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    • 51. 发明授权
    • Thin-film switching device having chlorine-containing active region and
methods of fabrication therefor
    • 具有含氯活性区域的薄膜开关器件及其制造方法
    • US5970325A
    • 1999-10-19
    • US858974
    • 1997-05-20
    • Jin JangKeun-soo LeeJong-hyun Choi
    • Jin JangKeun-soo LeeJong-hyun Choi
    • H01L21/205H01L21/336H01L29/786H01L29/78
    • H01L29/66765H01L21/02381H01L21/0245H01L21/02532H01L21/0262H01L29/78669
    • A thin-film switching device includes an active region including noncrystalline silicon, e.g., hydrogenated amorphous silicon, which includes chlorine distributed in a manner which produces a predetermined photoconductivity and a predetermined field-effect mobility in the active region. Preferably, the active region includes a plurality of hydrogenated amorphous silicon layers, at least one of which includes chlorine. In one embodiment, the plurality of hydrogenated amorphous silicon layers includes a hydrogenated amorphous silicon layer including between 0.1 ppm and 106 ppm chlorine. In another embodiment, the plurality of hydrogenated amorphous silicon layers includes a first hydrogenated amorphous silicon layer having a first chlorine concentration and a second hydrogenated amorphous silicon layer having a second chlorine concentration less than the first chlorine concentration. The first hydrogenated amorphous silicon layer includes 1 ppm to 105 ppm chlorine, and the second hydrogenated amorphous silicon layer includes less than 104 ppm chlorine. Related fabrication methods are also discussed.
    • 薄膜开关器件包括包括非晶硅(例如氢化非晶硅)的有源区,其包括以有效区域中产生预定光电导率和预定场效应迁移率的方式分布的氯。 优选地,有源区包括多个氢化非晶硅层,其中至少一个包括氯。 在一个实施例中,多个氢化非晶硅层包括含0.1ppm至106ppm氯的氢化非晶硅层。 在另一实施例中,多个氢化非晶硅层包括具有第一氯浓度的第一氢化非晶硅层和具有小于第一氯浓度的第二氯浓度的第二氢化非晶硅层。 第一氢化非晶硅层包括1ppm至105ppm的氯,第二氢化非晶硅层包括小于104ppm的氯。 还讨论了相关的制造方法。
    • 59. 发明授权
    • Method for fabricating thin film transistor using local oxidation and transparent thin film transistor
    • 使用局部氧化和透明薄膜晶体管制造薄膜晶体管的方法
    • US07442588B2
    • 2008-10-28
    • US11830010
    • 2007-07-30
    • Jin JangSe-Hwan KimYoun-Duck NamEung-Bum KimJi-Ho Hur
    • Jin JangSe-Hwan KimYoun-Duck NamEung-Bum KimJi-Ho Hur
    • H01L21/00
    • H01L29/7869
    • Disclosed is a method for fabricating a thin film transistor. Specifically, the method uses local oxidation wherein a portion of a transparent metal oxide layer is locally oxidized to be converted into a semiconductor layer so that the oxidized portion of the transparent metal oxide layer can be used as a channel region and the unoxidized portions of the transparent metal oxide layer can be used as source and drain electrodes.The method comprises the steps of forming a gate electrode on a substrate and forming a gate insulating layer thereon, forming a transparent metal oxide layer on the gate insulating layer, forming an oxidation barrier layer on the transparent metal oxide layer in such a manner that a portion of the transparent metal oxide layer positioned over the gate electrode is exposed, and locally oxidizing only the exposed portion of the transparent metal oxide layer to convert the exposed portion into a semiconductor layer.
    • 公开了一种制造薄膜晶体管的方法。 具体地,该方法使用局部氧化,其中透明金属氧化物层的一部分被局部氧化以转化为半导体层,使得透明金属氧化物层的氧化部分可以用作沟道区域,并且所述非氧化部分 透明金属氧化物层可以用作源极和漏极。 该方法包括以下步骤:在衬底上形成栅电极并在其上形成栅极绝缘层,在栅绝缘层上形成透明金属氧化物层,在透明金属氧化物层上形成氧化阻挡层, 露出位于栅电极上方的透明金属氧化物层的部分,仅局部氧化透明金属氧化物层的露出部分,将露出部分转换为半导体层。
    • 60. 发明授权
    • Polycrystalline silicon film containing Ni
    • 含Ni的多晶硅膜
    • US07339188B1
    • 2008-03-04
    • US09497508
    • 2000-02-04
    • Jin JangSeong-Jin Park
    • Jin JangSeong-Jin Park
    • H01L29/04
    • H01L21/02422H01L21/02488H01L21/02532H01L21/02667H01L21/02672H01L27/1277H01L27/1285H01L27/1296
    • The present invention is related to a polycrystalline silicon film containing Ni which is formed by crystallizing an amorphous silicon layer containing nickel. The present invention includes a polycrystalline silicon film wherein the polycrystalline film contains Ni atoms of which density ranges from 2×1017 to 5×1019 atoms/cm3 on average and comprises a plurality of needle-shaped silicon crystallites. In another aspect, the present invention includes a polycrystalline silicon film wherein the polycrystalline film contains Ni atoms of which density ranges from 2×1017 to 5×1019 atoms/cm3, comprises a plurality of needle-shaped silicon crystallites and is formed on an insulating substrate. Such a polysilicon film according to the present invention avoids metal contamination usually generated in a conventional method of metal induced crystallization.
    • 本发明涉及通过使包含镍的非晶硅层结晶而形成的含有Ni的多晶硅膜。 本发明包括多晶硅膜,其中多晶膜含有浓度范围为2×10 17至5×10 19原子/ cm 3的Ni原子。 并且包括多个针状硅微晶。 另一方面,本发明包括多晶硅膜,其中多晶膜含有密度为2×10 17至5×10 19原子/ cm 3的Ni原子 包括多个针状硅微晶,并形成在绝缘基板上。 根据本发明的这种多晶硅膜避免了通常以常规的金属诱导结晶方法产生的金属污染。