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51. 发明授权

US08374698B2 Package for an implantable neural stimulation device 有权
标题翻译：可植入神经刺激装置的包装
公开(公告)号：US08374698B2
公开(公告)日：2013-02-12
申请号：US11893939
申请日：2007-08-18
申请人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61N1/375
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.
摘要翻译：本发明是用于植入人体的改进的密封包装。可植入装置包括具有导电通孔的非导电基底。使用导电凸块将倒装芯片电路连接到基板，并电连接到通孔的第一子集。倒装芯片电路可以包含一个或多个堆叠或折叠堆叠。引线键合电路也附接到基板并电连接到通孔的第二子集。盖子粘合到基底上。盖，衬底和通孔形成改进的用于植入的密封包装。

52. 发明申请

US20130006340A1 Electronics Package Suitable for Implantation 有权
标题翻译：电子封装适用于植入
公开(公告)号：US20130006340A1
公开(公告)日：2013-01-03
申请号：US13610653
申请日：2012-09-11
申请人： Robert J. Greenberg , Jerry Ok
发明人： Robert J. Greenberg , Jerry Ok
IPC分类号： A61N1/375
CPC分类号： A61N1/0543 , A61N1/36046 , A61N1/3752 , H01L23/057 , H01L23/10 , H01L23/4985 , H01L2224/05573 , H01L2224/16225 , H01L2224/73204 , H01L2224/92125 , H01L2924/01079 , H01L2924/1461 , H05K1/0306 , H05K3/321 , H05K3/328 , H05K3/361 , H05K3/4015 , H05K3/423 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/0733 , H05K2203/1446 , H01L2924/00
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译：本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到某些非目标人士。电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。所得到的电子装置是生物相容的并且适合长期植入生物体组织。

53. 发明申请

US20110253432A1 Method and Apparatus for Providing Hermetic Electrical Feedthrough 有权
标题翻译：提供密封电气馈通的方法和装置
公开(公告)号：US20110253432A1
公开(公告)日：2011-10-20
申请号：US13165388
申请日：2011-06-21
申请人： Jerry Ok , Robert J. Greenberg
发明人： Jerry Ok , Robert J. Greenberg
IPC分类号： H05K1/09
CPC分类号： H05K3/4046 , H01L21/486 , H01L23/10 , H01L2924/0002 , H05K1/0306 , H05K2201/10287 , H05K2201/10416 , Y10T29/49139 , Y10T29/49146 , Y10T29/49147 , Y10T29/49162 , Y10T29/49163 , Y10T428/24926 , H01L2924/00
摘要： A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of .ltoreq.40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient's body. The method involves: (a) providing an unfired, ceramic sheet having a thickness of .ltoreq.40 mils and preferably comprising .ltoreq.99% aluminum oxide; (b) forming multiple blind holes in said sheet; (c) inserting solid wires, preferably of platinum, in said holes; (d) firing the assembly of sheet and wires to a temperature sufficient to sinter the sheet material but insufficient to melt the wires; and (e) removing sufficient material from the sheet lower surface so that the lower ends of said wires are flush with the finished sheet lower surface.
摘要翻译：一种适用于在厚度为40密耳的陶瓷片中形成气密电馈通件的方法和装置。更具体地，该方法产生一种包括生物相容性和电化学稳定性并且适于植入患者体内的气密电馈通装置。该方法包括：（a）提供厚度为40密耳，优选包含99.99％氧化铝的未烧制的陶瓷片; （b）在所述片材中形成多个盲孔; （c）将优选铂的实心线插入所述孔中; （d）将片材和电线的组件烧制到足以烧结片材但不足以熔化电线的温度; 以及（e）从片材下表面去除足够的材料，使得所述电线的下端与成品片材下表面齐平。

