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51. 发明申请

US20060147719A1 Curable composition, underfill, and method 审中-公开
标题翻译：可固化组合物，底部填充剂和方法
公开(公告)号：US20060147719A1
公开(公告)日：2006-07-06
申请号：US11368146
申请日：2006-03-03
申请人： Slawomir Rubinsztajn , John Campbell , Ryan Mills , Ananth Prabhakumar , Sandeep Tanopi , David Gibson , Florian Schattenmann
发明人： Slawomir Rubinsztajn , John Campbell , Ryan Mills , Ananth Prabhakumar , Sandeep Tanopi , David Gibson , Florian Schattenmann
IPC分类号： B32B27/38 , B32B15/02 , C08K3/22
CPC分类号： C08K3/22 , Y10T428/2995 , Y10T428/31511
摘要： A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites per square nanometer of surface area.
摘要翻译：提供可固化组合物及其相关方法。可固化组合物可以包括可固化树脂和细碎的耐火固体。固体可以具有大于约5平方米/克的表面积，并且确定每平方毫米表面积的活性表面终止位点的密度。

52. 发明申请

US20060123087A1 Email storage format including partially ordered logs of updates to email message attributes 审中-公开
标题翻译：电子邮件存储格式，包括电子邮件属性更新的部分有序日志
公开(公告)号：US20060123087A1
公开(公告)日：2006-06-08
申请号：US11004282
申请日：2004-12-04
申请人： David Gibson
发明人： David Gibson
IPC分类号： G06F15/16
CPC分类号： G06Q10/107
摘要： Email messages are stored without organization; the email messages are not stored in folders, and are otherwise not organized for storage purposes. The messages each have attributes, such as the folder in which they are to be displayed. The messages are organized, such as in folders, just for display purposes—the messages themselves are not moved; only attributes of the messages change. The messages are indexed by their contents. Metadata regarding the messages are stored as partially ordered logs of updates to the messages' attributes. The metadata may be stored as metadata events, where an event describes a change to an attribute of a message. A log of the events is partially ordered in that the events are organized in the order in which they occur as to a specific copy of the messages, but not necessarily in the order in which they occur as to all copies.
摘要翻译：电子邮件无组织存储; 电子邮件消息不存储在文件夹中，否则不会进行存储目的的组织。每个消息都具有属性，例如要显示它们的文件夹。消息被组织，例如在文件夹中，仅用于显示目的 - 消息本身不被移动; 消息的唯一属性更改。消息由其内容编入索引。关于消息的元数据被存储为消息属性的更新的部分有序日志。元数据可以存储为元数据事件，其中事件描述对消息的属性的改变。事件的日志是部分排序的，因为事件按照与消息的特定副本相关的顺序进行组织，但不一定按照所有副本发生的顺序进行。

53. 发明申请

US20060029506A1 Peristaltic pump head and tube holder 审中-公开
公开(公告)号：US20060029506A1
公开(公告)日：2006-02-09
申请号：US11157108
申请日：2005-06-20
申请人： David Gibson , Terence Bannister
发明人： David Gibson , Terence Bannister
IPC分类号： F04B43/08 , F04B43/12
CPC分类号： F04B43/1253
摘要： A tube holder for use with a peristaltic pump includes a housing having a recess for receipt of a pump rotor and a tube race around the recess. The tube race has a first race part and a second race part, a first tube inlet into the first race part and a first tube outlet from the first race part, a second tube inlet into the second race part and a second tube outlet from the second race part. The tube is insertable in the tube race by movement in a substantially orthogonal direction relative to the tube race so that it extends in through the first tube inlet, around the first race part, out through the first tube outlet, in through the second tube inlet, around the second race part, and out through the second tube outlet.

54. 发明申请

US20060029505A1 Peristaltic pump head and tube holder 审中-公开
公开(公告)号：US20060029505A1
公开(公告)日：2006-02-09
申请号：US11156683
申请日：2005-06-20
申请人： David Gibson , Terence Bannister
发明人： David Gibson , Terence Bannister
IPC分类号： F04B43/08 , F04B45/06
CPC分类号： F04B43/1253
摘要： A tube holder for use with a peristaltic pump includes a housing having a recess for receipt of a pump rotor and a tube race around the recess. The tube race has a first race part and a second race part, a first tube inlet into the first race part and a first tube outlet from the first race part, a second tube inlet into the second race part and a second tube outlet from the second race part. The tube is insertable in the tube race by movement in a substantially orthogonal direction relative to the tube race so that it extends in through the first tube inlet, around the first race part, out through the first tube outlet, in through the second tube inlet, around the second race part, and out through the second tube outlet.

