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    • 55. 发明授权
    • Potential detecting circuit and semiconductor integrated circuit
    • 电位检测电路和半导体集成电路
    • US6091268A
    • 2000-07-18
    • US055314
    • 1998-04-06
    • Tsukasa OoishiHideto HidakaMikio Asakura
    • Tsukasa OoishiHideto HidakaMikio Asakura
    • G01R31/28G01R19/165G01R31/3185G05F1/10H03K5/08H03K5/153
    • H03K5/08
    • A constant current source (1) is provided between a power supply (.sup.V CC) and an intermediate node (N1) and supplies a reference current (IR) which is a constant current between the power supply (.sup.V CC) and the intermediate node (N1). A variable resistor (2) is provided between the intermediate node (N1) and a comparison potential (VL) and its resistance value can be set to a desired value. A current flowing in the variable resistor (2) is a comparison current (IC). An amplifier (3) has an input connected to the intermediate node (N1) and amplifies a potential from the intermediate node (N1) to output a level detection signal (GE). Having this configuration, a potential detecting circuit which ensures a stable and controllable detection level is provided.
    • 在电源(VCC)和中间节点(N1)之间提供恒流源(1),并且在电源(VCC)和中间节点(N1)之间提供作为恒定电流的参考电流(IR) 。 在中间节点(N1)和比较电位(VL)之间设置可变电阻器(2),其电阻值可以设定为期望值。 在可变电阻器(2)中流动的电流是比较电流(IC)。 放大器(3)具有连接到中间节点(N1)的输入并放大来自中间节点(N1)的电位以输出电平检测信号(GE)。 具有这种配置,提供了确保稳定和可控的检测水平的电位检测电路。
    • 56. 发明授权
    • Semiconductor memory device having an SRAM as a cache memory integrated
on the same chip and operating method thereof
    • 具有集成在同一芯片上的作为高速缓存存储器的SRAM的半导体存储器件及其操作方法
    • US5509132A
    • 1996-04-16
    • US283487
    • 1994-08-01
    • Yoshio MatsudaKazuyasu FujishimaHideto HidakaMikio Asakura
    • Yoshio MatsudaKazuyasu FujishimaHideto HidakaMikio Asakura
    • G06F12/08G11C7/10G11C8/00G11C11/401G11C11/41
    • G06F12/0893G11C7/1051
    • A cache DRAM (100) includes a DRAM memory array (11) accessed by a row address signal and a column address signal, an SRAM memory array (21) accessed by the column address signal, and an ECC circuit (30). The DRAM memory array (11) is divided into a plurality of blocks (B1 to B64), each including a plurality of columns. The SRAM memory array (21) includes 4 ways (W1 to W4). In determining a cache hit/cache miss, a column address signal is inputted. Consequently, the SRAM memory array (21) is accessed and data are read from each of the ways. When a cache hit occurs, one way is selected in response to an externally applied way address signal, and data from that way are outputted. When a cache miss occurs, the column address signal is latched and the row address signal is applied. The DRAM array (11) is accessed in accordance with the row address signal and the latched column address signal.
    • 缓存DRAM(100)包括通过行地址信号和列地址信号访问的DRAM存储器阵列(11),由列地址信号访问的SRAM存储器阵列(21)和ECC电路(30)。 DRAM存储器阵列(11)被分成多个块(B1至B64),每个块包括多个列。 SRAM存储器阵列(21)包括4路(W1至W4)。 在确定高速缓存命中/高速缓存未命中时,输入列地址信号。 因此,访问SRAM存储器阵列(21)并且从每种方式读取数据。 当发生高速缓存命中时,响应于外部施加的方式地址信号选择一种方式,并且从该方式输出数据。 当发生高速缓存未命中时,锁存列地址信号并应用行地址信号。 根据行地址信号和锁存列地址信号来访问DRAM阵列(11)。