专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明申请

US20090156084A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE 有权
标题翻译：发光装置及制造发光装置的方法
公开(公告)号：US20090156084A1
公开(公告)日：2009-06-18
申请号：US12304316
申请日：2007-06-13
申请人： Yasushi Yagi , Shingo Watanabe , Toshihisa Nozawa , Chuichi Kawamura , Kimihiko Yoshino , Tadahiro Ohmi
发明人： Yasushi Yagi , Shingo Watanabe , Toshihisa Nozawa , Chuichi Kawamura , Kimihiko Yoshino , Tadahiro Ohmi
IPC分类号： H01J9/00 , H05B33/10
CPC分类号： H01L51/001 , C23C14/12 , C23C14/28 , H01L51/56
摘要： Disclosed is a light emitting device manufacturing apparatus including a plurality of processing chambers for performing a substrate processing for forming, on a target substrate, a light emitting device having multiple layers including an organic layer, wherein each of the plurality of processing chambers is configured to perform a substrate process on the target substrate while maintaining the target substrate such that its device forming surface, on which the light emitting device is to be formed, is oriented toward a direction opposite to a direction of gravity.
摘要翻译：公开了一种发光器件制造设备，包括：多个处理室，用于执行用于在目标衬底上形成包括有机层的多层的发光器件的衬底处理，其中，所述多个处理室中的每一个被配置为在目标衬底上执行衬底处理，同时保持目标衬底，使得要在其上形成发光器件的器件形成表面朝向与重力方向相反的方向。

52. 发明申请

US20090070004A1 Fuel Injection Controller 失效
标题翻译：燃油喷射控制器
公开(公告)号：US20090070004A1
公开(公告)日：2009-03-12
申请号：US11887829
申请日：2006-04-05
申请人： Shingo Watanabe
发明人： Shingo Watanabe
IPC分类号： F02D41/30
CPC分类号： F02D41/22 , F02D41/221 , F02D41/222 , F02D41/2451 , F02D41/3845 , F02D2041/223 , F02D2041/224 , F02D2041/225 , F02D2200/0602 , F02D2200/0604
摘要： A fuel injection controller used for a fuel injection device that pumps high-pressure fuel to an accumulator and distributes the high-pressure fuel accumulated in the accumulator to injectors mounted in respective cylinders of an internal combustion engine calculates an input quantity and an output quantity of the fuel to and from the accumulator and monitors fuel pressure in the accumulator with a pressure sensor attached to the accumulator. The fuel injection controller has a determination device that determines whether there is a deviation between a sensing value Pcob1 of the pressure sensor and a corresponding value assumed from data Qpf applied to balance computation of the fuel input/output quantities and a storage part that stores the corresponding value Pcf2 based on the data Qpf applied to the balance computation and the sensing value Pcob1 of the pressure sensor and that enables subsequent reading out of the stored values. Thus, it can be determined whether the control is normal control or abnormal control based on the sensing signal of the fuel pressure sensor even if the characteristic deviation of the fuel pressure sensor arises due to incorrect wiring or the like.
摘要翻译：一种用于燃料喷射装置的燃料喷射控制器，其将高压燃料泵送到蓄能器并将积存在蓄电池中的高压燃料分配到安装在内燃机的各个气缸中的喷射器上，计算输入量和输出量燃料往返于蓄能器并且利用连接到蓄能器的压力传感器监测蓄能器中的燃料压力。燃料喷射控制器具有确定装置，其判定压力传感器的检测值Pcob1与应用于平衡燃料输入输出量的计算的数据Qpf所假定的对应值之间是否存在偏差，以及存储部基于应用于平衡计算的数据Qpf和压力传感器的感测值Pcob1的对应值Pcf2，并且能够随后读出存储的值。因此，即使由于布线不正确等导致燃料压力传感器的特性偏差，也可以基于燃料压力传感器的感测信号来判定控制是正常控制还是异常控制。

