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    • 56. 发明申请
    • APPARATUS FOR THERMAL CHARACTERIZATION UNDER NON-UNIFORM HEAT LOAD
    • 用于非均匀热负荷下的热表征的装置
    • US20100046574A1
    • 2010-02-25
    • US12611519
    • 2009-11-03
    • Hendrik F. HamannMadhusudan K. IyengarJames A. LaceyRoger R. Schmidt
    • Hendrik F. HamannMadhusudan K. IyengarJames A. LaceyRoger R. Schmidt
    • G01K3/00G01N25/20
    • H01L23/34H01L2924/0002H01L2924/00
    • What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
    • 所公开的是用于确定用于从电子设备传递热量的冷却装置的冷却特性的装置。 该装置包括热耦合到热管的冷却装置。 该热管具有用于选择性地在其上施加热量的暴露表面。 选择性地将局部热源施加到暴露表面的至少一个区域。 热源优选地能够相对于暴露的表面和热强度都在位置上变化。 优选地,隔热板围绕热管的暴露表面定位,以将操作冷却装置与局部热源隔离。 当冷却装置处于传热模式时,温度检测器重复测量暴露表面上的温度分布。 然后使用温度分布来热定形冷却装置。
    • 57. 发明申请
    • Techniques to Predict Three-Dimensional Thermal Distributions in Real-Time
    • 实时预测三维热分布的技术
    • US20090326884A1
    • 2009-12-31
    • US12146952
    • 2008-06-26
    • Yasuo AmemiyaHendrik F. HamannWalter HirtYing HungJing Shen
    • Yasuo AmemiyaHendrik F. HamannWalter HirtYing HungJing Shen
    • G06G7/48G06F7/60
    • G06F1/206G06F17/5009H05K7/20836Y02D10/16
    • Techniques for monitoring and predicting environmental operating conditions in a data center are provided. In one aspect, a method for real-time, three-dimensional analysis of environmental operating conditions in a data center includes the following steps. High spatial resolution three-dimensional measurements of one or more environmental variables in the data center made at a time t1 are obtained. Real-time measurements of the environmental variables in the data center made at a time t2, wherein t2 is later in time than t1, are obtained. The high spatial resolution three-dimensional measurements are combined with the real-time measurements to derive a model for the environmental variables in the data center at the time t2. The model is used to predict three-dimensional distributions of the environmental variables in the data center at the time t2. A base model can be created and used to derive the model for the data center at the time t2.
    • 提供了一种用于监测和预测数据中心环境操作条件的技术。 一方面,用于对数据中心中的环境操作条件进行实时,三维分析的方法包括以下步骤。 获得了在时间t1进行的数据中心中的一个或多个环境变量的高空间分辨率三维测量。 在t2时刻对数据中心的环境变量进行实时测量,其中t2时间晚于t1。 将高空间分辨率三维测量与实时测量结合,以在时间t2导出数据中心中的环境变量的模型。 该模型用于预测时间t2的数据中心环境变量的三维分布。 可以创建基本模型并用于在时间t2导出数据中心的模型。