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    • 52. 发明授权
    • Semiconductor memory system having a data clock system for reliable high-speed data transfers
    • 具有用于可靠的高速数据传输的数据时钟系统的半导体存储器系统
    • US06614714B2
    • 2003-09-02
    • US10055149
    • 2002-01-22
    • Louis L. HsuJeremy K. StephensDaniel W. StoraskaLi-Kong Wang
    • Louis L. HsuJeremy K. StephensDaniel W. StoraskaLi-Kong Wang
    • G11C818
    • G11C7/222G11C7/1006G11C7/1072G11C2207/104
    • A data clock system for a semiconductor memory system is provided for performing reliable high-speed data transfers. The semiconductor memory system includes a plurality of data banks configured for storing data, the plurality of data banks in operative communication with a plurality of first data paths, each first data path in operative communication with a second data path. The data clock system includes a first clock path receiving a clock signal during a data transfer operation for transferring data between one data bank of the plurality of data banks and the second data path via one of the plurality of first data paths; and a second clock path receiving the clock signal from the first clock path and propagating the clock signal along therethrough, the second clock path including at least one clock driver. The transfer of data between the one of the plurality of first data paths and the second data path occurs upon receipt of the clock signal by the at least one clock driver. A method for propagating a clock signal in a semiconductor memory system is also provided for performing reliable high-speed data transfers. In the inventive system and method the clock signal is delayed during propagation along the first clock path and the second clock path by approximately the same amount of time regardless if the at least one clock driver is positioned proximate a far end of the second clock path or the at least one clock driver is positioned proximate a near end of the second clock path.
    • 提供了一种用于半导体存储器系统的数据时钟系统,用于执行可靠的高速数据传输。 半导体存储器系统包括被配置为存储数据的多个数据库,所述多个数据库与多个第一数据路径可操作地通信,每个第一数据路径与第二数据路径可操作地通信。 数据时钟系统包括在数据传输操作期间接收时钟信号的第一时钟路径,用于经由多个第一数据路径中的一个数据路径在多个数据库的一个数据组和第二数据路径之间传送数据; 以及第二时钟路径,从第一时钟路径接收时钟信号并且沿着其传播时钟信号,第二时钟路径包括至少一个时钟驱动器。 在所述至少一个时钟驱动器接收到所述时钟信号之后,发生所述多个第一数据路径中的一个数据路径和所述第二数据路径之间的数据传送。 还提供了用于在半导体存储器系统中传播时钟信号的方法,用于执行可靠的高速数据传输。 在本发明的系统和方法中,时钟信号在沿着第一时钟路径和第二时钟路径传播期间被延迟大约相同的时间量,而不管至少一个时钟驱动器位于第二时钟路径的远端附近, 至少一个时钟驱动器位于第二时钟路径的近端附近。
    • 53. 发明授权
    • Micro-cell redundancy scheme for high performance eDRAM
    • 用于高性能eDRAM的微单元冗余方案
    • US06400619B1
    • 2002-06-04
    • US09841950
    • 2001-04-25
    • Louis L. HsuLi-Kong Wang
    • Louis L. HsuLi-Kong Wang
    • G11C700
    • G11C29/808G11C29/24G11C2207/104
    • A new micro-cell redundancy scheme for a wide bandwidth embedded DRAM having a SRAM cache interface. For each bank of micro-cell array units comprising the eDRAM, at least one micro-cell unit is prepared as the redundancy to replace a defected micro-cell within the bank. After array testing, any defective micro-cell inside the bank is replaced with a redundancy micro-cell for that bank. A fuse bank structure implementing a look-up table is established for recording each redundant micro-cell address and its corresponding repaired micro-cell address. In order to allow simultaneous multi-bank operation, the redundant micro-cells may only replace the defective micro-cells within the same bank. When reading data from eDRAM, or writing data to eDRAM, the micro-cell array address is checked against the look-up table to determine whether that data is to be read from or written to the original micro-cell, or the redundant micro-cell. The micro-cell redundancy scheme is a flexible and reliable method for high-performance eDRAM applications.
