专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明授权

US08211325B2 Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applications 失效
标题翻译：使用固定研磨剂和高选择性浆料的组合来实现全金属平面度的工艺顺序用于预金属介电CMP应用
公开(公告)号：US08211325B2
公开(公告)日：2012-07-03
申请号：US12757767
申请日：2010-04-09
申请人： Jie Diao , Garlen C. Leung , Christopher Heung-Gyun Lee , Lakshmanan Karuppiah
发明人： Jie Diao , Garlen C. Leung , Christopher Heung-Gyun Lee , Lakshmanan Karuppiah
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00
CPC分类号： H01L21/31053 , B24B37/042 , B24B37/245 , H01L21/76229
摘要： A method and apparatus for polishing or planarizing a pre-metal dielectric layer by a chemical mechanical polishing process are provided. The method comprises providing a semiconductor substrate having feature definitions formed thereon, forming a pre-metal dielectric layer over the substrate, wherein the as-deposited pre-metal dielectric layer has an uneven surface topography, and planarizing the uneven surface topography of the pre-metal dielectric layer using chemical mechanical polishing techniques, wherein planarizing the uneven surface topography comprises polishing the pre-metal dielectric layer with a fixed abrasive polishing pad and a first polishing composition to remove a bulk portion of the pre-metal dielectric layer and achieve a first predetermined planarity, and polishing the pre-metal dielectric layer with a non-abrasive polishing pad and high selectivity slurry to remove a residual portion of the pre-metal dielectric and achieve a second predetermined planarity.
摘要翻译：提供了一种通过化学机械抛光工艺抛光或平坦化预金属介电层的方法和设备。该方法包括提供其上形成有特征定义的半导体衬底，在衬底上形成预金属介电层，其中所沉积的预金属介电层具有不平坦的表面形貌，并且平坦化前预处理电介质层的不平坦表面形貌，使用化学机械抛光技术的金属介电层，其中平坦化所述不平坦表面形貌包括用固定的研磨抛光垫和第一抛光组合物抛光所述预金属介电层，以去除所述金属前介电层的主体部分并实现第一预定的平面度，以及用非磨料抛光垫和高选择性浆料抛光预金属介电层，以去除前金属电介质的剩余部分并实现第二预定平面度。

52. 发明授权

US08014004B2 Determining physical property of substrate 有权
标题翻译：确定底物的物理性质
公开(公告)号：US08014004B2
公开(公告)日：2011-09-06
申请号：US12822096
申请日：2010-06-23
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
IPC分类号： G01B11/28
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译：确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。数据库中的每个光谱具有与之相关联的物理属性值。该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

53. 发明申请

US20110046918A1 METHODS AND APPARATUS FOR GENERATING A LIBRARY OF SPECTRA 审中-公开
标题翻译：用于生成谱图的方法和装置
公开(公告)号：US20110046918A1
公开(公告)日：2011-02-24
申请号：US12938307
申请日：2010-11-02
申请人： Abraham Ravid , Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David , Jun Qian , Sidney P. Huey , Ingemar Carlsson , Lakshmanan Karuppiah , Harry Q. Lee
发明人： Abraham Ravid , Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David , Jun Qian , Sidney P. Huey , Ingemar Carlsson , Lakshmanan Karuppiah , Harry Q. Lee
IPC分类号： G06F15/00 , G01B11/06 , G01B11/14
CPC分类号： G01N21/31 , G01N21/253 , H01L21/67161 , H01L21/67207 , H01L21/67253 , H01L21/67766
摘要： A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.
摘要翻译：描述了从用于处理产品晶片的参考基板产生库的方法。该方法包括在参考基板的多个明确定义的点处测量衬底特性，测量参考衬底的多个测量点处的光谱，存在比明确定义的点多的测量点，以及将测量的光谱与测量的衬底特性相关联。

54. 发明授权

US07444198B2 Determining physical property of substrate 有权
标题翻译：确定底物的物理性质
公开(公告)号：US07444198B2
公开(公告)日：2008-10-28
申请号：US11611640
申请日：2006-12-15
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , G01B11/02
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译：确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。数据库中的每个光谱具有与之相关联的物理属性值。该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

