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51. 发明授权

US07328505B2 Method for manufacturing multilayer circuit board 有权
标题翻译：多层电路板的制造方法
公开(公告)号：US07328505B2
公开(公告)日：2008-02-12
申请号：US10842526
申请日：2004-05-11
申请人： Koji Kondo
发明人： Koji Kondo
IPC分类号： H05K3/03 , H05K3/10
CPC分类号： H05K3/4632 , H01L2224/1147 , H05K1/0206 , H05K1/056 , H05K3/244 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2203/072 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49163
摘要： A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a single-sided conductor layer film. Then, a plurality of via-holes 24, which are bottomed by the conductor layers, are formed in the resin film. Then interlayer connecting material is packed in the via-holes 24 to form a single-sided conductor layer film having the interlayer connecting material. A plurality of single-sided conductor layer films are formed and stacked such that surfaces having the conductor layers face in the same direction. Then, the single-sided conductor layer films are pressed and heated to complete the multilayer circuit board. The multilayer circuit board is formed by using only the single-sided conductor layer films and pressing once, so the manufacturing process is simplified.
摘要翻译：仅在一个表面上具有电极的多层电路板制造如下。在由热塑性树脂制成的树脂膜上形成多个导体层以形成单面导体层膜。然后，在树脂膜中形成有由导体层底部的多个通路孔24。然后将层间连接材料包装在通孔24中，以形成具有层间连接材料的单面导体层膜。多个单面导体层膜被形成并堆叠，使得具有导体层的表面面向相同的方向。然后，对单面导体层膜进行加压加热以完成多层电路板。多层电路板仅使用单面导体层膜并按压一次形成，因此制造工艺简化。

52. 发明授权

US07036214B2 Manufacturing method of rigid-flexible printed circuit board and structure thereof 有权
公开(公告)号：US07036214B2
公开(公告)日：2006-05-02
申请号：US10383227
申请日：2003-03-07
申请人： Koji Kondo , Satoshi Takeuchi , Tomohiro Yokochi , Katsumi Yamazaki , Masakazu Terada
发明人： Koji Kondo , Satoshi Takeuchi , Tomohiro Yokochi , Katsumi Yamazaki , Masakazu Terada
IPC分类号： H05K3/36
CPC分类号： H05K3/4691 , H05K1/118 , H05K3/4069 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2201/0909 , H05K2201/09109 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.

53. 发明授权

US07012197B2 Multi-layer printed circuit board and method for manufacturing the same 有权
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US07012197B2
公开(公告)日：2006-03-14
申请号：US10814804
申请日：2004-04-01
申请人： Toshikazu Harada , Koji Kondo
发明人： Toshikazu Harada , Koji Kondo
IPC分类号： H05K1/03
CPC分类号： H05K1/0242 , H05K1/024 , H05K3/382 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0191 , H05K2201/0352 , H05K2203/065 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49163 , Y10T428/24917
摘要： A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.
摘要翻译：多层印刷电路板包括绝缘基板; 设置在所述绝缘基板的表面上的表面导电图案; 以及嵌入绝缘基板中的内导电图案。表面导电图案在绝缘基板侧具有表面粗糙度，表面导电图案的表面粗糙度大于内部导电图案的表面粗糙度。

54. 发明申请

US20050139386A1 Multi-layer printed circuit board and method for manufacturing the same 有权
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US20050139386A1
公开(公告)日：2005-06-30
申请号：US10814803
申请日：2004-04-01
申请人： Kazuo Tada , Koji Kondo , Satoshi Takeuchi
发明人： Kazuo Tada , Koji Kondo , Satoshi Takeuchi
IPC分类号： H05K3/46 , H05K1/16 , H05K1/00 , H05K3/36
CPC分类号： H05K1/167 , H05K3/4611 , H05K3/4614 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0317 , H05K2203/065 , Y10T29/49082 , Y10T29/49126 , Y10T29/49128
摘要： A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.
摘要翻译：多层印刷电路板包括：具有多层叠热塑性树脂膜的树脂基板; 嵌入树脂基板中的薄膜电阻器; 以及设置在薄膜电阻器上的电极。热塑性树脂膜包括由金属膜制成的导电图案。电极被设置在电极之上或之下的导电图案覆盖。

