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51. 发明授权

US07835266B2 Node apparatus and maintenance and operation supporting device 有权
标题翻译：节点设备及维护和运行支持设备
公开(公告)号：US07835266B2
公开(公告)日：2010-11-16
申请号：US11066568
申请日：2005-02-28
申请人： Satoshi Kumano , Yoshiyasu Sutou , Toshiyuki Yada , Kiyofumi Hara , Tomoyuki Abe , Michiko Suzuki , Kenichiro Ogi
发明人： Satoshi Kumano , Yoshiyasu Sutou , Toshiyuki Yada , Kiyofumi Hara , Tomoyuki Abe , Michiko Suzuki , Kenichiro Ogi
IPC分类号： G01R31/08
CPC分类号： H04L1/22 , H04J3/1611 , H04J2203/0023 , H04J2203/0057 , H04L12/42
摘要： The present invention relates a node device cross-connected to a STM transmission system and a maintenance and operation support device connected to the node device. The object of the present invention is to releasing a desired transmission section or link efficiently. Therefore, the node device according to the preset invention includes control section individually selecting a link provided to for a path in the communication devices accommodated into the local and remote stations; and cross-connection section providing a path through the selected link, wherein the control section selects an auxiliary link based on a system configuration when identifiers of all paths to be replaced by the substitute path are given.
摘要翻译：本发明涉及交叉连接到STM传输系统的节点设备和连接到节点设备的维护和操作支持设备。本发明的目的是有效地释放期望的传输部分或链接。因此，根据本发明的节点装置包括控制部分，单独选择为容纳在本地和远程站中的通信设备中的路径提供的链路; 以及提供通过所选择的链路的路径的交叉连接部分，其中当给出要由所述替代路径替换的所有路径的标识符时，所述控制部分基于系统配置来选择辅助链路。

52. 发明授权

US07773035B2 Microstrip antenna and high frequency sensor using microstrip antenna 失效
标题翻译：微带天线和使用微带天线的高频传感器
公开(公告)号：US07773035B2
公开(公告)日：2010-08-10
申请号：US11664292
申请日：2005-09-29
申请人： Kensuke Murata , Hiroshi Tsuboi , Kengo Iwata , Tomoyuki Abe
发明人： Kensuke Murata , Hiroshi Tsuboi , Kengo Iwata , Tomoyuki Abe
IPC分类号： H01Q1/38
CPC分类号： H01Q3/24 , H01Q9/0407 , H01Q9/0442 , H01Q19/005 , H01Q19/28
摘要： A microstrip antenna has feed element 102 and parasitic elements 104, 106 on the front surface of substrate 1. Microwave electrical power is applied to feed element 102. Parasitic elements 104, 106 are connected via through hole type leads passing through substrate 1, to switches upon the rear surface of substrate 1, respectively. By actuating the switches individually, parasitic elements 104, 106 are individually switched between a grounded state and a float state. The direction of the radio beam emitted from the microstrip antenna is varied by selecting which of parasitic elements 104, 106 is grounded and floated. A microwave signal source connects to feed element 102 via an feed line 108 very much shorter than the wavelength, accordingly the transmission losses being low and the efficiency being excellent.
摘要翻译：微带天线在基板1的前表面上具有馈电元件102和寄生元件104,106。微波电力被施加到馈电元件102.寄生元件104,106通过穿过衬底1的通孔型引线连接到开关分别在基板1的后表面上。通过单独地驱动开关，寄生元件104,106在接地状态和浮置状态之间单独切换。通过选择寄生元件104,106中的哪一个接地并漂浮来改变从微带天线发射的无线电波束的方向。微波信号源通过比波长短得多的馈线108连接到馈电元件102，因此传输损耗低，效率优异。

