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    • 51. 发明授权
    • Method and apparatus for inspecting a pattern formed on a substrate
    • 用于检查在基板上形成的图案的方法和装置
    • US06900888B2
    • 2005-05-31
    • US10650756
    • 2003-08-29
    • Minoru YoshidaShunji MaedaAtsushi ShimodaKaoru SakaiTakafumi OkabeMasahiro Watanabe
    • Minoru YoshidaShunji MaedaAtsushi ShimodaKaoru SakaiTakafumi OkabeMasahiro Watanabe
    • G01N21/956G03F7/20G03F9/00G01N21/88
    • G03F7/7065G01N21/95684
    • The inventive method and apparatus for detecting defects of a microscopic circuit pattern by imaging the pattern at high resolution comprises an objective lens for imaging the subject pattern, a laser illumination means for illuminating the pupil of the objective lens, means of diminishing the coherency of the laser illumination, an accumulative detector, and means of processing the signal detected by the detector. The method and apparatus are capable of imaging the subject pattern at high sensitivity and high speed based on the illumination by a short wavelength, which is indispensable for the enhancement of resolution, particularly based on a laser light source which is advantageous for practicing, with a resulting image being the same or better in quality as compared with an image resulting from the ordinary discharge tube illumination, whereby it is possible to detect microscopic defects at high sensitivity.
    • 用于通过以高分辨率对图案进行成像来检测微观电路图案的缺陷的本发明的方法和装置包括用于对被摄体图案进行成像的物镜,用于照射物镜的瞳孔的激光照明装置,降低该物镜的相干性的手段 激光照明,累积检测器,以及处理由检测器检测到的信号的装置。 该方法和装置能够以高灵敏度和高速度基于短波长的照明来对被摄体图案进行成像,这对于提高分辨率是不可或缺的,特别是基于有利于实践的激光光源 与普通放电管照明产生的图像相比,所得到的图像的质量相同或更好,从而可以以高灵敏度检测微观缺陷。
    • 53. 发明授权
    • Method and apparatus for observing and inspecting defects
    • 观察和检查缺陷的方法和装置
    • US06690469B1
    • 2004-02-10
    • US09397334
    • 1999-09-14
    • Yukihiro ShibataShunji MaedaKazuo YamaguchiMinoru YoshidaAtsushi YoshidaKenji OkaKenji Watanabe
    • Yukihiro ShibataShunji MaedaKazuo YamaguchiMinoru YoshidaAtsushi YoshidaKenji OkaKenji Watanabe
    • G01J400
    • G01N21/21G01N21/9501G01N21/956G01N21/95607G02B21/0016
    • A defect inspecting apparatus is disclosed that can detect finer defects with high resolution optical images of those defects, and which makes the difference in contrast greater between fine line patterns of a semiconductor device. The defect inspecting apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. Also included is a display for displaying the optical image detected by this lighting and detecting apparatus; an optical parameter setting device for setting and displaying optical parameters for the lighting and detecting apparatus on the display; and optical parameter adjusting apparatus for adjusting optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus; a storage device for storing comparative image data; and a defect detecting device for detecting defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.
    • 公开了能够利用这些缺陷的高分辨率光学图像检测更细的缺陷的缺陷检查装置,并且使得半导体器件的细线图案之间的对比度差异更大。 缺陷检查装置包括用于安装样品的样品安装装置; 照明和检测装置,用于照亮安装在安装件上的图案样品,并检测由其获得的反射光的光学图像。 还包括用于显示由该照明和检测装置检测的光学图像的显示器; 用于在显示器上设置和显示照明和检测装置的光学参数的光学参数设置装置; 以及光学参数调整装置,用于根据由所述光学参数设定装置设定的光学参数来调整对所述照明和检测装置设定的光学参数; 用于存储比较图像数据的存储装置; 以及缺陷检测装置,用于通过将由光学图像检测装置检测的光学图像与存储在存储器中的比较图像数据进行比较来检测在样本上形成的图案的缺陷。
    • 55. 发明授权
    • Method and apparatus for picking up 2D image of an object to be sensed
    • 拾取被感测物体的2D图像的方法和装置
    • US06507417B1
    • 2003-01-14
    • US09105222
    • 1998-06-26
    • Hiroshi MakihiraShunji MaedaKenji OkaMinoru YoshidaYasuhiko Nakayama
    • Hiroshi MakihiraShunji MaedaKenji OkaMinoru YoshidaYasuhiko Nakayama
    • H04N104
    • G06T7/0004G06T2207/30148
    • An image pickup device for sensing a two-dimensional (2D) image while causing a projected image of an object to be sensed being projected onto a linear image sensor to relatively move with respect to the linear image sensor in a direction (V scanning) perpendicular to the internal scan (H scan) direction of the linear image sensor. This device includes a position detector circuit that detects the position of the object to be sensed, and a pixel size modifier circuit for changing or modifying the setup configuration of a pixel size in the V scan direction of the linear image sensor on the basis of a position detection signal indicative of the position of the to-be-sensed object as detected by the position detector circuit. The pixel size modifier circuit is operable based on the object position detection signal to periodically change the interval of H-scanning start pulses of the linear image sensor.
    • 用于感测二维(2D)图像同时使待检测对象的投影图像投影到线性图像传感器上的图像拾取装置相对于线性图像传感器在垂直方向(V扫描)上相对移动 到线性图像传感器的内部扫描(H扫描)方向。 该装置包括检测待感测物体的位置的位置检测器电路和用于基于线性图像传感器的V扫描方向改变或修改像素尺寸的设置配置的像素尺寸修正器电路 位置检测信号,其指示由位置检测器电路检测到的待感测对象的位置。 像素尺寸修正器电路可以基于物体位置检测信号进行操作,以周期性地改变线性图像传感器的H扫描开始脉冲的间隔。
    • 56. 发明授权
    • Manufacturing method of semiconductor substrative and method and
apparatus for inspecting defects of patterns on an object to be
inspected
    • 半导体衬底的制造方法以及用于检查待检查物体上的图案缺陷的方法和装置
    • US5774222A
    • 1998-06-30
    • US539886
    • 1995-10-06
    • Shunji MaedaYasuhiko NakayamaMinoru YoshidaHitoshi KubotaKenji Oka
    • Shunji MaedaYasuhiko NakayamaMinoru YoshidaHitoshi KubotaKenji Oka
    • G01N21/95G01N21/956G01N21/88
    • G01N21/8806G01N21/9501G01N21/956G01N21/95607G01N2021/95615G01N2201/0618G01N2201/0634
    • A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.
    • 一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。 通过将通过物镜的环形照明照射到安装在台架上的晶片上,检查被检查物体上的微细图案,晶片上具有微细精细图案。 照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制,并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较,并且检测出显示不一致的图案的一部分作为缺陷,从而同时以高分辨率检测微细微图案或微细图案上的缺陷。 此外,通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。