55. 发明授权

US06855625B2 Manufacturing method of multilayer substrate 有权
标题翻译：多层基板的制造方法
公开(公告)号：US06855625B2
公开(公告)日：2005-02-15
申请号：US10458630
申请日：2003-06-11
申请人： Koji Kondo , Tetsuaki Kamiya , Toshikazu Harada , Ryuichi Onoda , Yasutaka Kamiya , Gentaro Masuda , Yoshitaro Yazaki , Tomohiro Yokochi
发明人： Koji Kondo , Tetsuaki Kamiya , Toshikazu Harada , Ryuichi Onoda , Yasutaka Kamiya , Gentaro Masuda , Yoshitaro Yazaki , Tomohiro Yokochi
IPC分类号： H05K3/28 , H05K1/11 , H05K3/00 , H05K3/40 , H05K3/46 , H01L21/47
CPC分类号： H05K3/4638 , H05K3/0035 , H05K3/281 , H05K3/4069 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0355 , H05K2201/0394 , H05K2201/09245 , H05K2201/096 , H05K2201/09854 , H05K2203/063 , H05K2203/065 , H05K2203/1476 , H05K2203/1572 , Y10T156/1064
摘要： Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
摘要翻译：制备单面导体图案化膜，其每一个具有只形成树脂膜的一侧的导体图案和填充有导电浆料的通孔。在单面导体图案化膜上层叠单面导体图案膜，其具有仅形成树脂膜的一侧的导体图案和形成在树脂膜中以露出电极的开口。此外，在单面导体图案化膜的底面上层叠具有露出电极的开口的覆盖层，以形成层压体。然后，通过在加热层叠体的同时按压，可以制造在其两侧具有电极的多层基板。

56. 发明申请

US20050000725A1 Manufacturing method for a printed circuit board 有权
标题翻译：印刷电路板的制造方法
公开(公告)号：US20050000725A1
公开(公告)日：2005-01-06
申请号：US10909434
申请日：2004-08-03
申请人： Yoshihiko Shiraishi , Koji Kondo
发明人： Yoshihiko Shiraishi , Koji Kondo
IPC分类号： H05K1/14 , H01L21/48 , H01L23/498 , H01L23/538 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/40 , H05K3/46
CPC分类号： H05K3/4632 , H01L21/4857 , H01L23/49822 , H01L23/49894 , H01L2224/16225 , H01L2924/00014 , H01L2924/09701 , H05K1/0306 , H05K1/095 , H05K1/167 , H05K3/4069 , H05K3/4605 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49162 , Y10T29/49165 , Y10T29/49211 , H01L2224/0401
摘要： A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic substrate. The single-sided conductor pattern films are laminated on the ceramic substrate. Then, the multilayered assembly is heated and pressed from both sides thereof to obtain a printed circuit board. During the heat and press treatment, respective single-sided conductor pattern films and the ceramic substrate bond together while the interlayer connection is obtained between the conductor patterns as well as between the conductor pattern and the printed conductor pattern.
摘要翻译：在由热塑性树脂制成的树脂膜上形成导体图案。每个单面导体图案膜具有填充有导电浆料的通孔。印刷导体图案和印刷电阻器形成在陶瓷基板上。单面导体图案膜层叠在陶瓷基板上。然后，将多层组件从其两侧加热并压制，得到印刷电路板。在热压处理期间，在导体图案之间以及在导体图案和印刷导体图案之间获得层间连接的情况下，各自的单面导体图案膜和陶瓷基板结合在一起。

