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    • 52. 发明授权
    • Method of manufacturing memory devices
    • 制造存储器件的方法
    • US08399326B2
    • 2013-03-19
    • US12785500
    • 2010-05-24
    • Ta-Wei LinWen-Jer Tsai
    • Ta-Wei LinWen-Jer Tsai
    • H01L21/336H01L21/311
    • H01L29/7841H01L27/108H01L27/10802
    • Disclosed is a memory device and method of operation thereof. The memory device may include a source region and a drain region of a first dopant type, the source and drain regions contain a first semiconductor material; a body region of a second dopant type, the body region being sandwiched between the source and drain regions, the body comprising a second semiconductor material; a gate dielectric layer over at least the body region; and a gate comprising a conductive material over the gate dielectric layer. Specifically, one of the first semiconductor material and the second semiconductor material is lattice matched with the other of the first semiconductor material and the second semiconductor material and has an energy gap smaller than the energy gap of the other of the first semiconductor material and the second semiconductor material.
    • 公开了一种存储装置及其操作方法。 存储器件可以包括第一掺杂剂类型的源极区域和漏极区域,源极区域和漏极区域包含第一半导体材料; 所述主体区域被夹在所述源极和漏极区域之间,所述主体包括第二半导体材料; 至少在所述身体区域上的栅介电层; 以及包括在所述栅极介电层上的导电材料的栅极。 具体地,第一半导体材料和第二半导体材料之一与第一半导体材料和第二半导体材料中的另一个晶格匹配,并且具有小于第一半导体材料和第二半导体材料中的另一个的能隙的能隙 半导体材料。
    • 53. 发明授权
    • Memory device
    • 内存设备
    • US07750368B2
    • 2010-07-06
    • US12139418
    • 2008-06-13
    • Ta-Wei LinWen-Jer Tsai
    • Ta-Wei LinWen-Jer Tsai
    • H01L29/76H01L29/94
    • H01L29/7841H01L27/108H01L27/10802
    • Disclosed is a memory device and method of operation thereof. The memory device may include a source region and a drain region of a first dopant type, the source and drain regions contain a first semiconductor material; a body region of a second dopant type, the body region being sandwiched between the source and drain regions, the body comprising a second semiconductor material; a gate dielectric layer over at least the body region; and a gate comprising a conductive material over the gate dielectric layer. Specifically, one of the first semiconductor material and the second semiconductor material is lattice matched with the other of the first semiconductor material and the second semiconductor material and has an energy gap smaller than the energy gap of the other of the first semiconductor material and the second semiconductor material.
    • 公开了一种存储装置及其操作方法。 存储器件可以包括第一掺杂剂类型的源极区域和漏极区域,源极区域和漏极区域包含第一半导体材料; 所述主体区域被夹在所述源极和漏极区域之间,所述主体包括第二半导体材料; 至少在所述身体区域上的栅介电层; 以及包括在所述栅极介电层上的导电材料的栅极。 具体地,第一半导体材料和第二半导体材料之一与第一半导体材料和第二半导体材料中的另一个晶格匹配,并且具有小于第一半导体材料和第二半导体材料中的另一个的能隙的能隙 半导体材料。
    • 54. 发明申请
    • Dynamic Random Access Memory Cell and Manufacturing Method Thereof
    • 动态随机存取存储器单元及其制造方法
    • US20100035389A1
    • 2010-02-11
    • US12570147
    • 2009-09-30
    • Ta-Wei LinWen-Jer Tsai
    • Ta-Wei LinWen-Jer Tsai
    • H01L21/8242
    • H01L27/10802H01L21/84H01L27/10844H01L27/1203H01L29/7841
    • A dynamic random access memory cell and a manufacturing method thereof are provided. First, a substrate on which a bottom oxide layer and a semiconductor layer are formed is provided. The semiconductor layer is formed on the bottom oxide layer. Next, a gate is formed on the semiconductor layer. Then, the semiconductor layer is patterned to expose a portion of the bottom oxide layer. Afterwards, an insulation layer is formed at the side walls of the semiconductor layer, wherein the height of the insulation layer is shorter than that of the semiconductor layer, so that a gap is formed between the tops of the insulation layer and the semiconductor layer. Further, a doping layer covering the insulation layer and having the same height with the semiconductor layer is formed on the bottom oxide layer. The doping layer contacts the side walls of the semiconductor layer via the gap.
