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51. 发明授权

US07357699B2 Substrate holding apparatus and polishing apparatus 有权
公开(公告)号：US07357699B2
公开(公告)日：2008-04-15
申请号：US10543546
申请日：2004-02-04
申请人： Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima , Koichi Fukaya
发明人： Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima , Koichi Fukaya
IPC分类号： B24B7/22
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.

52. 发明授权

US07354671B2 Fuel cell system having secondary cell 有权
标题翻译：具有二次电池的燃料电池系统
公开(公告)号：US07354671B2
公开(公告)日：2008-04-08
申请号：US11151540
申请日：2005-06-14
申请人： Tetsuhiro Ishikawa , Tsuyoshi Yano , Tadaichi Matsumoto , Katsuhiko Nishiyama , Hiroshi Yoshida
发明人： Tetsuhiro Ishikawa , Tsuyoshi Yano , Tadaichi Matsumoto , Katsuhiko Nishiyama , Hiroshi Yoshida
IPC分类号： H01M8/04 , H01M8/00 , H01M12/00
CPC分类号： H01M8/04559 , H01M8/04223 , H01M8/04228 , H01M8/04303 , H01M8/04567 , H01M8/04664 , H01M8/04865 , H01M8/04917 , H01M8/04947 , H01M8/04955 , H01M16/006 , H02J7/34
摘要： This invention provides a power supply system for supplying electrical power to a load. The system includes: a first and a second power supply wirings for a connection to the load; a fuel cell system having a fuel cell connected between the first and second power supply wiring; a secondary power supply system connected in parallel to the fuel cell between the first power supply wiring and the second power supply wiring; a switch for opening and closing the connection between the fuel cell and the first power supply wiring; a countercurrent prevention device connected between the fuel cell and the first power supply wiring; and a controller for controlling the secondary power supply system and the switch. The controller controls the secondary power supply system to boost a terminal voltage of the secondary power supply system to a first voltage, when connecting the fuel cell to the first power supply wiring. The first voltage is equal or higher than an electrical potential difference of the open terminals of the fuel cell.
摘要翻译：本发明提供一种用于向负载供电的电源系统。该系统包括：用于连接到负载的第一和第二电源配线; 具有连接在所述第一和第二电源配线之间的燃料电池的燃料电池系统; 与第一电源配线和第二电源配线之间的燃料电池并联连接的二次电源系统; 用于打开和关闭燃料电池和第一电源配线之间的连接的开关; 连接在燃料电池和第一电源配线之间的逆流防止装置; 以及用于控制二次电源系统和开关的控制器。当将燃料电池连接到第一电源配线时，控制器控制次级电源系统以将次级电源系统的端子电压升高到第一电压。第一电压等于或高于燃料电池的开路端子的电位差。

53. 发明授权

US07344976B2 Method for fabricating nonvolatile semiconductor memory device 有权
标题翻译：制造非易失性半导体存储器件的方法
公开(公告)号：US07344976B2
公开(公告)日：2008-03-18
申请号：US11377452
申请日：2006-03-17
申请人： Hiroshi Yoshida , Takumi Mikawa
发明人： Hiroshi Yoshida , Takumi Mikawa
IPC分类号： H01L21/4763
CPC分类号： H01L27/11507 , H01L27/11502 , H01L28/57
摘要： An adhesion layer composed of a titanium film and a titanium nitride film is formed by CVD on the inner wall of a contact hole formed in a multilayer film composed of an interlayer insulating film, a silicon nitride film, and a silicon dioxide film. Then, a conductive film made of tungsten or polysilicon is filled by CVD in the contact hole and the respective portions of the conductive film and the adhesion layer which are located over the silicon dioxide film are removed by CMP. Subsequently, the silicon dioxide film is removed by an etch-back method or a CMP method so that the silicon nitride film is exposed. This can prevent the delamination of the adhesion layer from the silicon nitride film as a hydrogen barrier film and also prevent the formation of a scratch in the silicon nitride film.
摘要翻译：在由层间绝缘膜，氮化硅膜和二氧化硅膜构成的多层膜中形成的接触孔的内壁上通过CVD形成由钛膜和氮化钛膜构成的粘合层。然后，通过CVD在接触孔中填充由钨或多晶硅制成的导电膜，并且通过CMP去除位于二氧化硅膜上方的导电膜和粘附层的各个部分。随后，通过蚀刻方法或CMP方法去除二氧化硅膜，以使氮化硅膜露出。这可以防止作为氢阻挡膜的粘合层从氮化硅膜分层，并且还防止在氮化硅膜中形成划痕。

54. 发明申请

US20080047667A1 Substrate holding apparatus and substrate polishing apparatus 审中-公开
公开(公告)号：US20080047667A1
公开(公告)日：2008-02-28
申请号：US11907590
申请日：2007-10-15
申请人： Yoshihiro Gunji , Hozumi Yasuda , Keisuke Namiki , Hiroshi Yoshida
发明人： Yoshihiro Gunji , Hozumi Yasuda , Keisuke Namiki , Hiroshi Yoshida
IPC分类号： B24B57/00
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.