55. 发明申请

US20080138988A1 DETECTION OF CLEARANCE OF POLYSILICON RESIDUE 审中-公开
标题翻译：检测多晶硅残留物的清除
公开(公告)号：US20080138988A1
公开(公告)日：2008-06-12
申请号：US11952777
申请日：2007-12-07
申请人： Jeffrey Drue David , Jun Qian , Garrett Sin , Daxin Mao , Chris Heung-Gyun Lee , Sivakumar Dhandapani , Boguslaw A. Swedek , Dominic J. Benvegnu , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Jun Qian , Garrett Sin , Daxin Mao , Chris Heung-Gyun Lee , Sivakumar Dhandapani , Boguslaw A. Swedek , Dominic J. Benvegnu , Lakshmanan Karuppiah
IPC分类号： H01L21/302
CPC分类号： H01L21/3212 , H01L22/26
摘要： During polishing of a substrate, polysilicon can be removed from a surface of the substrate. Detecting an endpoint during polishing of polysilicon can include polishing the substrate having a polysilicon residue on an area of oxide area and optically detecting clearance of the polysilicon residue.
摘要翻译：在抛光衬底期间，可以从衬底的表面去除多晶硅。在研磨多晶硅期间检测端点可以包括在氧化物区域的区域上抛光具有多晶硅残渣的基板，并光学地检测多晶硅残渣的间隙。

56. 发明申请

US20080035474A1 APPARATUS FOR ELECTROPROCESSING A SUBSTRATE WITH EDGE PROFILE CONTROL 审中-公开
标题翻译：用于电镀具有边缘型材控制的基板的装置
公开(公告)号：US20080035474A1
公开(公告)日：2008-02-14
申请号：US11877356
申请日：2007-10-23
申请人： You Wang , Jie DIAO , Stan TSAI , Lakshmanan Karuppiah
发明人： You Wang , Jie DIAO , Stan TSAI , Lakshmanan Karuppiah
IPC分类号： C25B9/00
CPC分类号： B23H5/08 , C25D17/10 , C25D17/12 , C25D21/12
摘要： Embodiments of the invention generally provide methods and apparatuses for electroprocessing a substrate. In one embodiment, an apparatus for electrochemically processing the substrate includes a conductive processing surface adapted for processing a substrate thereon, and a polishing head for retaining the substrate against the processing surface. At least one drive mechanism provides relative motion between the conductive processing surface and the substrate. A first electrode is disposed below the conductive processing surface and is comprised of a first material. A second electrode is disposed radially inward of the first electrode and comprised of a second material.
摘要翻译：本发明的实施方案通常提供用于对基底进行电处理的方法和装置。在一个实施例中，用于电化学处理衬底的装置包括适于在其上处理衬底的导电处理表面和用于将衬底保持在处理表面上的抛光头。至少一个驱动机构在导电处理表面和基底之间提供相对运动。第一电极设置在导电处理表面下方并且由第一材料构成。第二电极设置在第一电极的径向内侧并由第二材料构成。

57. 发明申请

US20080020682A1 Method for conditioning a polishing pad 审中-公开
标题翻译：调整抛光垫的方法
公开(公告)号：US20080020682A1
公开(公告)日：2008-01-24
申请号：US11490883
申请日：2006-07-21
申请人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Jim Atkinson , Lakshmanan Karuppiah , Liang-Yuh Chen
发明人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Jim Atkinson , Lakshmanan Karuppiah , Liang-Yuh Chen
IPC分类号： B24B1/00
CPC分类号： B24B53/017
摘要： A method of conditioning processing pads increases the removal rate of conductive material from a substrate surface during polishing. In this method, the direction of rotation of the processing pad relative to the conditioning disc during conditioning is opposite the direction of rotation of the processing pad relative to the substrate during polishing.
摘要翻译：调整处理垫的方法在抛光期间增加导电材料从衬底表面的去除速率。在这种方法中，处理衬垫相对于调理盘在调节期间的旋转方向与抛光期间相对于衬底相对于处理垫的旋转方向。

