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51. 发明申请

US20070081769A1 OPTICAL GUIDE HOLDING MEMBER AND OPTICAL MODULE 失效
标题翻译：光学指南保持成员和光学模块
公开(公告)号：US20070081769A1
公开(公告)日：2007-04-12
申请号：US11531922
申请日：2006-09-14
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , G02B6/423 , G02B6/424 , G02B6/4274
摘要： The present invention provides an optical guide holding member having holding holes in which optical guides are fitted and held. The optical guide holding member has electric leads buried in a mounting surface on which the openings of the holding holes are opened. The electric leads are partly exposed on the mounting surface, and are also exposed on a side surface crossing the mounting surface. The optical semiconductor device is electrically connected to the exposed part of electric leads and is optically coupled with the optical guides.
摘要翻译：本发明提供了一种光导保持构件，其具有保持孔，光导装置安装并保持在该保持孔中。光导保持构件具有埋入保持孔的开口的安装面上的电引线。电引线部分地暴露在安装表面上，并且也暴露在与安装表面交叉的侧表面上。光学半导体器件电连接到电引线的暴露部分并与光导光学耦合。

52. 发明授权

US07154751B2 Interface module-mounted LSI package 失效
公开(公告)号：US07154751B2
公开(公告)日：2006-12-26
申请号：US10920365
申请日：2004-08-18
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/367 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/1305 , H01L2924/15311 , H01L2924/00
摘要： An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.

53. 发明申请

US20060038287A1 LSI package equipped with interface module, interface module and connection holding mechanism 失效
公开(公告)号：US20060038287A1
公开(公告)日：2006-02-23
申请号：US11203959
申请日：2005-08-16
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： H01L23/34
CPC分类号： G02B6/3817 , G02B6/389 , G02B6/423 , G02B6/4246 , G02B6/4292 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： I an LSI package, an interface module includes with an interposer having a signal processing LSI mounted thereon and has electric connection terminals for connection to a mounting board and a transmission line for transmitting a high-speed signal to an external wiring. An electric connection terminal is formed in each of the interposer and the interface module for electrically connecting the interposer and the interface module to each other by the mechanical contact, and a fixing holder is mounted for allowing the electric connection terminals to hold the electric connection between the interposer and the interface module. Thus, it is possible to suppress the increase in the manufacturing cost that is caused by the complex construction of the assembly.

54. 发明申请

US20050231911A1 Interface module-mounted LSI package 失效
标题翻译：接口模块安装的LSI封装
公开(公告)号：US20050231911A1
公开(公告)日：2005-10-20
申请号：US10920365
申请日：2004-08-18
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H05K7/20 , H01L21/00 , H01L21/50 , H01L23/36 , H01L23/367 , H01L23/467 , H01L23/498
CPC分类号： H01L23/467 , H01L23/367 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/1305 , H01L2924/15311 , H01L2924/00
摘要： An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.
摘要翻译：接口模块安装的LSI封装具有内置基板，其具有信号处理LSI，用于信号传输的接口模块，机械地连接到插入器并且电连接到信号处理LSI，以及与两个信号接触的散热器处理LSI和接口模块，并辐射信号处理LSI和接口模块的热量。 LSI封装具有间隙，其作为用于信号处理LSI的散热部分和用于接口模块的散热部分之间的热电阻部分。