55. 发明申请

US20080041248A1 IMPRINT APPARATUS AND IMPRINT METHOD 失效
标题翻译： IMPRINT设备和印刷方法
公开(公告)号：US20080041248A1
公开(公告)日：2008-02-21
申请号：US11774216
申请日：2007-07-06
申请人： KOSUKE KUWABARA , Takashi Ando , Masahiko Ogino , Hiroshi Yoshida , Yasuhiko Tada
发明人： KOSUKE KUWABARA , Takashi Ando , Masahiko Ogino , Hiroshi Yoshida , Yasuhiko Tada
IPC分类号： B41J9/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G11B5/855 , H01L21/76817
摘要： The present invention provides an imprint apparatus transferring a surface structure of a stamper to material to be patterned by allowing the stamper come in contact with the material to be patterned. The imprint apparatus includes a holding means that holds the material to be patterned and the stamper with a distance therebetween, a pressure reduction means that reduces pressure of a chamber in which the material to be patterned and the stamper are placed, and an alignment means that aligns the stamper with the material to be patterned.
摘要翻译：本发明提供一种压印装置，通过允许压模与待图案化的材料接触，将压模的表面结构转移到待图案化的材料。压印装置包括保持装置，其保持要被图案化的材料和压模之间的距离;减压装置，其减小其中待图案化材料和压模放置的室的压力;以及对准装置，将压模与待图案化的材料对准。

56. 发明申请

US20080025431A1 TRANSMITTING APPARATUS AND METHOD, RECEIVING APPARATUS AND METHOD 审中-公开
标题翻译：发送装置和方法，接收装置和方法
公开(公告)号：US20080025431A1
公开(公告)日：2008-01-31
申请号：US11689092
申请日：2007-03-21
申请人： Seiichiro Horikawa , Hideo Kasami , Hiroshi Yoshida
发明人： Seiichiro Horikawa , Hideo Kasami , Hiroshi Yoshida
IPC分类号： H04L27/00
CPC分类号： H04L27/2071 , H04L27/00 , H04L27/2075 , H04L27/2278 , H04L27/2331
摘要： A transmitting apparatus converts a unit data item of the unit data items having a predetermined bit length into a time shift amount, stores, in a memory, a first symbol including a plurality of samples, generates a second symbol corresponding to the unit data item by cyclically shifting the samples in the first symbol by the time shift amount, and transmits the second symbol. A receiving apparatus receives two consecutive symbols each including a plurality of samples, detects sample values of the samples in each of the symbols, detects a time shift amount between the symbols based on the sample values of the samples in each of the symbols, and converts the time shift amount into a data item having the bit length.
摘要翻译：发送装置将具有预定比特长度的单位数据项的单位数据项转换为时移量，在存储器中存储包含多个样本的第一符号，生成与单位数据项对应的第二符号，将第一符号中的样本循环移位时移量，并发送第二符号。接收装置接收两个包括多个样本的连续符号，检测每个符号中的采样的采样值，根据每个符号中的样本的采样值，检测符号之间的时移量，并将其转换将时间量转换成具有位长度的数据项。

57. 外观设计

USD559152S1 Automobile 有权
公开(公告)号：USD559152S1
公开(公告)日：2008-01-08
申请号：US29263980
申请日：2006-08-02
申请人： Toshiyuki Okumoto , Hiroshi Yoshida
设计人： Toshiyuki Okumoto , Hiroshi Yoshida

58. 发明申请

US20070281646A1 VARIABLE CAPACITANCE DEVICE AND PORTABLE PHONE 失效
标题翻译：可变电容器和便携式电话
公开(公告)号：US20070281646A1
公开(公告)日：2007-12-06
申请号：US11755107
申请日：2007-05-30
申请人： Kazuhiko Itaya , Hiroshi Yoshida , Takashi Kawakubo
发明人： Kazuhiko Itaya , Hiroshi Yoshida , Takashi Kawakubo
IPC分类号： H04B1/26
CPC分类号： H01G5/18
摘要： A variable capacitance device has a piezoelectric driving part, a movable electrode, a fixed electrode, a dielectric film and a driving control unit. The piezoelectric driving part has a piezoelectric film, an upper electrode disposed on a top surface of the piezoelectric film, a lower electrode disposed on an undersurface of the piezoelectric film and electrode slits which separate the upper electrode and the lower electrode into two, respectively. The movable electrode is provided via the electrode slits at one end of the piezoelectric driving part. The fixed electrode is disposed opposite to the movable electrode via a gap. The dielectric film is disposed opposite to the movable electrode via the gap and provided on the fixed electrode. The driving control unit adjusts a distance between the movable electrode and the fixed electrode to reduce a fluctuation of a predetermined capacitance of a variable capacitor formed between the variable electrode and the fixed electrode.
摘要翻译：可变电容器件具有压电驱动部，可动电极，固定电极，电介质膜和驱动控制部。压电驱动部分具有压电膜，设置在压电膜的顶表面上的上电极，设置在压电膜的下表面上的下电极以及分别将上电极和下电极分成两部分的电极狭缝。可动电极通过电极狭缝设置在压电驱动部分的一端。固定电极通过间隙与可动电极相对设置。电介质膜经由间隙与可动电极相对设置，设置在固定电极上。驱动控制单元调整可动电极和固定电极之间的距离，以减小形成在可变电极和固定电极之间的可变电容器的预定电容的波动。