55. 发明申请

US20050280134A1 Multi-frequency noise suppression capacitor set 审中-公开
标题翻译：多频抑噪电容组
公开(公告)号：US20050280134A1
公开(公告)日：2005-12-22
申请号：US11154395
申请日：2005-06-16
申请人： David Gibson , Andy Stavros , Michael Warner
发明人： David Gibson , Andy Stavros , Michael Warner
IPC分类号： H01L23/02 , H01L23/50 , H01L23/64
CPC分类号： H01L23/66 , H01L23/50 , H01L23/642 , H01L25/105 , H01L2225/1023 , H01L2225/1058 , H01L2924/0002 , H01L2924/15311 , H01L2924/15331 , H01L2924/3011 , H01L2924/00
摘要： A decoupling device (10) includes a plurality of capacitors having different capacitances (14,16,18) physically mounted in a package (12, 212), and terminals including at least one first terminal (24, 224) and at least one second terminal (26, 226) adapted for mounting the package to a circuit panel. The plural capacitors are connected in parallel between the first and second terminals so as to form plural circuits with different self-resonant frequencies. The device can be mounted as a unit on a circuit board with the first terminals connected to a power conductor and the second terminals connected to a ground conductor, and provides low impedance shunting of noise over a wide frequency spectrum.
摘要翻译：解耦装置（10）包括具有物理地安装在封装（12,212）中的不同电容（14,16,18）的多个电容器，以及包括至少一个第一端子（24,224）和至少一个第二端子端子（26,226），适于将封装安装到电路板。多个电容器并联连接在第一和第二端子之间，以形成具有不同自谐振频率的多个电路。该装置可以作为单元安装在电路板上，其中第一端子连接到电源导体，并且第二端子连接到接地导体，并且在宽频谱上提供低阻抗的噪声分流。

56. 发明授权

US06972998B1 Double data rate memory devices including clock domain alignment circuits and methods of operation thereof 有权
标题翻译：双数据速率存储器件，包括时钟域对准电路及其操作方法
公开(公告)号：US06972998B1
公开(公告)日：2005-12-06
申请号：US10774904
申请日：2004-02-09
申请人： David Gibson , Angus David Starr MacAdam , Mike Farrell
发明人： David Gibson , Angus David Starr MacAdam , Mike Farrell
IPC分类号： G11C7/10 , G11C7/22 , G11C11/34 , G11C11/4096 , G11C29/02
CPC分类号： G11C29/028 , G11C7/1051 , G11C7/106 , G11C7/1066 , G11C7/1069 , G11C7/22 , G11C11/401 , G11C11/4096 , G11C29/02 , G11C29/50012
摘要： An integrated circuit memory device includes a memory, a read control circuit operatively associated with the memory and configured to produce data from the memory responsive to an externally-applied input clock signal, and an output latch configured to transfer data at an input thereof to an output pad of the memory device responsive to an externally-applied output clock signal. The device further includes a clock domain alignment circuit configured to receive the data produced by the memory and to responsively provide the data at the input of the output latch based on relative timing of the input clock signal and the output clock signal.
摘要翻译：集成电路存储器件包括存储器，与存储器可操作地相关联并被配置为响应于外部施加的输入时钟信号从存储器产生数据的读取控制电路，以及输出锁存器，被配置为将数据在其输入处传送到存储器件的输出焊盘响应外部施加的输出时钟信号。该器件还包括时钟域对准电路，其被配置为接收存储器产生的数据，并且基于输入时钟信号和输出时钟信号的相对定时响应地在输出锁存器的输入处提供数据。

57. 发明申请

US20050194672A1 Stacked packages and systems incorporating the same 有权
标题翻译：堆叠的包装和系统结合在一起
公开(公告)号：US20050194672A1
公开(公告)日：2005-09-08
申请号：US10981067
申请日：2004-11-04
申请人： David Gibson , Andy Stavros
发明人： David Gibson , Andy Stavros
IPC分类号： H01L23/02
CPC分类号： H01L25/10 , H01L23/49816 , H01L23/49833 , H01L23/4985 , H01L24/14 , H01L24/17 , H01L25/0655 , H01L25/105 , H01L2224/16225 , H01L2225/0652 , H01L2225/06527 , H01L2225/06548 , H01L2225/06572 , H01L2225/1023 , H01L2225/107 , H01L2924/1437 , H01L2924/15311 , H05K1/112 , H05K1/141 , H05K3/3436 , H05K2201/10378 , H05K2201/10515 , H01L2224/48091 , H01L2924/00014
摘要： A microelectronic assembly incorporates units stacked one above the other and may include a plurality of similar stacks mounted to a circuit board. Some of the stacks may be inverted, rotated or both relative to other stacks so that corresponding edges of the stacks face one another to facilitate communication between the stacks. Communication between the stacks may be carried along traces on one or more interposers intercepting the stacks remote from the circuit board. Within each stack, conducting paths may extend in vertical columns or in other arrangements such as a stair step arrangement wherein each conductive path traverses a series of column positions, or in a crossing arrangement such two conductive paths cross back and forth between column positions along the vertical extend of the stack. A stack may include portions disposed above and below the circuit board.
摘要翻译：微电子组件包括彼此层叠的单元，并且可以包括安装到电路板的多个相似的堆叠。堆叠中的一些可以相对于其他堆叠反转，旋转或两者，使得堆叠的相应边缘彼此面对以便于堆叠之间的连通。堆叠之间的通信可以沿着拦截远离电路板的堆叠的一个或多个插入器上的迹线进行。在每个堆叠内，导电路径可以在垂直列中或在其他布置中延伸，例如阶梯式布置，其中每个导电路径穿过一系列列位置，或者在交叉布置中，这样的两个导电路径沿着沿着该列位置的列位置之间来回交替堆叠的垂直延伸。堆叠可以包括设置在电路板上方和下方的部分。

