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51. 发明授权

US08237359B2 Display apparatus 有权
标题翻译：显示装置
公开(公告)号：US08237359B2
公开(公告)日：2012-08-07
申请号：US12490673
申请日：2009-06-24
申请人： Takaaki Higashida , Yoshie Iwane , Hisao Nagai , Kazuhiro Nishikawa , Hiroshi Hayata
发明人： Takaaki Higashida , Yoshie Iwane , Hisao Nagai , Kazuhiro Nishikawa , Hiroshi Hayata
IPC分类号： H01J1/62
CPC分类号： H01L27/3253 , G09G3/3225 , G09G2300/023 , G09G2300/0426 , G09G2300/0443 , G09G2300/0452 , H01L27/3211
摘要： There is provided a display apparatus configured by stacking a drive circuit substrate and a light-emitting substrate. Electrodes of the substrates are accurately aligned to be electrically connected to each other. A display apparatus is configured by stacking a drive circuit substrate having a drive circuit and a light-emitting substrate having a light-emitting unit including a pixel electrode to cause the drive circuit substrate and the light-emitting substrate to face each other, wherein on a stacked plane between the drive circuit substrate and the light-emitting substrate, an intermediate electrode connected to the light-emitting unit of the light-emitting substrate and a connection electrode connected to the drive circuit and the drive circuit substrate are electrically connected to each other, and the intermediate electrode is elongated in a direction parallel to or perpendicular to a longitudinal direction of the pixel electrode on the stacked plane.
摘要翻译：提供了一种通过堆叠驱动电路基板和发光基板而构成的显示装置。基板的电极被精确对准以彼此电连接。显示装置通过堆叠具有驱动电路的驱动电路基板和具有包括像素电极的发光单元的发光基板来使驱动电路基板和发光基板彼此面对，其中，在驱动电路基板和发光基板之间的层叠平面，连接到发光基板的发光单元的中间电极和连接到驱动电路和驱动电路基板的连接电极电连接到每个另一方面，并且中间电极在与堆叠平面上的像素电极的纵向方向平行或垂直的方向上伸长。

52. 发明授权

US07910507B2 Glass ceramic material for plasma display 失效
标题翻译：用于等离子体显示的玻璃陶瓷材料
公开(公告)号：US07910507B2
公开(公告)日：2011-03-22
申请号：US12520374
申请日：2007-12-20
申请人： Kazuhiro Nishikawa , Koji Tominaga
发明人： Kazuhiro Nishikawa , Koji Tominaga
IPC分类号： C03C8/22 , C03C4/04
CPC分类号： H01J11/34 , C03C8/22 , C03C8/24 , H01J5/04
摘要： There is provided a glass ceramic material for plasma display, in which glass fine grains (A) having a softening point of 570-640° C. are in 40-70 wt %, and glass fine grains (B) having a softening point of 480-540° C. are in 30-60 wt %, the glass ceramic material for plasma display being characterized in that the glass fine grains (A) comprise 2-12 wt % of SiO2, 50-58 wt % of B2O3, 10-20 wt % of Al2O3, 0-6 wt % of ZnO, 0-2.8 wt % of Li2O, and 10-22 wt % of at least one selected from MgO, CaO, SrO and BaO and that refractive index of the glass fine grains (A) is 1.53-1.56.
摘要翻译：提供了一种用于等离子显示器的玻璃陶瓷材料，其中软化点为570-640℃的玻璃细晶粒（A）为40-70重量％，玻璃细晶粒（B）的软化点为 480-540℃为30-60重量％，用于等离子体显示的玻璃陶瓷材料的特征在于，玻璃细晶粒（A）包含2-12重量％的SiO 2，50-58重量％的B 2 O 3，10 -20重量％的Al 2 O 3，0-6重量％的ZnO，0-2.8重量％的Li 2 O和10-22重量％的选自MgO，CaO，SrO和BaO中的至少一种，并且玻璃的折射率精细颗粒（A）为1.53-1.56。