58. 发明申请

US20070181442A1 Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process 审中-公开
标题翻译：在电化学机械衬底抛光过程中泡沫去除的方法和装置
公开(公告)号：US20070181442A1
公开(公告)日：2007-08-09
申请号：US11346891
申请日：2006-02-03
申请人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Lakshmanan Karuppiah
发明人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Lakshmanan Karuppiah
IPC分类号： B23H7/00
CPC分类号： B23H5/08 , B24B53/001 , B24B53/017 , C25F7/00
摘要： The embodiments of the invention generally relate to a method and apparatus for processing a substrate where reduced defect formation is desired. Embodiments of the invention may be beneficially practiced in chemical mechanical polishing and electrochemical mechanical polishing processes, among other processes where reduction in defect formation due to foam formation is desired. In one embodiment, a processing system for planarizing a substrate is provided that includes a platen, a pad disposed on the platen, a carrier head configured to retain the substrate against the pad while contacting an electronically conductive processing solution; and a foam removal assembly. The foam removal assembly is configured to remove foam from the electrically conductive processing solution, wherein a gap exists between a surface of the electrically conductive processing solution and a bottom edge of the foam removal assembly.
摘要翻译：本发明的实施例一般涉及用于处理需要减少缺陷形成的衬底的方法和装置。在化学机械抛光和电化学机械抛光工艺中，本发明的实施例以及其它需要减少形成泡沫的缺陷形成工艺也是有益的。在一个实施例中，提供了一种用于平坦化衬底的处理系统，其包括压板，设置在压板上的衬垫，构造成在接触电子导电处理溶液的同时将衬底保持抵靠衬垫的载体头; 和泡沫去除组件。泡沫去除组件被配置为从导电处理溶液中除去泡沫，其中在导电处理溶液的表面和泡沫去除组件的底部边缘之间存在间隙。

59. 发明申请

US20070151867A1 Apparatus and a method for electrochemical mechanical processing with fluid flow assist elements 审中-公开
标题翻译：用流体流动辅助元件进行电化学机械处理的装置和方法
公开(公告)号：US20070151867A1
公开(公告)日：2007-07-05
申请号：US11431231
申请日：2006-05-10
申请人： Yongqi Hu , Stan Tsai , Gerald Alonzo , Lakshmanan Karuppiah
发明人： Yongqi Hu , Stan Tsai , Gerald Alonzo , Lakshmanan Karuppiah
IPC分类号： B23H9/14 , C25F3/00 , B23H3/00
CPC分类号： C25F7/00 , B23H5/08 , B24B37/20 , Y10T29/49155 , Y10T29/49156
摘要： An apparatus and a method with fluid flow assist elements for electrochemical mechanical processing is provided in this invention. In one embodiment, the apparatus includes a first conductive layer having an upper surface adapted to contact a substrate, a second conductive layer disposed below the first conductive layer, an isolation layer disposed between the conductive layers, and a plurality of apertures, each having a first end formed through the first conductive layer and a second end formed through the second conductive layer, wherein the second ends of at least two apertures are laterally coupled by a channel.
摘要翻译：本发明提供了一种具有用于电化学机械加工的流体流动辅助元件的装置和方法。在一个实施例中，该装置包括具有适于接触基板的上表面的第一导电层，设置在第一导电层下方的第二导电层，设置在导电层之间的隔离层和多个孔，每个孔具有通过第一导电层形成的第一端和通过第二导电层形成的第二端，其中至少两个孔的第二端由通道横向耦合。

60. 发明申请

US20070108066A1 VOLTAGE MODE CURRENT CONTROL 审中-公开
标题翻译：电压模式电流控制
公开(公告)号：US20070108066A1
公开(公告)日：2007-05-17
申请号：US11553438
申请日：2006-10-26
申请人： Stan Tsai , Lakshmanan Karuppiah
发明人： Stan Tsai , Lakshmanan Karuppiah
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B24B37/042 , B24B49/10
摘要： Methods and apparatus for voltage-mode current control. A computer implemented method includes: (a) commencing a ECMP polishing step on a conductive film of a substrate; (b) setting a current output voltage of a voltage source, the current output voltage being set in accordance with a recipe for the ECMP polishing step; (c) measuring current flow through the conductive film; (d) calculating, based on the measured current flow, a current polishing rate; (e) determining whether an adjustment to the current output voltage is needed, the determining being based on a target polishing rate; and (f) when an adjustment is determined to be needed, calculating and effecting the adjustment to the current output voltage.
摘要翻译：电压模式电流控制的方法和装置。计算机实施方法包括：（a）在基板的导电膜上开始ECMP抛光步骤; （b）设定电压源的电流输出电压，根据ECMP研磨工序的配方设定电流输出电压; （c）测量通过导电膜的电流; （d）基于所测量的电流计算当前的抛光速率; （e）确定是否需要对当前输出电压的调整，所述确定基于目标抛光速率; 和（f）当确定需要调整时，计算并对当前输出电压进行调整。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式