58. 发明申请

US20050049352A1 Solvent-modified resin compositions and methods of use thereof 审中-公开
标题翻译：溶剂改性树脂组合物及其使用方法
公开(公告)号：US20050049352A1
公开(公告)日：2005-03-03
申请号：US10737943
申请日：2003-12-16
申请人： Slawomir Rubinsztajn , Sandeep Tonapi , David Gibson , John Campbell , Ananth Prabhakumar , Ryan Mills
发明人： Slawomir Rubinsztajn , Sandeep Tonapi , David Gibson , John Campbell , Ananth Prabhakumar , Ryan Mills
IPC分类号： C08K9/06 , C08L63/00 , C09C1/30 , H01L21/56 , H01L23/29 , C08K3/34
CPC分类号： B82Y30/00 , C01P2004/64 , C08K9/06 , C08L63/00 , C09C1/3081 , H01L21/563 , H01L23/293 , H01L23/295 , H01L2224/73203 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/12044 , H01L2924/00
摘要： A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.
摘要翻译：提供了用作底部填充材料的溶剂改性树脂组合物。所述组合物具有至少一种环氧树脂，至少一种溶剂和官能化胶体二氧化硅的填料。溶剂改性树脂组合物可用于制备透明的B阶树脂膜。本公开的实施例包括用作晶片级底部填充物，以及用于电子芯片的密封剂。

59. 发明申请

US20140069040A1 CONTRUCTION PANEL SYSTEM AND METHODS OF ASSEMBLY THEREOF 审中-公开
标题翻译：对接面板系统及其组装方法
公开(公告)号：US20140069040A1
公开(公告)日：2014-03-13
申请号：US14024387
申请日：2013-09-11
申请人： David Gibson
发明人： David Gibson
IPC分类号： E04B1/76
CPC分类号： E04B1/76 , E04B1/14 , E04C2/22 , E04C2/292 , E04C2/52
摘要： Some embodiments provide a construction system that includes a plurality of panels. Moreover, at least some of the plurality of panels may include an upper side, a lower side, an insulation member, and at least one support member that is coupled to the insulation member. In some aspects, the support member may be coupled to the insulation member such that the support member extends from the upper side to the lower side of the panel. In some embodiments, the construction system may also include a plurality of engagement elements that are configured to engage at least some of the panels to assemble the panels into at least a portion of a structure.
摘要翻译：一些实施例提供了包括多个面板的构造系统。此外，多个面板中的至少一些面板可以包括上侧，下侧，绝缘构件以及耦合到绝缘构件的至少一个支撑构件。在一些方面，支撑构件可以联接到绝缘构件，使得支撑构件从面板的上侧延伸到下侧。在一些实施例中，构造系统还可以包括多个接合元件，其被构造成接合至少一些面板以将面板组装成结构的至少一部分。

60. 发明授权

US07939934B2 Microelectronic packages and methods therefor 有权
标题翻译：微电子封装及其方法
公开(公告)号：US07939934B2
公开(公告)日：2011-05-10
申请号：US11315466
申请日：2005-12-22
申请人： Belgacem Haba , David Gibson
发明人： Belgacem Haba , David Gibson
IPC分类号： H01L23/48 , H01L23/14
CPC分类号： G01R1/0483 , G01R1/0735 , G01R1/07378 , H01L23/13 , H01L23/3128 , H01L23/49811 , H01L23/49827 , H01L23/4985 , H01L2224/05001 , H01L2224/05023 , H01L2224/05147 , H01L2224/05548 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2924/00013 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/19041 , H01L2924/3011 , H05K3/3436 , H05K3/3447 , H05K2201/0367 , H05K2203/0455 , Y02P70/613 , H01L2924/00 , H01L2224/29099 , H01L2224/05599
摘要： An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The assembly also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements.
摘要翻译：用于测试微电子器件的组件包括具有面和触点的微电子元件，与微电子元件的第一面间隔开并且覆盖微电子元件的第一面的柔性基板，以及从柔性基板延伸并远离第一面微电子元件，至少一些导电柱与微电子元件电互连。组件还包括设置在微电子元件和衬底之间的多个支撑元件，用于将柔性衬底支撑在微电子元件上。至少一些导电柱从支撑元件偏移。

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