning system to generate a library of spectral information.
    • 自动确定用于培训机器学习系统用于从建模的轮廓参数生成目标函数信息的训练数据集的轮廓数。 在一个实施例中,对训练数据集执行第一主成分分析(PCA),并且对包括训练数据集和测试数据集的组合数据集执行第二PCA。 基于第一PCA变换和第二PCA矩阵生成测试数据集估计。 测试数据集和测试数据集估计之间的误差大小用于确定与训练数据集相关联的多个简档是否足够大,用于训练机器学习系统以生成光谱信息库。
    • 60. 发明申请
    • Matching optical metrology tools using spectra enhancement
    • 使用光谱增强匹配光学测量工具
    • US20080117411A1
    • 2008-05-22
    • US11601351
    • 2006-11-16
    • Vi VuongYan ChenHolger Tuitje
    • Vi VuongYan ChenHolger Tuitje
    • G01N21/00
    • G01N21/956G01N21/274G01N21/4788G01N21/93
    • Optical metrology tools are matched by obtaining a first set of measured diffraction signals, which was measured using a first optical metrology tool, and a second set of measured diffraction signals, which was measured using a second optical metrology tool. A first spectra-shift offset is generated based on the difference between the first set of measured diffraction signals and the second set of measured diffraction signals. A first noise weighting function for the first optical metrology tool is generated based on measured diffraction signals measured using the first optical metrology tool. A first measured diffraction signal measured using the first optical metrology tool is obtained. A first adjusted diffraction signal is generated by adjusting the first measured diffraction signal using the first spectra-shift offset and the first noise weighting function.
    • 通过获得使用第一光学测量工具测量的第一组测量的衍射信号和使用第二光学测量工具测量的第二组测量的衍射信号来匹配光学测量工具。 基于第一组测量的衍射信号和第二组测量的衍射信号之间的差产生第一光谱偏移偏移。 基于使用第一光学测量工具测量的测量的衍射信号,产生用于第一光学测量工具的第一噪声加权函数。 获得使用第一光学测量工具测量的第一测量衍射信号。 通过使用第一光谱移位偏移和第一噪声加权函数调整第一测量的衍射信号来产生第一调节的衍射信号。