54. 发明授权

US07989080B2 Method and apparatus for providing hermetic electrical feedthrough 有权
标题翻译：用于提供密封电馈通的方法和装置
公开(公告)号：US07989080B2
公开(公告)日：2011-08-02
申请号：US11493469
申请日：2006-07-25
申请人： Robert J. Greenberg , Jerry Ok
发明人： Robert J. Greenberg , Jerry Ok
IPC分类号： H05K1/03
CPC分类号： H05K3/4046 , H01L21/486 , H01L23/10 , H01L2924/0002 , H05K1/0306 , H05K2201/10287 , H05K2201/10416 , Y10T29/49139 , Y10T29/49146 , Y10T29/49147 , Y10T29/49162 , Y10T29/49163 , Y10T428/24926 , H01L2924/00
摘要： A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of ≦40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient's body. The method involves: (a) providing an unfired, ceramic sheet having a thickness of ≦40 mils and preferably comprising ≧99% aluminum oxide; (b) forming multiple blind holes in said sheet; (c) inserting solid wires, preferably of platinum, in said holes; (d) firing the assembly of sheet and wires to a temperature sufficient to sinter the sheet material but insufficient to melt the wires; and (e) removing sufficient material from the sheet lower surface so that the lower ends of said wires are flush with the finished sheet lower surface.
摘要翻译：适用于在厚度为40密耳的陶瓷片中形成气密电馈通件的方法和装置。更具体地，该方法产生一种包括生物相容性和电化学稳定性并且适于植入患者体内的气密电馈通装置。该方法包括：（a）提供厚度为nlE; 40密耳，优选包含≥99％氧化铝的未烧制陶瓷片; （b）在所述片材中形成多个盲孔; （c）将优选铂的实心线插入所述孔中; （d）将片材和电线的组件烧制到足以烧结片材但不足以熔化电线的温度; 以及（e）从片材下表面去除足够的材料，使得所述电线的下端与成品片材下表面齐平。

55. 发明申请

US20110118807A1 Retinal Prosthesis and Method of Manufacturing a Retinal Prosthesis 有权
标题翻译：视网膜假体和制造视网膜假体的方法
公开(公告)号：US20110118807A1
公开(公告)日：2011-05-19
申请号：US12976650
申请日：2010-12-22
申请人： Robert J. Greenberg , Jerry Ok , Jordan Neysmith , Kevin Wilkins , Neil Hamilton Talbot , Da-Yu Chang
发明人： Robert J. Greenberg , Jerry Ok , Jordan Neysmith , Kevin Wilkins , Neil Hamilton Talbot , Da-Yu Chang
IPC分类号： A61F9/08 , A61N1/36
CPC分类号： A61N1/36046 , A61N1/0543 , A61N1/375 , A61N1/3758 , A61N1/3787 , H01L2224/16227 , H01L2224/32225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16251 , H01L2924/19104 , H01L2924/19107
摘要： The present invention is an improved package and configuration for an implantable retinal prosthesis. The retinal prosthesis of the present invention includes an electrode array suitable to be mounted in close proximity to a retina, an electronics package and inductive receiving coil mounted next to each other on a strap surrounding the sclera so that the height above the sclera of the prosthesis is minimized.
摘要翻译：本发明是用于植入式视网膜假体的改进的包装和构造。本发明的视网膜假体包括适于安装在视网膜附近的电极阵列，电子封装和感应接收线圈，其彼此相邻地安置在围绕巩膜的带上，使得假体巩膜上方的高度被最小化。

56. 发明授权

US07881799B2 Retinal prosthesis and method of manufacturing a retinal prosthesis 有权
标题翻译：视网膜假体和制造视网膜假体的方法
公开(公告)号：US07881799B2
公开(公告)日：2011-02-01
申请号：US11385315
申请日：2006-03-20
申请人： Robert J. Greenberg , Jerry Ok , Jordan Neysmith , Kevin Wilkins , Neil Hamilton Talbot , Da-Yu Chang
发明人： Robert J. Greenberg , Jerry Ok , Jordan Neysmith , Kevin Wilkins , Neil Hamilton Talbot , Da-Yu Chang
IPC分类号： A61N1/18
CPC分类号： A61N1/36046 , A61N1/0543 , A61N1/375 , A61N1/3758 , A61N1/3787 , H01L2224/16227 , H01L2224/32225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16251 , H01L2924/19104 , H01L2924/19107
摘要： An improved package and configuration for an implantable retinal prosthesis includes an electrode array suitable to be mounted in close proximity to a retina, an electronics package, and inductive receiving coil mounted next to each other on a strap surrounding the sclera so that the height above the sclera of the prosthesis is minimized.
摘要翻译：用于可植入视网膜假体的改进的包装和构造包括适于安装在靠近视网膜的电极阵列，电子封装和在包围巩膜的带上彼此相邻安装的感应接收线圈，使得高于假体的巩膜最小化。