57. 发明授权

US06784577B2 Vehicular AC current generator rotor having field-coil winding finishing-end hook portions 有权
标题翻译：车载交流电流发电机转子具有励磁线圈绕线精加工端钩部分
公开(公告)号：US06784577B2
公开(公告)日：2004-08-31
申请号：US10140327
申请日：2002-05-08
申请人： Koji Kondo
发明人： Koji Kondo
IPC分类号： H02K100
CPC分类号： H02K3/528
摘要： In a rotor for a vehicular alternating current generator, a field coil is wound around an insulating bobbin. A flange of the bobbin is formed with the first, second and third hook portions. A coil winding finishing end is wound around the first hook portion and is opposed to a winding direction of the field coil. The finishing end is then directed in a radially inward direction with the second hook portion, and extended further in the radially inward direction along the axial end surface of the flange. Then, the finishing end is directed in the axial direction with the third hook portion, radially inside of the outer peripheral end of the field coil. The finishing end forms an angle with itself of less than 90 degrees around the first hook portion when being viewed along an axial direction of the first hook portion.
摘要翻译：在用于车辆交流发电机的转子中，励磁线圈缠绕在绝缘筒管上。线轴的凸缘形成有第一，第二和第三钩部。线圈绕线末端卷绕在第一钩部上并且与励磁线圈的卷绕方向相对。然后将精加工端沿着径向向内的方向与第二钩部一起引导，并且沿着凸缘的轴向端面在径向向内的方向上进一步延伸。然后，在励磁线圈的外周端的径向内侧，第三钩部沿轴向方向引导精加工端。当沿着第一钩部的轴向观察时，最终端部围绕第一钩部形成小于90度的角度。

58. 发明授权

US06734877B1 Image display apparatus and method 有权
标题翻译：图像显示装置及方法
公开(公告)号：US06734877B1
公开(公告)日：2004-05-11
申请号：US09571052
申请日：2000-05-15
申请人： Fumitaka Honda , Koji Kondo
发明人： Fumitaka Honda , Koji Kondo
IPC分类号： G06F300
CPC分类号： G06F17/30843 , G06F17/30274
摘要： An index related process unit 75 in a web server 3 determines index related information regarding a display form of a VD index picture, which is necessary for a GUI data generating unit 77 to generate GUI data. The index related information includes, for example, the number of VD index pictures which can be displayed according to the size of a browser screen of a terminal device 4, numbers of VD index pictures to be selected when the number of VD index pictures generated exceeds the displayable number, and a VD index picture display form according to the length of a moving picture. The VD index picture display form is used so that the user of the terminal device 4 can recognize the length of the corresponding moving picture only by seeing the VD index picture display form displayed on the browser screen by selectively using a part of the area in which the VD index pictures can be displayed according to the length of the moving picture.
摘要翻译： Web服务器3中的索引相关处理单元75确定与GUI数据生成单元77生成GUI数据所必需的关于VD索引图片的显示形式的索引相关信息。索引相关信息包括例如根据终端设备4的浏览器屏幕的尺寸可以显示的VD索引图片的数量，当生成的VD索引图片的数量超过时要选择的VD索引图片的数量可显示的数量和根据运动图像的长度的VD索引图像显示形式。使用VD索引图像显示形式，使得终端装置4的用户只能通过选择性地使用其中的一部分区域来查看浏览器屏幕上显示的VD索引图像显示形式来识别相应运动图像的长度可以根据运动图像的长度显示VD索引图片。

