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    • 56. 发明授权
    • Manufacturing method for light emitting device
    • 发光装置的制造方法
    • US08377764B2
    • 2013-02-19
    • US13459122
    • 2012-04-28
    • Shunpei YamazakiHideaki KuwabaraMasakazu Murakami
    • Shunpei YamazakiHideaki KuwabaraMasakazu Murakami
    • H01L21/84
    • H01L51/56C23C14/046C23C14/12C23C14/246C23C14/564H01L27/3244H01L33/44
    • The present invention provides a vapor deposition method and a vapor deposition system of film formation systems by which EL materials can be used more efficiently and EL materials having superior uniformity with high throughput rate are formed. According to the present invention, inside a film formation chamber, an evaporation source holder in a rectangular shape in which a plurality of containers sealing evaporation material is moved at a certain pitch to a substrate and the evaporation material is vapor deposited on the substrate. Further, a longitudinal direction of an evaporation source holder in a rectangular shape may be oblique to one side of a substrate, while the evaporation source holder is being moved. Furthermore, it is preferable that a movement direction of an evaporation source holder during vapor deposition be different from a scanning direction of a laser beam while a TFT is formed.
    • 本发明提供一种可以更有效地使用EL材料的成膜系统的气相沉积方法和气相沉积系统,并且形成具有高生产率的均匀性优异的EL材料。 根据本发明,在成膜室内部,将密封蒸发材料的多个容器以一定间距移动到基板上的矩形状的蒸发源保持器和蒸发材料蒸镀在基板上。 此外,蒸发源保持器的纵向方向可以在基板的一侧倾斜,同时蒸发源保持器被移动。 此外,优选的是,蒸镀源夹持器在气相沉积期间的移动方向与形成TFT的激光束的扫描方向不同。
    • 59. 发明授权
    • Manufacturing method for wiring
    • 接线方法
    • US08053174B2
    • 2011-11-08
    • US11715468
    • 2007-03-08
    • Shunpei YamazakiHideaki Kuwabara
    • Shunpei YamazakiHideaki Kuwabara
    • G03F7/00H01L21/00
    • H01L21/32139C23C16/45589C23C16/509C23C16/54H01J2237/3342H01L21/2855H01L21/28562H01L21/312H01L21/76802H01L21/76838H01L27/124H01L27/1288H01L27/3246H01L51/0017H01L51/0022H01L51/5206H01L51/56
    • In the case in which a film for a resist is formed by spin coating, there is a resist material to be wasted, and the process of edge cleaning is added as required. Further, when a thin film is formed on a substrate using a vacuum apparatus, a special apparatus or equipment to evacuate the inside of a chamber vacuum is necessary, which increases manufacturing cost. The invention is characterized by including: a step of forming conductive layers on a substrate having a dielectric surface in a selective manner with a CVD method, an evaporation method, or a sputtering method; a step of discharging a compound to form resist masks so as to come into contact with the conductive layer; a step of etching the conductive layers with plasma generating means using the resist masks under the atmospheric pressure or a pressure close to the atmospheric pressure; and a step of ashing the resist masks with the plasma generating means under the atmospheric pressure or a pressure close to the atmospheric pressure. With the above-mentioned characteristics, efficiency in use of a material is improved, and a reduction in manufacturing cost is realized.
    • 在通过旋涂形成抗蚀剂用膜的情况下,存在要浪费的抗蚀剂材料,根据需要添加边缘清洁处理。 此外,当使用真空装置在基板上形成薄膜时,需要用于抽真空室内的专用装置或设备,这增加了制造成本。 本发明的特征在于包括:通过CVD法,蒸发法或溅射法以选择性方式在具有电介质表面的基板上形成导电层的步骤; 将化合物排出以形成抗蚀剂掩模以与导电层接触的步骤; 在大气压或接近大气压的压力下使用抗蚀剂掩模的等离子体发生装置蚀刻导电层的步骤; 以及在大气压或接近大气压的压力下用等离子体产生装置对抗蚀剂掩模进行灰化的步骤。 利用上述特征,提高了材料的使用效率,实现了制造成本的降低。
    • 60. 发明授权
    • Light emitting device and method of manufacturing the same
    • 发光元件及其制造方法
    • US08021204B2
    • 2011-09-20
    • US12538563
    • 2009-08-10
    • Shunpei YamazakiSatoshi SeoHideaki Kuwabara
    • Shunpei YamazakiSatoshi SeoHideaki Kuwabara
    • H01J9/24H01J9/00H01J9/14B44C1/22
    • H01L27/3206H01L27/322H01L27/3246H01L27/3276H01L51/5209H01L51/5218H01L51/5221H01L51/5228H01L51/5234H01L51/5237H01L51/524H01L51/5253H01L51/5271H01L2251/5315
    • All lights generated in an organic compound layer are not taken out towards a TFT from a cathode as a transparent electrode. For instance, the light is emitted in a lateral direction (direction parallel to the substrate surface) but the light emitted in the lateral direction is not taken out resultantly, which leads to a loss. Therefore, a light emitting device structured so as to increase the amount of light taken out in a certain direction is provided as well as a method of manufacturing this light emitting device. As a result of etching treatment, an upper edge portion of an insulator (19) is curved to have a radius of curvature, a slope is formed along the curved face while partially exposing layers (18c and 18d) of a first electrode, and a layer (18b) of the first electrode is exposed in a region that serves as a light emitting region. Light emitted from an organic compound layer (20) is reflected by the slope of the first electrode (layers 18c and 18d) to increase the total amount of light taken out in the direction indicated by the arrow in FIG. 1A.
    • 在有机化合物层中产生的所有光不从作为透明电极的阴极朝向TFT取出。 例如,光在横向方向(平行于基板表面的方向)发射,但是在横向方向上发射的光不会被取出,导致损失。 因此,提供了构造成增加沿某一方向取出的光量的发光器件以及制造该发光器件的方法。 作为蚀刻处理的结果,绝缘体(19)的上边缘部分被弯曲成具有曲率半径,沿着弯曲面形成斜面,同时部分地暴露第一电极的层(18c和18d),并且 第一电极的层(18b)暴露在用作发光区域的区域中。 从有机化合物层(20)发射的光被第一电极(层18c和18d)的斜率反射,以增加沿图1中箭头所示方向取出的光的总量。 1A。