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51. 发明授权

US07591406B2 Soldering method, soldering device, bonding method, bonding device, and nozzle unit 失效
标题翻译：焊接方法，焊接装置，接合方法，接合装置和喷嘴单元
公开(公告)号：US07591406B2
公开(公告)日：2009-09-22
申请号：US11277867
申请日：2006-03-29
申请人： Tatsuya Wagoh , Toru Mizuno , Osamu Shindo
发明人： Tatsuya Wagoh , Toru Mizuno , Osamu Shindo
IPC分类号： B23K26/00
CPC分类号： H05K3/3478 , B23K1/0056 , B23K3/0623 , H01L2224/742 , H05K3/3442 , H05K3/3494 , H05K2201/10727 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/107
摘要： Provided is a nozzle unit for use in a bonding device in which bonding between a first member and a second member is effected by providing a bonding member that has been melted by heating at a bonding position where the first member and the second member are to be bonded to each other. The nozzle unit includes: a cylindrical nozzle assembly having an accommodating space accommodating the bonding member, and an opening which allows ejection of the bonding member accommodated in the accommodating space onto the bonding position, which has a diameter larger than the diameter of the bonding member, and which communicates with the accommodating space; and a holding/releasing member for releasably holding the bonding member within the accommodating space.
摘要翻译：提供一种用于接合装置的喷嘴单元，其中通过在第一构件和第二构件的接合位置处提供通过加热而熔化的接合构件来实现第一构件和第二构件之间的接合彼此粘合。喷嘴单元包括：圆柱形喷嘴组件，其具有容纳接合构件的容纳空间，以及允许将容纳在容纳空间中的接合构件弹出到接合位置的开口，该接合位置的直径大于接合构件的直径并且与容纳空间连通; 以及用于将接合构件可释放地保持在容纳空间内的保持/释放构件。

52. 发明申请

US20070075061A1 Method and apparatus for adjusting static attitude of magnetic head 审中-公开
标题翻译：用于调节磁头静态的方法和装置
公开(公告)号：US20070075061A1
公开(公告)日：2007-04-05
申请号：US11542377
申请日：2006-10-04
申请人： Osamu Shindo , Toru Mizuno , Hitoshi Nakayama , Shinji Atsuzawa
发明人： Osamu Shindo , Toru Mizuno , Hitoshi Nakayama , Shinji Atsuzawa
IPC分类号： B23K26/02 , B21J5/06
CPC分类号： G11B5/4826
摘要： Provided is a method for adjusting static attitude of a magnetic head attached to a flexure that is disposed near a free end of a head support. The free end is a distal end in a longitudinal direction of the head support. The method includes generating an adjustment condition by analyzing an image signal obtained from images of the magnetic head, the images being picked up with at least two image pickup units; bending the flexure for static attitude adjustment based on the adjustment condition; and irradiating a laser beam to a bent area of the flexure.
摘要翻译：本发明提供一种用于调节附着在靠近头部支撑件的自由端的挠曲件上的磁头的静态姿势的方法。自由端是头部支撑件的纵向方向上的远端。该方法包括通过分析从磁头的图像获得的图像信号来产生调整条件，所述图像由至少两个图像拾取单元拾取; 根据调整条件弯曲挠曲件进行静态姿态调整; 并将激光束照射到弯曲部的弯曲区域。

53. 发明申请

US20070064333A1 Method and apparatus for adjusting static attitude of thin film magnetic head 有权
标题翻译：调整薄膜磁头静态的方法和装置
公开(公告)号：US20070064333A1
公开(公告)日：2007-03-22
申请号：US11520685
申请日：2006-09-14
申请人： Osamu Shindo , Toru Mizuno , Takao Torii
发明人： Osamu Shindo , Toru Mizuno , Takao Torii
IPC分类号： G11B20/20 , G11B21/02
CPC分类号： G11B5/6005 , G11B5/4833 , Y10T29/49032 , Y10T29/49036 , Y10T29/5313 , Y10T29/53165
摘要： Provided is a method for adjusting static attitude of a thin film magnetic head attached to a flexure of a head arm assembly. The method includes: previously ranking and memorizing adjustment conditions corresponding to static attitude angles of the thin film magnetic head; measuring a static attitude angle of the thin film magnetic head; bending the flexure for static attitude adjustment based on a particular adjustment condition corresponding to a measured angle; and irradiating a laser beam to a bent area of the flexure.
摘要翻译：提供了一种用于调节附接到头臂组件的挠曲部的薄膜磁头的静态姿势的方法。该方法包括：先前对与薄膜磁头的静态姿势角对应的调整条件进行排序和记忆; 测量薄膜磁头的静态姿态角; 基于对应于测量角度的特定调整条件来弯曲挠曲件用于静态姿态调节; 并将激光束照射到弯曲部的弯曲区域。