57. 发明授权

US07835794B2 Electronics package suitable for implantation 有权
标题翻译：电子封装适合植入
公开(公告)号：US07835794B2
公开(公告)日：2010-11-16
申请号：US11928515
申请日：2007-10-30
申请人： Robert J. Greenberg , Jerry Ok
发明人： Robert J. Greenberg , Jerry Ok
IPC分类号： A61N1/00
CPC分类号： A61N1/0543 , A61N1/36046 , A61N1/3752 , H01L23/057 , H01L23/10 , H01L23/4985 , H01L2224/05573 , H01L2224/16225 , H01L2224/73204 , H01L2224/92125 , H01L2924/01079 , H01L2924/1461 , H05K1/0306 , H05K3/321 , H05K3/328 , H05K3/361 , H05K3/4015 , H05K3/423 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/0733 , H05K2203/1446 , H01L2924/00
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by applying conductive adhesive between electrical contacts and non-conductive underfill around the contacts. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译：本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到某些非目标人士。密封电子封装通过在触点周围的电触点和非导电底部填充物之间施加导电粘合剂而直接粘合到柔性电路或电极上。所得到的电子装置是生物相容的并且适合长期植入生物体组织。

58. 发明申请

US20080268134A1 ELECTRODE WITH INCREASED STABILITY AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有增加的稳定性的电极及其制造方法
公开(公告)号：US20080268134A1
公开(公告)日：2008-10-30
申请号：US11924763
申请日：2007-10-26
申请人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
发明人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
IPC分类号： H01M4/04
CPC分类号： A61N1/0543 , A61N1/36046
摘要： The present invention provides an implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts.The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material.The present invention provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer.The present invention provides A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.
摘要翻译：本发明提供具有增加的稳定性的可植入电极，其具有聚集结构，其中电极的表面被包括填充有棒或柱的开口的材料覆盖。本发明提供了具有增加的稳定性的可植入电极，其中电极的表面包括填充有用导电或绝缘材料填充的棒的网状网格。本发明提供一种具有增加的稳定性的电极的制造方法，包括：在基底层上沉积金属层; 在金属层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 去除留下空间的光致抗蚀剂层; 并用聚合物填充空间。本发明提供了一种制造具有增加的稳定性的电极的方法，包括：在基底层上沉积金属层; 在金属层上施加聚合物层; 在聚合物层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 并除去光致抗蚀剂层。

59. 发明公开

US20230248302A1 SYSTEMS AND METHODS FOR VAGUS NERVE MONITORING AND STIMULATION 审中-公开
公开(公告)号：US20230248302A1
公开(公告)日：2023-08-10
申请号：US18167041
申请日：2023-02-09
申请人： The Alfred E. Mann Foundation for Scientific Research
发明人： Brian V. MECH , Neil Talbot , Brian M. Shelton , Joseph L. Calderon , Robert J. Greenberg
IPC分类号： A61B5/00 , A61B5/369
CPC分类号： A61B5/4094 , A61B5/369 , A61B5/0205
摘要： The present disclosure generally relates to devices, systems, and methods for detecting, monitoring, predicting, and/or treating medical conditions (e.g., epileptic seizures) using one or more sensors configured to collect biomarker data from a human subject (e.g., vagal tone and/or physiological or other biomarkers).

60. 发明申请

US20210290961A1 SYSTEMS FOR TREATING OBSTRUCTIVE SLEEP APNEA 有权
公开(公告)号：US20210290961A1
公开(公告)日：2021-09-23
申请号：US17210033
申请日：2021-03-23
申请人： THE ALFRED E. MANN FOUNDATION FOR SCIENTIFIC RESEARCH
发明人： Robert J. Greenberg , HARSHIT R. SURI , JOSEPH L. CALDERON , BRIAN R. DEARDEN
IPC分类号： A61N1/36 , A61N1/372
摘要： Systems for treating obstructive sleep apnea having an implanted stimulator with an internal sensor configured to generate sensory data corresponding to movement of the thoracic or abdominal cavity of a patient during respiration. The system includes a wireless communications link between the stimulator and at least one external sensor for sensing a patient's physiological parameter and is used to augment the sensory data from the internal sensor. The stimulator includes a stimulation system configured to deliver electrical stimulation to a nerve which innervates an upper airway muscle, such as the hypoglossal nerve to treat sleep apnea.

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