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    • 60. 发明授权
    • Method for evaluating photo mask and method for manufacturing semiconductor device
    • 评估光掩膜的方法和制造半导体器件的方法
    • US07229721B2
    • 2007-06-12
    • US10705954
    • 2003-11-13
    • Shoji MimotogiShigeki NojimaOsamu Ikenaga
    • Shoji MimotogiShigeki NojimaOsamu Ikenaga
    • G03F1/00
    • G03F7/70625G03F1/44G03F1/68G03F1/78G03F7/705
    • A method for evaluating a photo mask comprises preparing a photo mask including a unit drawing pattern, finding a dimensional variation relating to the photo mask, the dimensional variation including first and second dimensional variations, the first dimensional variation occurring due to a positional displacement and size mismatch of the unit drawing pattern in the photo mask and the second dimensional variation occurring due to etching and development relating to a manufacturing of the photo mask, estimating a deteriorated amount of an exposure latitude occurring due to the dimensional variation of the photo mask using the dimensional variation and a degree of influence of the dimensional variation for the exposure latitude, and judging quality of the photo mask by comparing the deteriorated amount of the exposure latitude and an allowable deteriorated amount of the exposure latitude.
    • 一种用于评估光掩模的方法包括制备包括单元绘图图案的光掩模,找到与光掩模相关的尺寸变化,包括第一和第二尺寸变化的尺寸变化,由于位置偏移和尺寸而发生的第一尺寸变化 光掩模中的单位绘图图案的不匹配以及由于与光掩模的制造相关的蚀刻和显影而发生的第二尺寸变化,估计由于光掩膜的尺寸变化而产生的曝光宽容度的恶化量, 通过比较曝光宽容度的劣化量和曝光宽容度的允许恶化量来判断曝光宽容度的尺寸变化和影响程度,以及判断光掩模的质量。