55. 发明授权

US06687272B2 Semiconductor laser device 有权
标题翻译：半导体激光器件
公开(公告)号：US06687272B2
公开(公告)日：2004-02-03
申请号：US10244386
申请日：2002-09-17
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： H01S304
CPC分类号： H01S5/02292 , H01S5/02248 , H01S5/02272 , H01S5/0683
摘要： A semiconductor laser device comprising a mount substrate, a semiconductor laser element, and a total reflection mirror. The substrate includes an n-type Si substrate, an i-type Si layer deposited on a part of the Si substrate, and a p-type Si layer deposited on the Si layer. The Si substrate and Si layers constitute a pin photodiode. A part of the sides of the Si layers is a sloping surface. The laser element is mounted on the substrate and has a light-emitting surface opposing the sloping surface. The mirror is provided on a part of the sloping surface. It reflects and outputs a central part of a light beam emitted from the laser element. It guides the remaining part of the light beam to the photodiode.
摘要翻译：一种半导体激光装置，包括安装基板，半导体激光元件和全反射镜。衬底包括n型Si衬底，沉积在Si衬底的一部分上的i型Si层和沉积在Si层上的p型Si层。 Si衬底和Si层构成引脚光电二极管。 Si层的一部分侧面是倾斜表面。激光元件安装在基板上并且具有与倾斜表面相对的发光表面。镜子设在倾斜表面的一部分上。它反射并输出从激光元件发射的光束的中心部分。它将光束的剩余部分引导到光电二极管。

56. 发明授权

US06487224B1 Laser diode assembly 失效
标题翻译：激光二极管组件
公开(公告)号：US06487224B1
公开(公告)日：2002-11-26
申请号：US09408122
申请日：1999-09-29
申请人： Makoto Ohashi , Hideto Furuyama
发明人： Makoto Ohashi , Hideto Furuyama
IPC分类号： H01S500
CPC分类号： H01S5/02292 , G02B6/4214 , H01S5/02252 , H01S5/02284
摘要： A laser diode assembly capable of guiding a laser beam to a predetermined direction by utilizing a reflecting surface which has an arbitrary angle with respect to a sub-mount. The assembly includes a first unit, a second unit, and a laser diode. The first unit has a first surface and a mounting surface inclined to the first surface. The second unit is made of a semiconductor substrate and is on the first unit. The second unit has a second surface and a reflecting surface that coincides with a (111) surface of the semiconductor substrate inclined to the second surface. The laser diode is on the second surface and irradiates a laser beam to the reflecting surface along a direction parallel to the second surface. The second unit is on the first unit in a manner that the second surface is disposed parallel to the mounting surface. thereby realizing an inclined angle of the reflecting surface with respect to the first surface of 45 degrees.
摘要翻译：一种激光二极管组件，其能够通过利用相对于副底座具有任意角度的反射表面将激光束引导到预定方向。组件包括第一单元，第二单元和激光二极管。第一单元具有第一表面和与第一表面倾斜的安装表面。第二单元由半导体衬底制成并在第一单元上。第二单元具有与第二表面倾斜的半导体衬底的（111）表面重合的第二表面和反射表面。激光二极管位于第二表面上，并沿着平行于第二表面的方向将激光束照射到反射表面。第二单元以第二表面平行于安装表面的方式在第一单元上。从而实现反射面相对于第一表面45度的倾斜角度。

57. 发明授权

US5980119A Single-crystal component to be applied to optical module and its fabrication method 失效
标题翻译：应用于光模块的单晶元件及其制作方法
公开(公告)号：US5980119A
公开(公告)日：1999-11-09
申请号：US917892
申请日：1997-08-27
申请人： Hideto Furuyama
发明人： Hideto Furuyama
IPC分类号： H01L21/302 , B81C1/00 , F15C5/00 , G02B6/24 , G02B6/36 , G02B6/38 , G02B6/42 , H01L21/306 , G02B6/00
CPC分类号： G02B6/4249 , G02B6/3885 , G02B6/3652 , G02B6/3692
摘要： To provide a single crystal component comprising a single crystal substrate whose surface portion and depth direction are defined, a tapered groove formed on the surface portion of the single crystal substrate and having an opening and a cross-sectional shape gradually narrowed along the depth direction, and a protrusion formed on the groove nearby the surface portion of the single crystal substrate.
摘要翻译：为了提供包括限定了表面部分和深度方向的单晶衬底的单晶组件，形成在单晶衬底的表面部分上并且具有沿深度方向逐渐变窄的开口和横截面形状的锥形槽，以及形成在单晶基板的表面部附近的槽上的突起。