53. 发明申请

US20100012362A1 RESIN COMPOSITION, RESIN FILM, COVER LAY FILM, INTERLAYER ADHESIVE, METAL-CLAD LAMINATE AND MULTILAYER PRINTED CIRCUIT BOARD 审中-公开
标题翻译：树脂组合物，树脂膜，覆盖膜，层间粘合剂，金属层压板和多层印刷电路板
公开(公告)号：US20100012362A1
公开(公告)日：2010-01-21
申请号：US12090628
申请日：2006-10-18
申请人： Tomoyuki Abe , Toshio Komiyatani
发明人： Tomoyuki Abe , Toshio Komiyatani
IPC分类号： H05K1/02 , B32B27/04 , B32B7/06 , B32B7/12 , H05K1/03 , C08G77/04 , C08L79/08 , C08L83/04 , C08K3/22
CPC分类号： C09J179/08 , C08G59/4042 , C08L63/00 , H05K1/0346 , H05K3/281 , H05K3/4614 , H05K3/4626 , H05K3/4691 , H05K2201/0154 , H05K2201/0162 , H05K2201/0209 , Y10T428/1476 , Y10T428/2852 , Y10T428/31663
摘要： The present invention provides a resin composition for use as an adhesive material of a printed circuit board, comprising a polyimide siloxane resin. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, in which flowing out during heating/pressing is prevented and which provide excellent adhesion strength. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, which exhibit excellent heat resistance.
摘要翻译：本发明提供一种用作印刷电路板的粘合剂材料的树脂组合物，其包含聚酰亚胺硅氧烷树脂。本发明还提供了防止加热/加压期间流出的树脂组合物，树脂膜，覆盖膜，层间粘合剂，覆金属层压板和多层印刷电路板，并且提供优异的粘合强度。本发明还提供耐热性优异的树脂组合物，树脂膜，覆盖膜，层间粘合剂，覆金属层压板和多层印刷电路板。

54. 发明授权

US07595228B2 Method for manufacturing electronic component-mounted board 有权
标题翻译：电子元件安装板的制造方法
公开(公告)号：US07595228B2
公开(公告)日：2009-09-29
申请号：US11233177
申请日：2005-09-23
申请人： Tomoyuki Abe , Yasuo Yamagishi
发明人： Tomoyuki Abe , Yasuo Yamagishi
IPC分类号： H01L21/70 , H01L21/98
CPC分类号： H01L24/81 , H01L21/563 , H01L21/6835 , H01L23/13 , H01L23/3121 , H01L23/49822 , H01L23/5385 , H01L23/5389 , H01L23/642 , H01L24/13 , H01L24/16 , H01L25/50 , H01L2221/68345 , H01L2224/10165 , H01L2224/1182 , H01L2224/16 , H01L2224/16235 , H01L2224/73203 , H01L2224/81007 , H01L2224/81136 , H01L2224/8114 , H01L2224/81201 , H01L2224/81203 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K3/3436 , H05K3/3489 , H05K3/3494 , H05K3/4682 , H05K2203/0475 , H05K2203/111 , Y02P70/613 , H01L2224/0401
摘要： A method for manufacturing an electronic component-mounted board (X) includes a temperature raising step for heating an electronic component (30A), with a solder bump electrode (31) containing a solder material, to a first temperature higher than the melting point of the solder material, while also heating a wiring board (X′), with an electrode section (21) corresponding to the solder bump electrode (31), to a second temperature lower than the first temperature. The method further includes a joining step for joining the solder bump electrode (31) and the electrode section (21) by pressing the electronic component (30A) against the wiring board (X′), with the solder bump electrodes (31) and the electrode sections (21) abutting against each other.
摘要翻译：一种电子部件安装板（X）的制造方法，包括：将包含焊料材料的焊料凸块电极（31）加热到高于熔点的第一温度的电子部件（30A）的升温工序，焊料材料，同时将与焊料凸块电极（31）相对应的电极部分（21）加热到低于第一温度的第二温度的布线板（X'）。该方法还包括通过用焊料凸块电极（31）和焊料凸块电极（31）将电子部件（30A）压靠在布线板（X'）上而将焊料凸块电极（31）和电极部分（21）电极部分（21）彼此抵靠。

