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    • 53. 发明申请
    • ELECTRICAL LAPPING GUIDE FOR FLARE POINT CONTROL AND TRAILING SHIELD THROAT HEIGHT IN A PERPENDICULAR MAGNETIC WRITE HEAD
    • 用于磁头控制和导航屏蔽的电气导线指南在一个完整的磁性写头
    • US20080144215A1
    • 2008-06-19
    • US11611824
    • 2006-12-15
    • Wen-Chien David HsiaoMing JiangVladimir NikitinAron PentekYi Zheng
    • Wen-Chien David HsiaoMing JiangVladimir NikitinAron PentekYi Zheng
    • G11B5/147G11B5/23
    • G11B5/3169G11B5/1278G11B5/3163G11B5/3166G11B5/3173G11B5/6005Y10T29/49021Y10T29/49039Y10T29/49043Y10T29/49044Y10T29/49046Y10T29/49048Y10T29/49052
    • A method for constructing a magnetic write head using an electrical lapping guide to carefully control critical dimensions dining a lapping operation used to define an air bearing surface. The lapping guide is photolithographically patterned in a common photolithographic step with another write head structure so that special relation between the lapping guide and critical dimensions of the write head structure can be carefully maintained. For example, the electrical lapping guide can be patterned in a common photolithographic step as the write pole so that the location of the flare point can he carefully controlled with respect to the location of the lapping guide. A stitched flare structure can also be built together with the electrical lapping guide, then a self-aligned shield can be further built over this stitched flare structure so that both flare point and shield throat can be controlled tightly together by this electrical lapping guide during lapping process. Similarly, the lapping guide can be formed in a common photolithographic step with a trailing shield, so that a critical dimension such as throat height of the trailing shield can be carefully controlled with respect to the electrical lapping guide.
    • 一种使用电研磨导向器构造磁性写入头的方法,以仔细控制关键尺寸,以用于界定空气轴承表面的研磨操作。 研磨导向器在具有另一写头结构的普通光刻步骤中光刻图案化,使得研磨引导件与写入头结构的关键尺寸之间的特殊关系可以被小心地保持。 例如,电研磨引导件可以以普通的光刻步骤图案化为写入极,使得可以相对于研磨导轨的位置仔细地控制闪光点的位置。 缝合的火炬结构也可以与电研磨导轨一起构建,然后可以在该缝合的火炬结构上进一步构建自对准的屏蔽,使得在研磨过程中这种电研磨引导件可以将喇叭口和屏蔽喉两者紧密地一起控制 处理。 类似地,研磨引导件可以在具有后挡板的普通光刻步骤中形成,使得可以相对于电研磨导轨小心地控制关键尺寸,例如后挡板的喉部高度。
    • 54. 发明申请
    • Process to open connection vias on a planarized surface
    • 在平坦化表面上打开连接通孔的过程
    • US20070245557A1
    • 2007-10-25
    • US11411555
    • 2006-04-25
    • Amanda BaerHamid BalamaneMichael FeldbaumMing JiangAron Pentek
    • Amanda BaerHamid BalamaneMichael FeldbaumMing JiangAron Pentek
    • H01K3/10
    • G11B5/3163G11B5/1278G11B5/3116Y10T29/49021Y10T29/49032Y10T29/49044Y10T29/49126Y10T29/49139Y10T29/49153Y10T29/49155Y10T29/49165Y10T29/49169
    • A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A substrate such as an alumina fill layer, magnetic shaping layer, etc. is formed with region having a contact pad formed therein. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over the substrate and is covered with a thick layer of alumina. The alumina can be applied by a high deposition rate process that does not form voids or seams in the alumina layer. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer. The mask can then be lifted off and an electrically conductive material can be deposited into the via. Forming the via by a subtractive method rather than by a liftoff process allows the alumina to be deposited in a manner that does not result in voids. The use of reactive ion milling allows the via to be well defined and formed with substantially vertical side walls rather than in a conical or outward spreading fashion as would be formed by other material removal processes such as wet etching.
    • 在用于垂直磁记录的诸如磁写头的结构上的氧化铝保护层中形成通孔的方法。 在其中形成有形成有接触垫的区域形成诸如氧化铝填充层,磁性成形层等的基板。 诸如磁极和/或磁性后屏蔽的结构形成在衬底之上,并被厚层氧化铝覆盖。 可以通过在氧化铝层中不形成空隙或接缝的高沉积速率工艺来施加氧化铝。 然后可以通过化学机械抛光工艺(CMP)将氧化铝层平坦化,然后在氧化铝层上形成诸如光致抗蚀剂掩模的掩模结构。 掩模结构形成有设置在接触垫上方的开口。 然后执行反应离子研磨机以除去在掩模中的开口处暴露的部分氧化铝层,从而在氧化铝层中形成通孔。 然后可以将掩模剥离,并且可以将导电材料沉积到通孔中。 通过减法法而不是通过剥离工艺形成通孔允许以不会导致空隙的方式沉积氧化铝。 使用反应离子研磨允许通孔被良好地限定并且形成有基本垂直的侧壁,而不是以其它材料去除工艺(例如湿蚀刻)形成的锥形或向外扩展方式。
    • 57. 发明授权
    • Method for manufacturing a perpendicular magnetic write head having a tapered write pole
    • 一种具有锥形写入极的垂直磁性写入头的制造方法
    • US08318031B2
    • 2012-11-27
    • US12748182
    • 2010-03-26
    • Aron PentekThomas J. A. RoucouxYi Zheng
    • Aron PentekThomas J. A. RoucouxYi Zheng
    • B44C1/22
    • G11B5/3163G11B5/1278G11B5/3116G11B5/3146G11B5/315
    • A method for manufacturing a magnetic write head having a write pole with a tapered leading edge and a tapered trailing edge. The method includes forming a non-magnetic bump player over a surface, forming a mask over the non-magnetic bump layer and performing a first ion milling to form a tapered back edge on the non-magnetic bump layer. A magnetic write pole material is then deposited over the surface and over the non-magnetic bump layer. Then a non-magnetic step structure is formed over the magnetic write pole material and an ion milling is performed to form a taper on the upper surface of the write pole. The write pole lateral dimensions can then be defined, and a non-magnetic bump formed over the tapered portion of the upper surface of the write pole. Another ion milling can then be performed to extend the taper of the surface of the write pole.
    • 一种用于制造具有带有锥形前缘和锥形后缘的写极的磁写头的方法。 所述方法包括在表面上形成非磁性碰撞播放器,在非磁性凸块层上形成掩模,并执行第一离子铣削以在非磁性凸块层上形成锥形后缘。 然后将磁性写入磁极材料沉积在表面上并在非磁性凸起层上方。 然后在磁性写入磁极材料上形成非磁性阶梯结构,并且执行离子铣削以在写入极的上表面上形成锥形。 然后可以限定写入极横向尺寸,并且在写入极的上表面的锥形部分上形成非磁性凸块。 然后可以执行另一种离子铣削来延伸写极的表面的锥度。