53. 发明申请

US20080211197A1 Metal gasket material plate and method for manufacturing the same 有权
标题翻译：金属垫片材料板及其制造方法
公开(公告)号：US20080211197A1
公开(公告)日：2008-09-04
申请号：US11965910
申请日：2007-12-28
申请人： Tsunehiko Abe , Tomokazu Nakanishi , Shingo Watanabe , Yoshiharu Takada , Ichiro Goto , Shinsuke Mochizuki , Kenji Okubo , Yasuaki Nagai
发明人： Tsunehiko Abe , Tomokazu Nakanishi , Shingo Watanabe , Yoshiharu Takada , Ichiro Goto , Shinsuke Mochizuki , Kenji Okubo , Yasuaki Nagai
IPC分类号： F16J15/08
CPC分类号： F16J15/0818 , F16J15/0825 , F16J15/122 , F16J2015/085 , F16J2015/0856 , F16J2015/0868 , Y10T428/31678
摘要： (Problems to be Solved)The present invention is intended to provide a metal gasket material plate with which exfoliation of the coating or blister can be prevented even if it is used in the presence of an electrolyte aqueous solution and which can be manufactured through a process without use of hexavalent chromium in consideration of the environment, etc.(Means for Solving the Problems)The present, invention relates to a metal gasket material plate comprising a metal plate 1 having a rubber layer 4 on one side or both sides thereof through an adhesive layer 3, wherein a rust-resistant pigment is added to both of said adhesive layer 3 and said rubber layer 4.
摘要翻译：（待解决的问题）本发明旨在提供一种金属垫片材料板，其即使在电解质水溶液的存在下使用也可以防止涂层或泡罩的剥离，并且可以通过工艺制造考虑到环境等而不使用六价铬。（用于解决问题的手段）本发明涉及一种金属垫片材料板，其包括金属板1，金属板1的一侧或两侧具有橡胶层4，通过粘合剂层3，其中将防锈颜料加入到所述粘合剂层3和所述橡胶层4中。

54. 发明授权

US07344785B2 Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same 有权
标题翻译：用于印刷电路板的铜箔，其制造方法和用于制造它的三价铬转化处理溶液
公开(公告)号：US07344785B2
公开(公告)日：2008-03-18
申请号：US11249452
申请日：2005-10-14
申请人： Muneo Kodaira , Shingo Watanabe , Gen Sasaki , Yasuyuki Ito , Katsumi Nomura
发明人： Muneo Kodaira , Shingo Watanabe , Gen Sasaki , Yasuyuki Ito , Katsumi Nomura
IPC分类号： B32B15/20
CPC分类号： C25D5/12 , C23C22/53 , C23C28/00 , C23C28/321 , C23C28/322 , C23C28/3225 , C23C28/345 , C23C2222/10 , C23C2222/20 , C25D5/48 , H05K3/384 , H05K3/389 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12451 , Y10T428/12493 , Y10T428/12569 , Y10T428/12785 , Y10T428/12792 , Y10T428/1291 , Y10T428/24917
摘要： A copper foil 1 comprises a roughened plating layer 2, a Ni—Co alloy plating layer 3, a zinc galvanized (underlying) layer 4, a chromate treatment layer 5, and a silane coupling treatment layer 6 on a surface to be bonded with a base material for a printed circuit board, and the chromate treatment layer 5 is formed by using a trivalent chromium conversion treatment solution containing 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH-value of 3.0 to 4.5. According to the present invention, a copper foil for a printed circuit board, a method for fabricating the same, and a trivalent chromium conversion treatment solution used for fabricating the same, which have an excellent controllability in Zn film forming amount and chromate film forming amount can be obtained.
摘要翻译：铜箔1包括在与...接合的表面上的粗糙化电镀层2，Ni-Co合金镀层3，镀锌（下层）层4，铬酸盐处理层5和硅烷偶联处理层6 用于印刷电路板的基材，铬酸盐处理层5通过使用含有70mg / L以上且小于500mg / L的三价铬离子转化为金属铬并具有pH值的三价铬转化处理溶液形成值为3.0〜4.5。根据本发明，用于印刷电路板的铜箔，其制造方法和用于制造它的三价铬转化处理溶液在Zn膜形成量和铬酸盐膜形成量方面具有优异的控制性可以获得。

55. 发明申请

US20070205109A1 Palladium plating solution 有权
标题翻译：钯镀液
公开(公告)号：US20070205109A1
公开(公告)日：2007-09-06
申请号：US11711516
申请日：2007-02-27
申请人： Shingo Watanabe , Junji Ohnishi , Hiroshi Wachi , Takayuki Sone
发明人： Shingo Watanabe , Junji Ohnishi , Hiroshi Wachi , Takayuki Sone
IPC分类号： C25D3/50
CPC分类号： C25D3/50 , C25D3/567 , C25D5/12 , H05K3/244
摘要： The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.
摘要翻译：本发明提供一种能够形成钯电镀膜的电镀液，其能够进一步提高由镀镍膜，镀钯膜和镀金膜构成的组合物的表面处理中的焊料特性，金属如铜。在含有可溶性钯盐和含有锗的液体组合物的导电盐的本发明的钯电镀溶液中，根据钯的还原值，可溶性钯盐的量为0.1g / l至50g / l 金属，导电盐的量为10g / l至400g / l，锗的量为0.1mg / l至1000mg / l。