58. 发明授权

US5559918A Optical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layer 失效
标题翻译：光电半导体模块，其中密封的光学半导体器件连接到电布线层
公开(公告)号：US5559918A
公开(公告)日：1996-09-24
申请号：US379282
申请日：1995-01-27
申请人： Hideto Furuyama , Hiroshi Hamasaki , Tamon Kobayashi
发明人： Hideto Furuyama , Hiroshi Hamasaki , Tamon Kobayashi
IPC分类号： G02B6/38 , G02B6/42 , G02B6/00 , G02B6/36
CPC分类号： G02B6/3839 , G02B6/4231 , G02B6/4238 , G02B6/4248 , G02B6/4249 , G02B6/3838 , G02B6/4232
摘要： An optical semiconductor module includes a submount body having a groove buried with an insulator, an optical semiconductor device mounted on the submount body, a cap, arranged across the groove on the submount body and bonded and fixed to the submount body by a bonding member, for hermetically sealing the optical semiconductor device, and an electrical wiring layer arranged to extend from the outside of the cap on the submount body to the inside of the cap through the groove buried with the insulator. The electrical wiring layer is electrically connected to the optical semiconductor device.
摘要翻译：一种光半导体模块，包括：具有埋置有绝缘体的沟槽的基座主体，安装在所述基座主体上的光学半导体装置，盖子，布置在所述基座主体上的所述槽上，并且通过接合构件粘合固定到所述基座主体，用于气密地密封光学半导体器件;以及电布线层，其布置成通过所述绝缘体埋入的沟槽从所述底座主体上的盖的外部延伸到所述盖的内部。电配线层与光半导体装置电连接。

59. 发明授权

US5084410A Method of manufacturing semiconductor devices 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US5084410A
公开(公告)日：1992-01-28
申请号：US257519
申请日：1988-10-14
申请人： Kazuhiro Eguchi , Tetsuo Sadamasa , Hideto Furuyama , Yuzo Hirayama
发明人： Kazuhiro Eguchi , Tetsuo Sadamasa , Hideto Furuyama , Yuzo Hirayama
IPC分类号： H01L21/20 , H01L29/04 , H01L29/10 , H01L31/105 , H01L33/00 , H01S5/22 , H01S5/227 , H01S5/32 , H01S5/323
CPC分类号： H01L21/02639 , H01L21/02392 , H01L21/02543 , H01L21/02546 , H01L21/0262 , H01L29/045 , H01L29/1029 , H01L31/105 , H01L33/0062 , H01S5/2203 , H01S5/227 , H01S5/2201 , H01S5/3202 , H01S5/32391 , Y10S438/973
摘要： A semiconductor device which comprises a semiconductor substrate having a surface orientation substantially in a {100}-orientation is provided. On the semiconductor substrate, plural steps formed in a direction deviated substantially from a -direction by 5 degrees or more are formed. The steps, which are mesa and concave portions, are buried by plural semiconductor crystal layers grown by the use of MOCVD or the like. A method of manufacturing such a device is also provided.

60. 发明授权

US4958202A Semiconductor light-emitting device and method of manufacturing the same 失效
标题翻译：半导体发光装置及其制造方法
公开(公告)号：US4958202A
公开(公告)日：1990-09-18
申请号：US382345
申请日：1989-07-20
申请人： Jun'ichi Kinoshita , Motoyasu Morinaga , Hideto Furuyama , Yuzo Hirayama
发明人： Jun'ichi Kinoshita , Motoyasu Morinaga , Hideto Furuyama , Yuzo Hirayama
IPC分类号： H01S5/227
CPC分类号： H01S5/227 , H01S5/2277 , Y10S148/05 , Y10S148/051 , Y10S148/066 , Y10S148/095 , Y10T29/413
摘要： An active layer is formed on an n-type InP buffer layer of a substrate. A pair of strip-shaped grooves are formed into the active layer to divide it into a contract portion and side portions. A p-type InP cladding layer is deposited on the entire surface of the active layer and grooves. The cladding layer is selectively etched to form a mesa portion including the central active portion and expose the buffer layer. An insulating film is coated on the mesa portion and buffer layer, so that a semiconductor light-emitting device is manufactured.

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