53. 发明授权

US07768795B2 Electronic circuit device, electronic device using the same, and method for manufacturing the same 有权
标题翻译：电子电路装置，使用该电子装置的电子装置及其制造方法
公开(公告)号：US07768795B2
公开(公告)日：2010-08-03
申请号：US11660515
申请日：2005-08-31
申请人： Daisuke Sakurai , Masahiro Ono , Kazuhiro Nishikawa
发明人： Daisuke Sakurai , Masahiro Ono , Kazuhiro Nishikawa
IPC分类号： H01R12/16
CPC分类号： H01L25/18 , G11C5/04 , H01L23/5386 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/92 , H01L24/96 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2224/24137 , H01L2224/32145 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/01078 , H01L2924/15331 , H05K1/185 , H05K1/189 , H05K3/4614
摘要： Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.
摘要翻译：电子电路装置100被构造成使得通过将由第一树脂片制成的基板模块与嵌入其中的电子部件（190）组成的基板模块单元插入到包括连接端子（120）的壳体（150）中，控制电路（130）和第一布线图案（140），其中基板模块彼此电连接和机械连接。该电子电路装置（100）分配母基板。此外，通过减少衬底模块，可以将具有大量衬底模块的衬底模块单元堆叠在有限的封装空间中，从而安装更大的存储容量和更高的功能。

54. 发明申请

US20100167908A1 DIELECTRIC PORCELAIN COMPOSITION FOR USE IN ELECTRONIC DEVICES 有权
标题翻译：用于电子设备的电介质组合物
公开(公告)号：US20100167908A1
公开(公告)日：2010-07-01
申请号：US11993722
申请日：2005-06-24
申请人： Tomoyuki Tada , Kazuhiro Nishikawa , Kazuya Toji , Kazuhiro Kura , Takeshi Shimada
发明人： Tomoyuki Tada , Kazuhiro Nishikawa , Kazuya Toji , Kazuhiro Kura , Takeshi Shimada
IPC分类号： C04B35/465
CPC分类号： H01B3/12 , C01G23/002 , C01P2002/50 , C01P2002/72 , C01P2006/32 , C01P2006/40 , C04B35/465 , C04B35/6262 , C04B35/62695 , C04B2235/3208 , C04B2235/3217 , C04B2235/3222 , C04B2235/3224 , C04B2235/3232 , C04B2235/3286 , C04B2235/5436 , C04B2235/608 , C04B2235/77 , C04B2235/786 , C04B2235/80
摘要： The invention intends to provide a dielectric porcelain composition for use in electronic devices, in which the relative dielectric constant εr is high, the Qf value is high and, the temperature coefficient τf can be controlled while maintaining the temperature coefficient τf at the resonant frequency small and the Qf value high. According to the invention, when, in an LnAlO3—CaTiO3-based dielectric porcelain composition, a molar ratio of LnAlO3 and CaTiO2 is optimized and Al is substituted by a slight amount of Ga, a structure that has an LnAlO3—CaTiO3 solid solution as a main phase and a solid solution of Al—Ga-based oxide as a secondary phase and does not substantially contain α-Al2O3 in the structure can be obtained, and the temperature coefficient τf can be controlled while maintaining the temperature coefficient τf at the resonant frequency small and the Qf value high.
摘要翻译：本发明提供一种用于电子器件的电介质瓷组合物，其中相对介电常数ε高，Qf值高，并且可以控制温度系数τf，同时保持谐振时的温度系数τf 频率小，Qf值高。根据本发明，当在基于LnAlO3-CaTiO3的电介质瓷组合物中，优化LnAlO 3和CaTiO 2的摩尔比并且Al被少量的Ga取代时，具有LnAlO 3 -CaTiO 3固溶体作为主相和作为第二相的Al-Ga类氧化物的固溶体，并且在该结构中基本上不含有α-Al 2 O 3，并且可以在将温度系数τf保持在谐振频率的同时控制温度系数τf 小，Qf值高。

55. 发明授权

US07613010B2 Stereoscopic electronic circuit device, and relay board and relay frame used therein 失效
标题翻译：立体电子电路装置，其中使用的继电器板和继电器框架
公开(公告)号：US07613010B2
公开(公告)日：2009-11-03
申请号：US10985325
申请日：2004-11-10
申请人： Masahiro Ono , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
发明人： Masahiro Ono , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
IPC分类号： H05K1/11
CPC分类号： H05K1/183 , H01L23/5385 , H01L25/0652 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2924/09701 , H01L2924/15156 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K1/145 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09036 , H05K2201/10446 , H05K2201/10636 , H05K2201/10674 , H05K2203/1572 , Y02P70/611 , H01L2924/00012
摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.
摘要翻译：立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。