55. 发明授权

US07550366B2 Method for bonding substrates and device for bonding substrates 有权
标题翻译：接合基板的方法和用于接合基板的装置
公开(公告)号：US07550366B2
公开(公告)日：2009-06-23
申请号：US11293663
申请日：2005-12-02
申请人： Tadatomo Suga , Mohammad Matiar Rahman Howlader , Tomoyuki Abe
发明人： Tadatomo Suga , Mohammad Matiar Rahman Howlader , Tomoyuki Abe
IPC分类号： H01L21/30
CPC分类号： H01L21/187 , H01L24/27 , H01L24/30 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01079 , H01L2924/09701
摘要： A method for bonding of substrates has a steps of irradiating surfaces of the substrates respectively in a vacuum with both an inert gas beam and a metal beam thereby forming island shaped thin metal films on the surfaces of the substrates, and surface-activated bonding of the substrates through the island shaped thin metal films by contacting the surfaces of the substrates each other.
摘要翻译：基板的接合方法具有分别在惰性气体束和金属梁两者的真空中照射基板的表面的步骤，从而在基板的表面上形成岛状薄金属膜，并且将表面激活的通过使基板的表面彼此接触而穿过岛状薄金属膜的基板。

56. 发明申请

US20080192453A1 MULTILAYER INTERCONNECTION SUBSTRATE AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：多层互连基板及其制造方法
公开(公告)号：US20080192453A1
公开(公告)日：2008-08-14
申请号：US12099450
申请日：2008-04-08
申请人： Masateru Koide , Tomoyuki Abe
发明人： Masateru Koide , Tomoyuki Abe
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H05K3/4688 , H05K1/0306 , H05K1/0313 , H05K3/462 , H05K3/4641 , H05K2203/1189 , Y10T29/49126
摘要： According to an aspect of an embodiment, a multilayer interconnection substrate comprises a resin substrate layer comprising a first insulating layer made of a resin, and a first interconnection layer made of a conductive material, a ceramic substrate layer comprising a second insulating layer made of a ceramic, and a second interconnection layer made of a conductive material, a mechanically bonding layer mechanically bonding the resin substrate layer and the ceramic substrate layer which are laminated, and an electrically bonding member penetrating the mechanically bonding layer and electrically bonding the resin substrate layer and the ceramic substrate layer.
摘要翻译：根据实施例的一个方面，多层互连基板包括树脂基板层，该树脂基板层包括由树脂制成的第一绝缘层和由导电材料制成的第一互连层，陶瓷基板层包括由陶瓷和由导电材料制成的第二互连层，机械粘合层机械粘合树脂基板层和陶瓷基板层;以及电接合构件，其穿透机械接合层并电连接树脂基板层和陶瓷基板层。

57. 发明授权

US07388157B2 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US07388157B2
公开(公告)日：2008-06-17
申请号：US11320965
申请日：2005-12-30
申请人： Tomoyuki Abe , Nobuyuki Hayashi , Motoaki Tani , Kenichiro Abe , Kenji Iida
发明人： Tomoyuki Abe , Nobuyuki Hayashi , Motoaki Tani , Kenichiro Abe , Kenji Iida
IPC分类号： H05K1/03
CPC分类号： G01R1/07314 , G01R1/44 , H05K1/0366 , H05K1/056 , H05K1/117 , H05K3/429 , H05K3/4608 , H05K3/4623 , H05K3/4641 , H05K3/4688 , H05K2201/0323 , H05K2201/0919 , H05K2201/09536 , H05K2201/09845 , H05K2203/061
摘要： A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers. The second substrate has the outline different from that of the first substrate. A stepped surface is defined on the front surface at least of the first substrate. Electrodes can be formed on the stepped surface as well as on the back surface of the first substrate and the front surface of the second substrate. This structure enables detection of an electric signal from the stepped surface. A further flexibility can thus be achieved in locating electrodes as compared with a conventional printed wiring board having uniform substrates simply superimposed on each other. This results in an expanded use or purpose for a printed wiring board.
摘要翻译：印刷电路板由彼此重叠的第一和第二基板制成。第一和第二基板分别包括由含有碳纤维的树脂制成的芯层。第二基板具有与第一基板的轮廓不同的轮廓。至少在第一基板的表面上限定有台阶面。电极可以形成在阶梯表面以及第一基板的背面和第二基板的前表面上。该结构能够检测来自台阶表面的电信号。因此与具有简单地叠加的均匀基板的传统印刷线路板相比，可以在定位电极方面实现更大的灵活性。这导致印刷电路板的使用或目的的扩大。

