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    • 58. 发明申请
    • ELECTRODE WITH INCREASED STABILITY AND METHOD OF MANUFACTURING THE SAME
    • 具有增加的稳定性的电极及其制造方法
    • US20080268134A1
    • 2008-10-30
    • US11924763
    • 2007-10-26
    • Dao Min ZhouJerry OkNeil Hamilton TalbotBrian V. MechJames Singleton LittleRobert J. Greenberg
    • Dao Min ZhouJerry OkNeil Hamilton TalbotBrian V. MechJames Singleton LittleRobert J. Greenberg
    • H01M4/04
    • A61N1/0543A61N1/36046
    • The present invention provides an implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts.The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material.The present invention provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer.The present invention provides A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.
    • 本发明提供具有增加的稳定性的可植入电极,其具有聚集结构,其中电极的表面被包括填充有棒或柱的开口的材料覆盖。 本发明提供了具有增加的稳定性的可植入电极,其中电极的表面包括填充有用导电或绝缘材料填充的棒的网状网格。 本发明提供一种具有增加的稳定性的电极的制造方法,包括:在基底层上沉积金属层; 在金属层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 去除留下空间的光致抗蚀剂层; 并用聚合物填充空间。 本发明提供了一种制造具有增加的稳定性的电极的方法,包括:在基底层上沉积金属层; 在金属层上施加聚合物层; 在聚合物层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 并除去光致抗蚀剂层。