    • 一种用于具有SRAM缓存接口的宽带宽嵌入式DRAM的新型微小区冗余方案。 对于包括eDRAM的每个微单元阵列单元组,至少一个微单元单元被准备为冗余以替代该单元内的缺陷微单元。 在阵列测试之后,银行内的任何有缺陷的微单元被该银行的冗余微单元替代。 建立实现查找表的熔丝库结构,用于记录每个冗余微小区地址及其对应的修复的微小区地址。 为了允许同时多行操作,冗余微单元可以仅替换同一个存储体内的有缺陷的微单元。 当从eDRAM读取数据或将数据写入eDRAM时,将针对查找表检查微单元阵列地址,以确定该数据是从原始微单元读取还是写入原始微单元, 细胞。 微单元冗余方案是高性能eDRAM应用的灵活可靠的方法。
    • 54. 发明授权
    • Method for fabricating semiconductor devices with different properties using maskless process
    • 使用无掩模工艺制造具有不同特性的半导体器件的方法
    • US06355531B1
    • 2002-03-12
    • US09634225
    • 2000-08-09
    • Jack A. MandelmanLouis L. HsuCarl J. RadensWilliam R. TontiLi-Kong Wang
    • Jack A. MandelmanLouis L. HsuCarl J. RadensWilliam R. TontiLi-Kong Wang
    • H01L218236
    • H01L21/823892H01L21/823807H01L21/82385Y10S438/981
    • A method is provided for fabricating semiconductor devices having different properties on a common semiconductor substrate. The method includes the steps of (a) forming N openings on the semiconductor substrate, wherein each opening is corresponding to a channel region of each semiconductor device, (b) forming oxide layers of an ith type on surfaces of the N openings, (c) depositing gate conductor material of an ith type over structure of the semiconductor devices, the gate conductor material of the ith type having a gate conductor work-function of an ith type, (d) removing the gate conductor material of the ith type such that a predetermined amount of the gate conductor material of the ith type remains in an ith opening to form a gate conductor material layer of the ith type on top surface in the ith opening and the gate conductor material of the ith type deposited in the structure other than the ith opening is removed, (e) removing the oxide layers of the ith type from openings other than the ith opening, (f) repeating the steps of (a) through (e) from “i=1” to “i=N”, and (g) forming at least one layer on surface of each of N gate conductor material layers in the N openings to form a gate conductor, whereby the N semiconductor devices have N gate conductors, respectively, wherein the N gate conductors have N types of gate conductor work-functions. The semiconductor devices also have channel regions of which doping levels are different from each other by implanting the channel regions with different types of implants.
    • 提供了一种在公共半导体衬底上制造具有不同特性的半导体器件的方法。 该方法包括以下步骤:(a)在半导体衬底上形成N个开口,其中每个开口对应于每个半导体器件的沟道区,(b)在N个开口的表面上形成第i个类型的氧化物层,(c )沉积所述半导体器件的第i型结构的栅极导体材料,所述第i型栅极导体材料具有第i类型的栅极导体功函数,(d)去除所述第i种类型的栅极导体材料,使得 第i个类型的栅极导体材料的预定量保持在第i个开口中,以在第i个开口的顶表面上形成第i型的栅极导体材料层,并且沉积在除第 除去第i个开口,(e)从第i个开口以外的开口除去第i个类型的氧化物层,(f)重复步骤(a)至(e)从“i = 1”到“i = N “,(g)在其上形成至少一层 在N个开口中的N个栅极导体材料层中的每一个的表面形成栅极导体,由此N个半导体器件分别具有N个栅极导体,其中N个栅极导体具有N种类型的栅极导体功函数。 半导体器件还具有通过用不同类型的植入物植入沟道区域而使掺杂水平彼此不同的沟道区域。
    • 55. 发明授权
    • System and method for sequential testing of high speed serial link core
    • 高速串行连接核心序列测试系统及方法
    • US07191371B2
    • 2007-03-13
    • US10118751
    • 2002-04-09
    • Louis L. HsuLi-Kong Wang
    • Louis L. HsuLi-Kong Wang
    • G01R31/28
    • H04L1/243
    • A testing circuit for testing a series of at least three alternating transmitter and receiver links. The testing circuit including a built-in-self-test (BIST.) macro for generating test data and transmitting the test data to a first link of the series of transmitter and receiver links, and for receiving processed test data from a last link of the series of transmitter receiver links; and at least one test transmission line for transmitting test data received by a link of the series of transmitter and receiver links to a next link of the series of transmitter and receiver links, wherein the at least one test transmission line connects the at least three transmitter and receiver links. A method for testing a series of links having at least three alternating transmitter and receiver links of a plurality of transmitter and receiver links in a SerDes core including generating at least one test data signal; transmitting the at least one test data signal sequentially through the transmitter and receiver links of the series of links; receiving the at least one test data signal from a last link of the series of transmitter and receiver links; and checking the at least one test data signal received.