54. 发明申请

US20060065641A1 Conductive ball bonding method and conductive ball bonding apparatus 有权
标题翻译：导电球接合法和导电球接合装置
公开(公告)号：US20060065641A1
公开(公告)日：2006-03-30
申请号：US11233090
申请日：2005-09-23
申请人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
IPC分类号： B23K26/20
CPC分类号： B23K3/0623 , B23K1/0056 , H01L2224/742 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/107
摘要： The present invention provides a solder ball bonding method and a solder ball bonding apparatus, which can enhance efficiency of bonding processing and in which plural electrodes formed on objects to be bonded are bonded to each other by melting a solder ball. In the present invention, the solder balls are picked up by a pick-up nozzle having a plurality of pick-up openings corresponding to electrode areas on the objects to be bonded and the solder balls are conveyed on the electrode areas. A laser radiating unit disposed independently above the pick-up nozzle is shifted along an arrangement direction of the pick-up openings and a laser beam from the laser radiating unit is irradiated onto the solder ball through a transparent member of the pick-up nozzle and through the pick-up opening of the pick-up nozzle, thereby melting the solder ball on the electrode area.
摘要翻译：本发明提供一种焊球接合方法和焊球接合装置，其可以提高接合处理的效率，并且通过熔化焊球将形成在待接合物体上的多个电极彼此接合。在本发明中，焊球由具有对应于待接合物体上的电极区域的多个拾取开口的拾取喷嘴拾取，并且焊球在电极区域上传送。独立于拾取喷嘴上方设置的激光辐射单元沿着拾取开口的排列方向移动，并且来自激光辐射单元的激光束通过拾取喷嘴的透明构件照射到焊球上，通过拾取喷嘴的拾取开口，从而熔化电极区域上的焊球。

55. 发明申请

US20050076498A1 Apparatus and method for mounting electronic part 失效
标题翻译：用于安装电子部件的装置和方法
公开(公告)号：US20050076498A1
公开(公告)日：2005-04-14
申请号：US10978365
申请日：2004-11-02
申请人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
发明人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
IPC分类号： B23P19/00 , H01L21/00 , H01L21/60 , H05K13/04
CPC分类号： H05K13/0812 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53061 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261
摘要： The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.
摘要翻译：本发明提供了能够应对高密度安装，窄间距安装，腔体安装等的安装方法。在该方法中，可以获得相对于基准姿态从由捡取喷嘴保持的拾取喷嘴从晶片上取出的芯片的位移量，并且当芯片被输送到用于将芯片实际安装到基板上的安装喷嘴，考虑到位移量来校正位移量，使得安装喷嘴始终将芯片保持在固定的姿态。

56. 发明申请

US20050076497A1 Apparatus and method for mounting electronic part 失效
标题翻译：用于安装电子部件的装置和方法
公开(公告)号：US20050076497A1
公开(公告)日：2005-04-14
申请号：US10682731
申请日：2003-10-10
申请人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
发明人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
IPC分类号： B23P19/00 , H01L21/00 , H01L21/60 , H05K13/04
CPC分类号： H05K13/0812 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53061 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261
摘要： A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.
摘要翻译：一种能够应对高密度安装，窄间距安装，腔体安装等的安装装置。在该装置中，获得由相对于基准姿势由拾取喷嘴保持的拾取喷嘴从晶片上取出的芯片的位移量，并且当芯片被输送到用于将芯片实际安装到基板上的安装喷嘴，考虑到位移量来校正位移量，使得安装喷嘴始终将芯片保持在固定的姿态。

57. 发明申请

US20050067395A1 Solder bonding method and solder bonding device 有权
标题翻译：焊接方法和焊接接合装置
公开(公告)号：US20050067395A1
公开(公告)日：2005-03-31
申请号：US10947294
申请日：2004-09-23
申请人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
IPC分类号： B23K1/005 , H05K3/34
CPC分类号： H05K3/3494 , B23K1/0056 , H01L2224/11003 , H01L2224/742 , H05K3/3442 , H05K2203/041 , H05K2203/107
摘要： A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.
摘要翻译：提供焊料接合方法和焊接接合装置，其中焊料熔化，并且通过向设置有电极部分的区域的内侧照射激光来进行电极部分的加热，使得电极部分之间的温度差并且熔化的焊料更小以改善焊料的润湿性并增加焊接可靠性。焊接接合方法和焊接接合装置通过熔化焊料进行形成在待接合物体上的电极部分的接合。在熔融之前将焊料供应到电极部分之后，激光照射到焊料和焊料周围的电极部分。焊料熔化，电极部分被加热。因此焊料相对于电极部的润湿性提高，可以提高电极部之间的电连接的可靠性。