58. 发明申请

US20070232059A1 Multilayer interconnection substrate and method of manufacturing the same 有权
标题翻译：多层互连基板及其制造方法
公开(公告)号：US20070232059A1
公开(公告)日：2007-10-04
申请号：US11474453
申请日：2006-06-26
申请人： Tomoyuki Abe
发明人： Tomoyuki Abe
IPC分类号： H01L21/4763 , H01L23/48
CPC分类号： H05K3/4614 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K3/3473 , H05K3/4069 , H05K3/4617 , H05K3/462 , H05K2201/0215 , H05K2201/10378 , H01L2924/00
摘要： A multilayer interconnection substrate is disclosed that includes a multilayer interconnection layer having at least a first interconnection layer and a second interconnection layer stacked with an insulating layer provided therebetween, and a connection via configured to electrically connect the first interconnection layer and the second interconnection layer. The connection via includes an internal conductor and a metal film covering the internal conductor. The internal conductor is an aggregate of metal particles.
摘要翻译：公开了一种多层互连衬底，其包括具有至少第一互连层和层叠有设置在其间的绝缘层的第二互连层的多层互连层，以及经配置以电连接第一互连层和第二互连层的连接通孔。连接通孔包括内部导体和覆盖内部导体的金属膜。内部导体是金属颗粒的聚集体。

59. 发明申请

US20070222085A1 Semiconductor device and fabrication process thereof 有权
标题翻译：半导体器件及其制造工艺
公开(公告)号：US20070222085A1
公开(公告)日：2007-09-27
申请号：US11483527
申请日：2006-07-11
申请人： Tomoyuki Abe , Shinya Iijima
发明人： Tomoyuki Abe , Shinya Iijima
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05085 , H01L2224/05567 , H01L2224/1134 , H01L2224/13012 , H01L2224/13023 , H01L2224/13099 , H01L2224/13144 , H01L2224/73203 , H01L2224/81192 , H01L2224/81205 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： A semiconductor device includes a mount substrate and a semiconductor chip mounted upon the mount substrate via a metal bump, wherein metal bump includes an inner part joined to the semiconductor chip and an outer part covering the inner part, the outer part having an increased hardness as compared with the inner part.
摘要翻译：半导体器件包括安装基板和通过金属凸块安装在安装基板上的半导体芯片，其中金属凸块包括连接到半导体芯片的内部部分和覆盖内部部分的外部部分，外部部件具有增加的硬度与内部相比。

60. 发明授权

US07248222B2 High-frequency module 有权
标题翻译：高频模块
公开(公告)号：US07248222B2
公开(公告)日：2007-07-24
申请号：US11167568
申请日：2005-06-28
申请人： Shinya Iijima , Tomoyuki Abe , Nobuyuki Hayashi , Yoji Ohashi , Toshihiro Shimura
发明人： Shinya Iijima , Tomoyuki Abe , Nobuyuki Hayashi , Yoji Ohashi , Toshihiro Shimura
IPC分类号： H01Q1/38
CPC分类号： G01S7/032 , G01S13/931 , H01L23/552 , H01L23/66 , H01L25/16 , H01L2223/6627 , H01L2223/6677 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/1903 , H01L2924/19105 , H01L2924/3011
摘要： A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the resin base member, a second conductive pattern formed on the other surface of the resin base member for constituting a waveguide in combination with the first conductive pattern to pass a high-frequency signal through the resin base member and including a window for allowing the high-frequency signal to pass therethrough, a cap for covering a semiconductor element and for absorbing or reflecting the high-frequency signal, an adopter (a waveguide tube) fixed onto the second conductive pattern such that one open end thereof surrounds the window, and an antenna fixed to the other open end of the adaptor.
摘要翻译：高频模块包括加强件（支撑基板），一个表面固定在加强件上的树脂基底部件，形成在树脂基底部件的一个表面上的第一导电图案，形成在第二导电图案上的第二导电图案用于与第一导电图案组合的用于构成波导的树脂基底构件的另一表面，以使高频信号通过树脂基底，并且包括用于允许高频信号通过的窗口，用于覆盖半导体元件，用于吸收或反射高频信号，固定在第二导电图案上的采用者（波导管），使得其一个开口端围绕窗口，以及固定到适配器的另一开口端的天线。

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