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    • 51. 发明申请
    • Rack shaft support device
    • 机架轴支撑装置
    • US20100024583A1
    • 2010-02-04
    • US12461011
    • 2009-07-29
    • Akitake KawakuboYoshinori SuzukiHirofumi IshimiYoshio Kondo
    • Akitake KawakuboYoshinori SuzukiHirofumi IshimiYoshio Kondo
    • F16H55/28
    • F16H55/283B62D3/123Y10T74/19623Y10T74/1967
    • A rack shaft support device includes: a rack shaft support member that is accommodated inside a retention hole formed in a housing so as to slide in an axial direction of the retention hole, and slidably supports a rack shaft; a sealing member fixed to an inlet port of the retention hole; an intermediate member that is interposed between the rack shaft support member and the sealing member; a torsion spring that couples the sealing member and the intermediate member; a cam mechanism that converts a rotational force of the intermediate member induced by untwisting of the torsion spring to a force by which the intermediate member pushes the rack shaft support member; an opposing portion that opposes a rear surface of the rack shaft support member; and an annular elastic member that is interposed between the rear surface of the rack shaft support member and the opposing portion.
    • 齿条轴支撑装置包括:齿条轴支撑构件,容纳在形成在壳体中的保持孔内,以沿着保持孔的轴向方向滑动,并且可滑动地支撑齿条轴; 密封构件,其固定到所述保持孔的入口; 中间构件,其插入在所述齿条轴支撑构件和所述密封构件之间; 耦合所述密封构件和所述中间构件的扭转弹簧; 凸轮机构,其将由扭转弹簧解捻而引起的中间构件的旋转力转换成中间构件推动齿条轴支撑构件的力; 与齿条轴支撑构件的后表面相对的相对部分; 以及设置在齿条轴支撑构件的后表面和相对部分之间的环形弹性构件。
    • 60. 发明授权
    • Rotational speed adjustment for wafer polishing method
    • 晶圆抛光方法转速调整
    • US06257961B1
    • 2001-07-10
    • US09503914
    • 2000-02-15
    • Yoshinori SuzukiJames O. Bopp
    • Yoshinori SuzukiJames O. Bopp
    • B24B100
    • B24B37/005B24B37/042B24B49/006B24B49/03
    • A method of obtaining polished semiconductor wafers with a polishing device includes conducting polishing of a first batch of semiconductor wafers with the polishing device at a turntable rotational speed to obtain a first batch of polished semiconductor wafers, experiencing a downtime following completion of the polishing of the first batch of semiconductor wafers with the polishing device, adjusting the turntable rotational speed for polishing of a next consecutive batch of semiconductor wafers, the adjustment being based upon a length of the downtime between the completion of the polishing of the first batch of semiconductor wafers and a start of polishing of the next consecutive batch of semiconductor wafers, and conducting polishing of the next consecutive batch of semiconductor wafers with the polishing device at the adjusted turntable rotational speed to obtain a next consecutive batch of semiconductor wafers. The method insures that batches of wafers polished after a downtime of the polishing device have a necessary flatness.
    • 利用抛光装置获得抛光的半导体晶片的方法包括以抛光装置转动第一批半导体晶片的抛光,以获得第一批抛光的半导体晶片,在完成抛光的半导体晶片之后经历停机 第一批具有抛光装置的半导体晶片,调整用于抛光下一批连续批次的半导体晶片的转盘旋转速度,该调整基于第一批半导体晶片的抛光完成之间的停机时间长度以及 开始研磨下一批连续批次的半导体晶片,并且以调整的转台转速对研磨装置进行下一个连续批次的半导体晶片的抛光,以获得下一个连续批次的半导体晶片。 该方法确保在抛光装置的停机时间之后抛光的晶片批次具有必要的平坦度。