56. 发明申请

US20070071999A1 Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil 有权
标题翻译：镀镍液及其制备方法，镀镍法和印刷线路板铜箔
公开(公告)号：US20070071999A1
公开(公告)日：2007-03-29
申请号：US11524781
申请日：2006-09-21
申请人： Yasuyuki Ito , Katsuyuki Matsumoto , Koji Nukaga , Yasuhiro Kusano , Kenji Yokomizo , Shingo Watanabe , Hiroyuki Ogawara , Katsumi Nomura
发明人： Yasuyuki Ito , Katsuyuki Matsumoto , Koji Nukaga , Yasuhiro Kusano , Kenji Yokomizo , Shingo Watanabe , Hiroyuki Ogawara , Katsumi Nomura
IPC分类号： C25D3/56 , C25D3/12
CPC分类号： C25D3/12 , C25D3/562 , H05K3/384 , H05K3/389 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10S428/935 , Y10T428/12438 , Y10T428/12472 , Y10T428/12569 , Y10T428/12611 , Y10T428/12792 , Y10T428/1291
摘要： A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.
摘要翻译：镍镀液制备方法的步骤为：将100g / L以上且小于200g / L的硫酸镍和10g / L以上且小于30g / L的柠檬酸钠或8 g / L以上且小于25g / L的柠檬酸，但不添加氯化镍; 并将所得溶液的pH调节至2以上且小于4.另一种镀镍溶液制备方法具有以下步骤：将100g / L以上且小于200g / L的硫酸镍溶解于水中，将10 g / L以上且小于30g / L的柠檬酸钠或8g / L以上且小于25g / L的柠檬酸，但不添加硼酸; 并将所得溶液的pH调节至2以上且小于4。

57. 发明申请

US20060257680A1 Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same 有权
标题翻译：用于印刷电路板的铜箔，其制造方法和用于制造它的三价铬转化处理溶液
公开(公告)号：US20060257680A1
公开(公告)日：2006-11-16
申请号：US11249452
申请日：2005-10-14
申请人： Muneo Kodaira , Shingo Watanabe , Gen Sasaki , Yasuyuki Ito , Katsumi Nomura
发明人： Muneo Kodaira , Shingo Watanabe , Gen Sasaki , Yasuyuki Ito , Katsumi Nomura
IPC分类号： C25D5/10 , B32B15/00
CPC分类号： C25D5/12 , C23C22/53 , C23C28/00 , C23C28/321 , C23C28/322 , C23C28/3225 , C23C28/345 , C23C2222/10 , C23C2222/20 , C25D5/48 , H05K3/384 , H05K3/389 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12451 , Y10T428/12493 , Y10T428/12569 , Y10T428/12785 , Y10T428/12792 , Y10T428/1291 , Y10T428/24917
摘要： A copper foil 1 comprises a roughened plating layer 2, a Ni—Co alloy plating layer 3, a zinc galvanized (underlying) layer 4, a chromate treatment layer 5, and a silane coupling treatment layer 6 on a surface to be bonded with a base material for a printed circuit board, and the chromate treatment layer 5 is formed by using a trivalent chromium conversion treatment solution containing 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH-value of 3.0 to 4.5. According to the present invention, a copper foil for a printed circuit board, a method for fabricating the same, and a trivalent chromium conversion treatment solution used for fabricating the same, which have an excellent controllability in Zn film forming amount and chromate film forming amount can be obtained.
摘要翻译：铜箔1包括在与...接合的表面上的粗糙化电镀层2，Ni-Co合金镀层3，镀锌（下层）层4，铬酸盐处理层5和硅烷偶联处理层6 用于印刷电路板的基材，铬酸盐处理层5通过使用含有70mg / L以上且小于500mg / L的三价铬离子转化为金属铬并具有pH值的三价铬转化处理溶液形成值为3.0〜4.5。根据本发明，用于印刷电路板的铜箔，其制造方法和用于制造它的三价铬转化处理溶液在Zn膜形成量和铬酸盐膜形成量方面具有优异的控制性可以获得。

58. 外观设计

USD424024S Quartz process tube 失效
公开(公告)号：USD424024S
公开(公告)日：2000-05-02
申请号：US74296
申请日：1997-07-24
申请人： Tetsuya Hanagata , Shingo Watanabe
设计人： Tetsuya Hanagata , Shingo Watanabe

59. 外观设计

USD423463S Quartz process tube 失效
公开(公告)号：USD423463S
公开(公告)日：2000-04-25
申请号：US74280
申请日：1997-07-24
申请人： Testuya Hanagata , Shingo Watanabe
设计人： Testuya Hanagata , Shingo Watanabe

60. 外观设计

USD406113S Processing tube for use in a semiconductor wafer heat processing apparatus 失效
公开(公告)号：USD406113S
公开(公告)日：1999-02-23
申请号：US74293
申请日：1997-07-24
申请人： Tetsuya Hanagata , Shingo Watanabe
设计人： Tetsuya Hanagata , Shingo Watanabe

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式