56. 发明授权

US07376318B2 Circuit board and its manufacturing method 有权
标题翻译：电路板及其制造方法
公开(公告)号：US07376318B2
公开(公告)日：2008-05-20
申请号：US11653891
申请日：2007-01-17
申请人： Norihito Tsukahara , Kazuhiro Nishikawa
发明人： Norihito Tsukahara , Kazuhiro Nishikawa
IPC分类号： G02B6/10
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L2224/16 , H01L2224/24226 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/095 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/185 , H05K3/4664 , H05K2201/0187 , H05K2203/0568 , Y10T29/49124 , Y10T29/49126 , Y10T29/53874 , H01L2924/00
摘要： A circuit board comprises a base film that is a base layer, a first conductive circuit manufactured by hardening conductive paste material formed in a predetermined shape on the base film, a first insulating layer manufactured by hardening insulating paste material formed on the base film and the first conductive circuit, and a second conductive circuit manufactured by hardening conductive paste material in a predetermined shape on the first insulating layer, wherein an electronic part built-in by the first insulating layer and second insulating layer is connected to the second conductive circuit, and the first conductive circuit is connected to the second conductive circuit through a via hole.
摘要翻译：电路板包括作为基底层的基膜，通过在基膜上硬化形成为预定形状的导电糊料材料制成的第一导电电路，通过硬化形成在基膜上的绝缘膏材料而形成的第一绝缘层和第一导电电路和通过在第一绝缘层上硬化具有预定形状的导电糊料材料制成的第二导电电路，其中由第一绝缘层和第二绝缘层内置的电子部件连接到第二导电电路，以及第一导电电路通过通孔连接到第二导电电路。

57. 发明申请

US20080094793A1 Electronic Circuit Device, Electronic Device Using the Same, and Method for Manufacturing the Same 有权
标题翻译：电子电路装置，使用其的电子装置及其制造方法
公开(公告)号：US20080094793A1
公开(公告)日：2008-04-24
申请号：US11660515
申请日：2005-08-31
申请人： Daisuke Sakurai , Masahiro Ono , Kazuhiro Nishikawa
发明人： Daisuke Sakurai , Masahiro Ono , Kazuhiro Nishikawa
IPC分类号： H05K5/00 , H01L21/52
CPC分类号： H01L25/18 , G11C5/04 , H01L23/5386 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/92 , H01L24/96 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2224/24137 , H01L2224/32145 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/01078 , H01L2924/15331 , H05K1/185 , H05K1/189 , H05K3/4614
摘要： Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.
摘要翻译：电子电路装置100被构造成使得通过将由第一树脂片制成的基板模块与嵌入其中的电子部件（190）组成的基板模块单元插入到包括连接端子（120）的壳体（150）中，控制电路（130）和第一布线图案（140），其中基板模块彼此电连接和机械连接。该电子电路装置（100）分配母基板。此外，通过减少衬底模块，可以将具有大量衬底模块的衬底模块单元堆叠在有限的封装空间中，从而安装更大的存储容量和更高的功能。