    • 提供了一种动态随机存取存储单元及其制造方法。 首先,提供形成有底部氧化物层和半导体层的基板。 半导体层形成在底部氧化物层上。 接下来,在半导体层上形成栅极。 然后,对半导体层进行图案化以暴露底部氧化物层的一部分。 之后,在半导体层的侧壁形成绝缘层,其中绝缘层的高度比半导体层的高度短,从而在绝缘层的顶部和半导体层之间形成间隙。 此外,在底部氧化物层上形成覆盖绝缘层并且与半导体层具有相同高度的掺杂层。 掺杂层经由间隙与半导体层的侧壁接触。
    • 56. 发明授权
    • Non-volatile memory and operating method thereof
    • 非易失性存储器及其操作方法
    • US06822910B2
    • 2004-11-23
    • US10248220
    • 2002-12-29
    • Wen-Jer TsaiChih-Chieh YehTao-Cheng Lu
    • Wen-Jer TsaiChih-Chieh YehTao-Cheng Lu
    • G11C1604
    • G11C16/10G11C16/0466
    • A non-volatile memory device is described, comprising a plurality of memory cells, a plurality of word lines, a plurality of drain lines, and a plurality of source lines, wherein two adjacent memory cells in a column constitute a cell pair, and all cell pairs are arranged in rows and columns. The two memory cells in each cell pair share a source region, and two adjacent cell pairs in a column share a drain region. The source regions and the gates of the memory cells in the same row are coupled to a source line and a word line, respectively, and the drain regions of the memory cells in the same column are coupled to a drain line.
    • 描述了一种非易失性存储器件,其包括多个存储器单元,多个字线,多个漏极线和多个源极线,其中列中的两个相邻的存储器单元构成一个单元对,并且全部 单元对以行和列排列。 每个单元对中的两个存储单元共享源区,并且列中的两个相邻单元对共享漏区。 相同行中的存储单元的源极区域和栅极分别耦合到源极线和字线,并且同一列中的存储器单元的漏极区域耦合到漏极线。
    • 59. 发明授权
    • Erase scheme for non-volatile memory
    • 非易失性存储器的擦除方案
    • US06614694B1
    • 2003-09-02
    • US10112707
    • 2002-04-02
    • Chih-Chieh YehWen-Jer TsaiTao-Cheng Lu
    • Chih-Chieh YehWen-Jer TsaiTao-Cheng Lu
    • G11C1604
    • G11C16/3404A61K31/365G11C16/0475G11C16/3418
    • A method of an erase scheme for a non-volatile memory cell. The non-volatile memory cell includes a substrate, source, drain with a channel region and a gate above the channel region separated by nonconducting charge-trapping material sandwiched between first and second insulating layers. The method includes the following steps. First, hot hole erase is performed to inject hot holes into the nonconducting charge-trapping material to eliminate first electrons trapped in the nonconducting charge-trapping material and causing some holes to remain in the second insulating layer. Finally, soft anneal is performed to inject second electrons to the second insulating layer to eliminate the holes left in the second insulating layer.
    • 一种用于非易失性存储单元的擦除方案的方法。 非易失性存储单元包括具有沟道区的衬底,源极,漏极以及夹在第一和第二绝缘层之间的由不导电的电荷俘获材料隔开的沟道区上方的栅极。 该方法包括以下步骤。 首先,进行热孔擦除以将热空穴注入到不导电的电荷捕获材料中,以消除捕获在不导电的电荷捕获材料中的第一电子,并使一些孔留在第二绝缘层中。 最后,进行软退火以将第二电子注入第二绝缘层以消除留在第二绝缘层中的孔。