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    • 51. 发明申请
    • Semiconductor constructions
    • 半导体结构
    • US20070117347A1
    • 2007-05-24
    • US11655386
    • 2007-01-17
    • Hongmei WangFred FishburnJanos FucskoT. AllenRichard LaneRobert HansonKevin Shea
    • Hongmei WangFred FishburnJanos FucskoT. AllenRichard LaneRobert HansonKevin Shea
    • H01L21/76
    • H01L21/76232
    • The invention includes methods of forming isolation regions. An opening can be formed to extend into a semiconductor material, and an upper periphery of the opening can be protected with a liner while a lower periphery is unlined. The unlined portion can then be etched to form a widened region of the opening. Subsequently, the opening can be filled with insulative material to form an isolation region. Transistor devices can then be formed on opposing sides of the isolation region, and electrically isolated from one another with the isolation region. The invention also includes semiconductor constructions containing an electrically insulative isolation structure extending into a semiconductor material, with the structure having a bulbous bottom region and a stem region extending upwardly from the bottom region to a surface of the semiconductor material.
    • 本发明包括形成隔离区域的方法。 可以形成开口以延伸到半导体材料中,并且可以用衬垫保护开口的上周边,而下边缘是无衬里的。 然后可以对无衬里部分进行蚀刻以形成开口的加宽区域。 随后,开口可以用绝缘材料填充以形成隔离区域。 晶体管器件然后可以形成在隔离区域的相对侧上,并且与隔离区域彼此电隔离。 本发明还包括包含延伸到半导体材料中的电绝缘隔离结构的半导体结构,其结构具有球形底部区域和从底部区域向上延伸到半导体材料表面的杆区域。
    • 53. 发明申请
    • Methods of implanting dopant into channel regions
    • 将掺杂剂注入通道区域的方法
    • US20060199340A1
    • 2006-09-07
    • US11406863
    • 2006-04-18
    • Hongmei WangKurt BeigelFred FishburnRongsheng Yang
    • Hongmei WangKurt BeigelFred FishburnRongsheng Yang
    • H01L21/336
    • H01L21/26513H01L21/324H01L21/823412H01L27/0811H01L27/088H01L29/66537H01L29/7833
    • The invention includes methods of forming channel region implants for two transistor devices simultaneously, in which a mask is utilized to block a larger percentage of a channel region location of one of the devices relative to the other. The invention also pertains to methods of forming capacitor structures in which a first capacitor electrode is spaced from a semiconductor substrate by a dielectric material, a second capacitor electrode comprises a conductively-doped diffusion region within the semiconductor material, and a capacitor channel region location is beneath the dielectric material and adjacent the conductively-doped diffusion region. An implant mask is formed to cover only a first portion of the capacitor channel region location and to leave a second portion of the capacitor channel region location uncovered. While the implant mask is in place, dopant is implanted into the uncovered second portion of the capacitor channel region location.
    • 本发明包括同时形成两个晶体管器件的沟道区域植入物的方法,其中掩模用于阻挡相对于另一个器件之一的较大百分比的沟道区域位置。 本发明还涉及形成电容器结构的方法,其中第一电容器电极通过电介质材料与半导体衬底隔开,第二电容器电极包括半导体材料内的导电掺杂扩散区,电容器通道区位置为 在介电材料的下方并与导电掺杂的扩散区相邻。 形成注入掩模以仅覆盖电容器沟道区位置的第一部分并且留下未覆盖的电容器沟道区位置的第二部分。 当植入掩模就位时,掺杂剂被注入到电容器通道区域位置的未覆盖的第二部分中。