58. 发明授权

US07297876B2 Circuit board and method of manufacturing the same 失效
标题翻译：电路板及其制造方法
公开(公告)号：US07297876B2
公开(公告)日：2007-11-20
申请号：US10918274
申请日：2004-08-13
申请人： Daisuke Sakurai , Norihito Tsukahara , Kazuhiro Nishikawa
发明人： Daisuke Sakurai , Norihito Tsukahara , Kazuhiro Nishikawa
IPC分类号： H05K1/16
CPC分类号： H05K1/185 , H01L21/4846 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/16 , H01L2224/76155 , H01L2224/82102 , H01L2224/97 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1815 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H05K1/095 , H05K3/107 , H05K3/1258 , H05K2201/0129 , H05K2201/09036 , H05K2201/10674 , H05K2203/1189 , Y10T29/4913 , H01L2224/82 , H01L2924/00
摘要： Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an electronic component into the resin film from a back-face of the film, thereby exposing electrodes of the component from a bottom of the grooves. Then cool the film for curing. Peel the film off the mold, then fill the grooves with conductive paste, and cure the paste for forming circuit patterns. The foregoing procedure allows bringing the electrodes positively into conduction with the circuit patterns of a circuit board incorporating the electronic component, and achieving a narrower pitch between routings of the circuit patterns.
摘要翻译：对热塑性树脂膜进行热处理，最终成为绝缘树脂层，并将膜压在膜上形成凹槽的模具上。接下来，从薄膜的背面将电子部件压配合到树脂薄膜中，从而从凹槽的底部露出部件的电极。然后将薄膜冷却固化。将薄膜剥离模具，然后用导电膏填充凹槽，并固化糊料以形成电路图案。上述过程允许将电极与包含电子部件的电路板的电路图案正向地导通，并且在电路图案的布线之间实现更窄的间距。

59. 发明授权

US07233069B2 Interconnection substrate and fabrication method thereof 失效
标题翻译：互连基板及其制造方法
公开(公告)号：US07233069B2
公开(公告)日：2007-06-19
申请号：US10947177
申请日：2004-09-23
申请人： Norihito Tsukahara , Kazuhiro Nishikawa , Daisuke Sakurai
发明人： Norihito Tsukahara , Kazuhiro Nishikawa , Daisuke Sakurai
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H05K3/247 , H01L2924/0002 , H05K1/095 , H05K2201/0266 , H05K2201/035 , H01L2924/00
摘要： An interconnection substrate includes: an interconnection layer region where at least a first conductor layer and a second conductor layer are vertically stacked in that order on a substrate, with the first conductor layer and second conductor layer containing conductive particles and a binder, wherein the first conductor layer and second conductor layer stacked in the interconnection layer region have conductive particles different in average particle size from each other. As a result, only an intended region can have low resistance.
摘要翻译：互连基板包括：互连层区域，其中至少第一导体层和第二导体层在基板上依次垂直堆叠，第一导体层和第二导体层包含导电颗粒和粘合剂，其中第一堆叠在互连层区域中的导体层和第二导体层具有彼此平均粒径不同的导电粒子。结果，只有预期的区域可以具有低电阻。

60. 发明授权

US07180007B2 Electronic circuit device and its manufacturing method 失效
标题翻译：电子电路器件及其制造方法
公开(公告)号：US07180007B2
公开(公告)日：2007-02-20
申请号：US10860653
申请日：2004-06-04
申请人： Kazuhiro Nishikawa , Norihito Tsukahara , Masayuki Okano
发明人： Kazuhiro Nishikawa , Norihito Tsukahara , Masayuki Okano
IPC分类号： H05K1/09
CPC分类号： H05K3/321 , H01L2224/16225 , H01L2224/29012 , H01L2224/32225 , H01L2224/73103 , H01L2224/73204 , H01L2224/83192 , H01L2924/01322 , H05K1/095 , H05K3/305 , H05K3/4664 , H05K2201/09881 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要： It comprises circuit board 10 with circuit pattern 2 formed by conductive resin paste on resin substrate 1, surface-mounted type electronic components 30, 40 arranged with electrode terminals with respect to the connecting region of circuit pattern 2, connecting member 3 formed from conductive resin paste for connecting the connecting region to the electrode terminal, and insulating adhesive 6 for bonding the electronic components 30, 40 and circuit board 10, which is lower in curing temperature than conductive resin paste and disposed in a space between circuit board 10 and electronic components 30, 40 between connecting regions.
摘要翻译：它包括具有由树脂基板1上的导电树脂膏形成的电路图案2的电路板10，相对于电路图案2的连接区域布置有电极端子的表面安装型电子部件30,4，由导电树脂形成的连接部件3 用于将连接区域连接到电极端子的粘合剂以及用于粘合固化温度低于导电树脂浆料并且设置在电路板10和电子部件之间的空间中的电子部件30,40和电路板10的绝缘粘合剂6 30，40连接区域之间。

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