59. 发明授权

US06238777B1 Printed-circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US06238777B1
公开(公告)日：2001-05-29
申请号：US09166589
申请日：1998-10-06
申请人： Ryuji Oda , Koji Kondo
发明人： Ryuji Oda , Koji Kondo
IPC分类号： B32B300
CPC分类号： H05K1/0271 , H05K1/111 , H05K3/107 , H05K3/4644 , H05K2201/09781 , H05K2201/10689 , H05K2201/10734 , Y10T428/24917
摘要： A printed-circuit board according to the present invention includes: a plurality of insulating layers; a plurality of conductive patterns formed in each insulating layer; and a plurality of closed and curved patterns each formed around the conductive patterns in each insulating layer, and each formed by a material having a coefficient of linear thermal expansion smaller than that of the insulating layer. In this case, each closed and curved pattern is made of copper and formed of same material as that of each conductive pattern. Further, when the coefficient of linear thermal expansion of each insulating layer is &agr;1, when the coefficient of linear thermal expansion of each conductive layer is &agr;2, and when the coefficient of linear thermal expansion of each closed and curved pattern is &agr;3, the following condition, i.e., &agr;1>&agr;2≧&agr;3, is satisfied.
摘要翻译：根据本发明的印刷电路板包括：多个绝缘层; 形成在每个绝缘层中的多个导电图案; 以及多个闭合和弯曲的图案，每个形成在每个绝缘层中的导电图案周围，并且每个由具有比绝缘层的线性热膨胀系数小的线性热膨胀系数的材料形成。在这种情况下，每个封闭和弯曲图案由铜制成并且由与每个导电图案相同的材料形成。此外，当绝缘层的线性热膨胀系数为α1时，当每个导电层的线性热膨胀系数为α2时，并且当每个闭合曲线图案的线性热膨胀系数为α3时，以下条件，即α1>α2> =α3。

60. 发明授权

US5843479A Bisacodyl dosage form with multiple enteric polymer coatings for colonic delivery 失效
标题翻译：具有用于结肠递送的多种肠溶性聚合物涂层的双反乳糖剂型
公开(公告)号：US5843479A
公开(公告)日：1998-12-01
申请号：US728945
申请日：1996-10-11
申请人： Gary Robert Kelm , Koji Kondo , Akio Nakajima
发明人： Gary Robert Kelm , Koji Kondo , Akio Nakajima
IPC分类号： A61K9/14 , A61K9/28 , A61K9/32 , A61K9/48 , A61K9/50 , A61K31/44 , A61K31/4402 , A61K47/30 , A61K47/38 , A61K47/48 , A61P1/10 , A61K9/34 , A61K9/36
CPC分类号： A61K9/145 , A61K31/44 , A61K31/4402 , A61K47/48969 , A61K9/146 , A61K9/2846 , A61K9/2886 , A61K9/4808 , A61K9/4891 , A61K9/5078 , B82Y5/00
摘要： The present invention relates to a pharmaceutical composition in a unit dosage form for peroral administration in a human or lower animal, having a gastrointestinal tract comprising a small intestine and a colon with a lumen therethrough having an inlet to the colon from the small intestine, comprising: a. a safe and effective amount of rapidly dissolving bisacodyl incorporated into a compressed, bi-convex tablet, with a maximum diameter of about 4 mm to about 10 mm; b. a non-pH dependent smoothing coat applied to the tablet to provide a smooth tablet surface free from edges and sharp curves; and c. an enteric polymer coating material comprising at least one inner coating layer and only one outer coating layer; wherein the rapidly dissolving bisacodyl is released at a point near the inlet to, or within the colon; each of the inner coating layer(s) is an enteric polymer that begins to dissolve in an aqueous media at a pH between about 5 to about 6.3; and the outer coating layer is an enteric polymer that begins to dissolve in an aqueous media at a pH between about 6.8 to about 7.2.
摘要翻译：本发明涉及一种用于人或低等动物口服给药的单位剂量形式的药物组合物，其具有胃肠道，该胃肠道包含小肠和结肠与其中具有从小肠到结肠入口的结肠，包括：一个。将安全有效量的快速溶解的双醋酸掺入压缩的双凸片中，最大直径为约4mm至约10mm; b。施加到片剂上的非pH依赖性平滑涂层以提供没有边缘和锋利曲线的光滑片剂表面; 和c。肠溶性聚合物涂层材料，其包含至少一个内涂层和仅一个外涂层; 其中快速溶解的双醋酸在靠近入口处或结肠内的点释放; 每个内部涂层是在pH约5至约6.3之间开始溶解于水性介质中的肠溶性聚合物; 并且外涂层是在约6.8至约7.2之间的pH下开始溶解于水性介质中的肠溶性聚合物。

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