59. 发明授权

US07264980B2 Method of mounting light emitting element 有权
标题翻译：发光元件的安装方法
公开(公告)号：US07264980B2
公开(公告)日：2007-09-04
申请号：US11348210
申请日：2006-02-06
申请人： Masafumi Ozawa , Hiroshi Yoshida , Takashi Kobayashi
发明人： Masafumi Ozawa , Hiroshi Yoshida , Takashi Kobayashi
IPC分类号： H01L21/00 , H01L29/26
CPC分类号： H01L21/681 , G02B6/4221 , H01S5/02252
摘要： The present invention provides a method of mounting a light emitting element, in which a light emission point can be positioned at high accuracy with respect to the mounting member. A semiconductor laser element is placed on a matching stage. Next, a position and an azimuth of a laser stripe of the semiconductor laser element is observed, and linear displacement in X and Y directions of the semiconductor laser element from a reference line and a reference point on the matching stage, and angular displacement in an azimuth (θ) within an X-Y plane are measured. In accordance with a measured result, a control signal is sent to a driving mechanism of the feeding collet to drive the feeding collet, and the position of the semiconductor laser element is adjusted on the matching stage. After the adjustment, the semiconductor laser element is fed to and placed on a mounting surface of a heat sink H.
摘要翻译：本发明提供了一种安装发光元件的方法，其中发光点可以相对于安装构件以高精度定位。将半导体激光元件放置在匹配台上。接下来，观察半导体激光元件的激光条的位置和方位角，并且从参考线和匹配台上的参考点在半导体激光元件的X和Y方向上的线性位移以及匹配台中的角位移测量XY平面内的方位角（θ）。根据测量结果，将控制信号发送到馈送夹头的驱动机构以驱动馈送夹头，并且在匹配台上调整半导体激光元件的位置。在调整之后，半导体激光元件被馈送到放置在散热器H的安装表面上并被放置在散热器H的安装表面上。

60. 发明申请

US20070199924A1 Fracture Prediction Device For Spot Welded Portion, Method Of The Same, Computer Program, And Computer Readable Recording Medium 有权
标题翻译：点焊部分断裂预测装置，方法，计算机程序和计算机可读记录介质
公开(公告)号：US20070199924A1
公开(公告)日：2007-08-30
申请号：US10599921
申请日：2005-04-12
申请人： Hiroshi Yoshida , Naruhiko Nomura , Akihiro Uenishi
发明人： Hiroshi Yoshida , Naruhiko Nomura , Akihiro Uenishi
IPC分类号： B23K11/25
CPC分类号： G01N3/24 , B23K11/11 , G01N3/08 , G01N2203/0067 , G01N2203/0214 , G01N2203/0216 , G01N2203/0218 , G01N2203/0296 , G06F17/5018
摘要： According to exemplary embodiments of the present invention, a fracture prediction device for a spot welded portion can be provided. For example, the device may include an input arrangement configured to input all or some of a material strength, a plate thickness, a nugget diameter of a spot welding, a plate width of a joint, and a rotation angle of the joint in a tension test, based on a cross tension test and/or a shear tension test at a spot welded joint. The device can also include a first calculation arrangement configured to calculate a fracture strength parameter of the spot welded portion from all or any of the material strength, the plate thickness, the nugget diameter of the spot welding, the plate width of the joint, and the rotation angle of the joint in the tension test. A parameter storage arrangement may also be provided which can be configured to store the fracture strength parameter by each steel type. Further, the device may further have a second calculation arrangement configured to determine a fracture of the spot welded portion by installing the fracture strength parameter stored in the parameter storage arrangement into a fracture prediction formula in which a deformation at a periphery of the spot welding is modeled by a finite element procedure. Exemplary embodiments of the method software arrangement and computer accessible medium performing similar procedures can also be provided.
摘要翻译：根据本发明的示例性实施例，可以提供一种用于点焊部分的断裂预测装置。例如，设备可以包括输入装置，其被配置为输入材料强度，板厚度，点焊的熔核直径，接头的板宽度和接头处于张力的旋转角度的全部或一些基于交叉拉伸试验和/或点焊接头处的剪切张力试验进行试验。该装置还可以包括第一计算装置，其被配置为根据材料强度，板厚度，点焊的熔核直径，接头的板宽度以及所述点焊的直径来计算点焊部的断裂强度参数接头在张力试验中的旋转角度。还可以提供参数存储装置，其可被配置为通过每种钢种来存储断裂强度参数。此外，该装置还可以具有第二计算装置，其被配置为通过将存储在参数存储装置中的断裂强度参数设置为断点预测公式来确定点焊部分的断裂，其中点焊周边的变形为由有限元程序建模。还可以提供方法软件配置和执行类似过程的计算机可访问介质的示例性实施例。

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