58. 发明授权

US06595844B1 Outer-diameter blade, inner-diameter blade, core drill and processing machines using same ones 失效
标题翻译：外径刀片，内径刀片，芯钻和加工机使用相同的刀片
公开(公告)号：US06595844B1
公开(公告)日：2003-07-22
申请号：US09708050
申请日：2000-11-08
申请人： Toru Mizuno , Ikuo Hattori , Akihiko Sugama , Toshikatsu Matsuya , Yoshiaki Ise
发明人： Toru Mizuno , Ikuo Hattori , Akihiko Sugama , Toshikatsu Matsuya , Yoshiaki Ise
IPC分类号： B24B3300
CPC分类号： B28D1/041 , B28D1/121 , Y10T408/81
摘要： A core drill having a shank and a cup shaped base metal section constructed of a disk shaped top wall and a cylindrical side wall provided on a fore-end of the shank. A grinding stone portion is mounted on an outer end part of the base metal section, with abrasive grains fixed to the outer end part of the base metal section. Abrasive grain layers are formed in a spiral pattern on inner and outer side surfaces of the cylindrical side wall of the base metal section, with abrasive grains fixed to the inner and outer side surfaces of the cylindrical side wall thereof. When the grinding stone portion is put into rotational contact with a workpiece, the workpiece is ground through to form a circle hole in section leaving a cylindrical core therein.
摘要翻译：一种芯钻具，其具有由盘形顶壁和设置在柄前端上的圆柱形侧壁构成的柄和杯形贱金属部分。研磨石部分安装在贱金属部分的外端部上，磨粒固定在贱金属部分的外端部分上。研磨粒子层以螺旋状形成在基部金属部的圆筒状侧壁的内侧面和外侧面上，磨粒形成在其圆筒形侧壁的内侧面和外侧面上。当研磨石部分与工件旋转接触时，工件被磨成通孔，从而在其中形成圆孔，留下圆柱形芯。

59. 发明授权

US5893637A Electroluminescent display apparatus for a vehicle 失效
标题翻译：车辆用电致发光显示装置
公开(公告)号：US5893637A
公开(公告)日：1999-04-13
申请号：US724251
申请日：1996-09-30
申请人： Toru Mizuno
发明人： Toru Mizuno
IPC分类号： B60K35/00 , B60K37/02 , B60Q3/04
CPC分类号： B60K37/02 , B60K2350/2034
摘要： A display panel includes a transparent EL panel held at an inner end of an opening formed in an instrument panel portion and inclined at a predetermined acute angle with respect to a viewing direction. A cover is disposed at a back side of the display panel for covering the display panel. A surface of the opening portion and an inner face of the cover, to which light from the display panel enters, are colored dark to absorb unnecessary ambient light.
摘要翻译：显示面板包括保持在形成在仪表板部分中的开口的内端并相对于观察方向以预定锐角倾斜的透明EL面板。盖子布置在显示面板的背面，用于覆盖显示面板。开口部分的表面和来自显示面板的光进入的盖的内表面被着色为暗，以吸收不必要的环境光。

60. 发明授权

US5004968A Method for acceleration and deceleration control of servomotors 失效
标题翻译：伺服电机加减速控制方法
公开(公告)号：US5004968A
公开(公告)日：1991-04-02
申请号：US381396
申请日：1989-07-05
申请人： Toru Mizuno , Ryuichi Hara
发明人： Toru Mizuno , Ryuichi Hara
IPC分类号： H02P29/00 , G05B19/416
CPC分类号： G05B19/416 , G05B2219/42256 , G05B2219/43013 , G05B2219/43062
摘要： A method for acceleration and deceleration control of servomotors always brings out the maximum operating capability of a machine equipped with servomotors, such as a robot, NC machine tool, etc. and accurately moves a respective operating section of the machine, e.g., robot work point, tool, etc., along a commanded path. When a command is read from a program, the speed command value is divided by a maximum allowable (Am) of the machine, set previously, to determine a time constant (T) for acceleration and deceleration control (Step S2), and the time constant is divided by a sampling period to obtain a number (n) of times of commanded speed sampling (Step S3). The servomotor is driven at a controlled speed after the acceleration/deceleration process. The controlled speed is obtained by dividing a sum of a commanded speed of the current sampling period and commanded speeds sampled in the previous (n-1) periods preceding the current period, by the number (n) of times of sampling. Thus, accelerated and decelerated operations of the machine are always performed at the maximum allowable acceleration/deceleration, whereby the maximum operating capability of the machine is available and the respective machine operating section can be moved accurately along the commanded path.
摘要翻译： PCT No.PCT / JP88 / 01241 Sec。 371日期：1989年7月5日 102（e）日期1989年7月5日PCT提交1988年12月9日PCT公布。出版物WO89 / 06066 日期：1989年6月29日。伺服电机的加减速控制方法总是提供装备有机器人，数控机床等伺服电动机的机器的最大操作能力，并精确地移动相应的操作部分机器，例如机器人工作点，工具等，沿着命令的路径。当从程序中读出命令时，将速度指令值除以预先设定的机器的最大允许量（Am），以确定加速和减速控制的时间常数（T）（步骤S2）常数除以采样周期，以获得指令速度采样次数（n）（步骤S3）。伺服电机在加速/减速过程后以受控的速度驱动。控制速度通过将当前采样周期的指令速度与在当前周期之前的（n-1）个周期中采样的指令速度之和除以采样次数（n）来得到。因此，机器的加速和减速操作总是以最大允许的加速/减速进行，从而可以获得机器的最大操作能力，并且可以沿着指令路径精确地移动各个机器操作部。

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