    • 用于测试一系列至少三个交替发射机和接收机链路的测试电路。 所述测试电路包括用于产生测试数据并将所述测试数据发送到所述一系列发射机和接收机链路的第一链路的内置自测试(BIST)宏,以及从所述一系列发射机和接收机链路的第一链路接收经处理的测试数据 一系列发射机接收器链路; 以及至少一个测试传输线,用于将由所述一系列发射机和接收机链路的链路接收的测试数据发射到所述一系列发射机和接收机链路中的下一个链路,其中所述至少一个测试传输线路将所述至少三个发射机 和接收器链接。 一种用于测试一系列链路的方法,所述链路具有至少三个在SerDes核心中的多个发射机和接收机链路的交替发射机和接收机链路,包括生成至少一个测试数据信号; 通过所述一系列链路的所述发射机和接收机链路顺序地传送所述至少一个测试数据信号; 从所述一系列发射机和接收机链路的最后一个链路接收所述至少一个测试数据信号; 以及检查所接收的至少一个测试数据信号。
    • 60. 发明授权
    • Method of integrating volatile and non-volatile memory cells on the same substrate and a semiconductor memory device thereof
    • 将易失性和非易失性存储单元集成在同一衬底上的方法及其半导体存储器件
    • US06670234B2
    • 2003-12-30
    • US09887403
    • 2001-06-22
    • Louis L. HsuCarl J. RadensLi-Kong Wang
    • Louis L. HsuCarl J. RadensLi-Kong Wang
    • H01L2100
    • H01L27/11526H01L27/105H01L27/1052H01L27/10861H01L27/10894H01L27/11546
    • A method for fabricating DRAM and flash memory cells on a single chip includes providing a silicon substrate, forming a trench capacitor for each of the DRAM cells in the silicon substrate, forming isolation regions in the silicon substrate which are electrically isolated from each other, forming first type wells for DRAM and flash memory cells at first predetermined regions of the silicon substrate by implanting a first type impurity in the first predetermined regions, forming second type wells for DRAM and flash memory cells at second predetermined regions in the first type wells by implanting a second type impurity in the second predetermined regions, forming oxide layers for DRAM and flash memory cells on the second type wells, forming gate electrodes for DRAM and flash memory cells on the oxide layers for DRAM and flash memory cells, and forming source and drain regions for DRAM and flash memory cells in the respective second type wells for DRAM and flash memory cells, in which the source and drain regions are associated with each of the gate electrodes for DRAM and flash memory cells.
    • 在单个芯片上制造DRAM和闪存单元的方法包括提供硅衬底,为硅衬底中的每个DRAM单元形成沟槽电容器,形成硅衬底中彼此电隔离的隔离区域,形成 通过在第一预定区域中注入第一种类型的杂质,在第一种类型的阱中的第二预定区域形成用于DRAM和闪速存储单元的第二类型阱,通过植入 在第二预定区域中形成第二类型杂质,在第二类型阱上形成用于DRAM和闪存单元的氧化物层,在DRAM和闪存单元的氧化物层上形成用于DRAM的闪存存储单元的栅电极,以及形成源极和漏极 用于DRAM和闪速存储器单元的相应的第二类型阱中的用于DRAM和闪存单元的区域 e源极和漏极区域与用于DRAM和闪存单元的每个栅电极相关联。