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51. 发明申请

US20080067663A1 Wafer level chip package and a method of fabricating thereof 有权
标题翻译：晶圆级芯片封装及其制造方法
公开(公告)号：US20080067663A1
公开(公告)日：2008-03-20
申请号：US11522885
申请日：2006-09-18
申请人： Teck-Gyu Kang , Belgacem Haba , Guilian Gao
发明人： Teck-Gyu Kang , Belgacem Haba , Guilian Gao
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L24/16 , H01L21/4853 , H01L23/3114 , H01L23/49811 , H01L24/02 , H01L24/11 , H01L24/12 , H01L24/81 , H01L2224/02125 , H01L2224/0231 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/05548 , H01L2224/11334 , H01L2224/13023 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/19042 , H01L2224/29099
摘要： Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.
摘要翻译：公开了包括具有倾斜侧壁的立管和制造这种芯片封装的方法的晶片级芯片封装。本发明的晶片级芯片封装可有利地用于各种微电子组件中。

52. 发明申请

US20050279916A1 Image sensor package and fabrication method 有权
标题翻译：图像传感器封装及制作方法
公开(公告)号：US20050279916A1
公开(公告)日：2005-12-22
申请号：US11120711
申请日：2005-05-03
申请人： Teck-Gyu Kang , Michael Estrella , Jae Park , Kenneth Thompson , Craig Mitchell , Belgacem Haba
发明人： Teck-Gyu Kang , Michael Estrella , Jae Park , Kenneth Thompson , Craig Mitchell , Belgacem Haba
IPC分类号： H01L27/00 , H01L27/146 , H01L31/0203 , H04N5/225
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73253 , H01L2924/07811 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H04M2250/52 , H04N5/2253 , H01L2224/16225 , H01L2924/00012 , H01L2924/00
摘要： An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent one another. A package in accordance with the present invention reduces the amount of space in the package by allowing at least one surface of the image sensor controller and at least one surface of the image sensor to be directly attached or connected to one another. Electrical conductive material in the nature of anisotropic conductive materials is also preferably applied to the substrate in the form of an adhesive layer to allow for the image sensor controller and the image sensor to be in electrical communication with one another.
摘要翻译：公开了一种降低已知图像传感器封装的总体尺寸的图像传感器封装。图像传感器封装包括图像传感器和图像传感器控制器，其布置在基板上，使得图像传感器和图像传感器控制器的表面彼此直接相邻。根据本发明的包装通过允许图像传感器控制器的至少一个表面和图像传感器的至少一个表面直接附接或彼此连接来减少包装中的空间量。各向异性导电材料性质的导电材料也优选以粘合剂层的形式施加到基底上，以允许图像传感器控制器和图像传感器彼此电连通。

53. 发明授权

US07495179B2 Components with posts and pads 有权
公开(公告)号：US07495179B2
公开(公告)日：2009-02-24
申请号：US11166982
申请日：2005-06-24
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
IPC分类号： H05K1/16
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

54. 发明授权

US07368695B2 Image sensor package and fabrication method 有权
标题翻译：图像传感器封装及制作方法
公开(公告)号：US07368695B2
公开(公告)日：2008-05-06
申请号：US11120711
申请日：2005-05-03
申请人： Teck-Gyu Kang , Michael Estrella , Jae M. Park , Kenneth Robert Thompson , Craig S. Mitchell , Belgacem Haba
发明人： Teck-Gyu Kang , Michael Estrella , Jae M. Park , Kenneth Robert Thompson , Craig S. Mitchell , Belgacem Haba
IPC分类号： H01L27/00
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73253 , H01L2924/07811 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H04M2250/52 , H04N5/2253 , H01L2224/16225 , H01L2924/00012 , H01L2924/00
摘要： An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent one another. A package in accordance with the present invention reduces the amount of space in the package by allowing at least one surface of the image sensor controller and at least one surface of the image sensor to be directly attached or connected to one another. Electrical conductive material in the nature of anisotropic conductive materials is also preferably applied to the substrate in the form of an adhesive layer to allow for the image sensor controller and the image sensor to be in electrical communication with one another.
摘要翻译：公开了一种降低已知图像传感器封装的总体尺寸的图像传感器封装。图像传感器封装包括图像传感器和图像传感器控制器，其布置在基板上，使得图像传感器和图像传感器控制器的表面彼此直接相邻。根据本发明的包装通过允许图像传感器控制器的至少一个表面和图像传感器的至少一个表面直接附接或彼此连接来减少包装中的空间量。各向异性导电材料性质的导电材料也优选以粘合剂层的形式施加到基底上，以允许图像传感器控制器和图像传感器彼此电连通。

55. 发明授权

US07304376B2 Microelectronic assemblies with springs 有权
标题翻译：带弹簧的微电子组件
公开(公告)号：US07304376B2
公开(公告)日：2007-12-04
申请号：US10901407
申请日：2004-07-28
申请人： Belgacem Haba , Jae M. Park , Teck-Gyu Kang , Nicholas J. Colella
发明人： Belgacem Haba , Jae M. Park , Teck-Gyu Kang , Nicholas J. Colella
IPC分类号： H01L23/48
CPC分类号： H01L24/16 , H01L24/11 , H01L24/12 , H01L24/81 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/13655 , H01L2224/81143 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4913 , H01L2924/00015 , H01L2924/00014 , H01L2224/13099
摘要： A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, remote from the microelectronic element, to the panel. The springs can also serve as antennas so as to provide a miniaturized phased array.
摘要翻译：诸如半导体芯片的微电子元件具有弹簧，例如键合到触点的螺旋弹簧，使得弹簧用作与电路板的电连接。该单元可以容易地测试，并且可以通过将远离微电子元件的弹簧的远端粘合到面板上而被表面安装到电路板。弹簧也可以用作天线，以便提供小型化的相控阵列。

56. 发明申请

US20050284658A1 Components with posts and pads 有权
标题翻译：具有柱和垫的组件
公开(公告)号：US20050284658A1
公开(公告)日：2005-12-29
申请号：US11166982
申请日：2005-06-24
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae Park , Belgacem Haba
IPC分类号： H01L23/13 , H01L23/31 , H01L23/498 , H01L25/065 , H05K1/11 , H05K3/06 , H05K3/40
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译：封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48））暴露在介电层的外表面处，焊盘通过迹线连接到柱。电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。还公开了制造连接部件的方法。

57. 发明申请

US20050173805A1 Micro pin grid array with pin motion isolation 失效
标题翻译：微针栅格阵列，具有引脚运动隔离
公开(公告)号：US20050173805A1
公开(公告)日：2005-08-11
申请号：US10985119
申请日：2004-11-10
申请人： Philip Damberg , Belgacem Haba , David Tuckerman , Teck-Gyu Kang
发明人： Philip Damberg , Belgacem Haba , David Tuckerman , Teck-Gyu Kang
IPC分类号： H01L21/44 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/32 , H05K3/34
CPC分类号： H01L23/4985 , H01L23/49811 , H01L23/49838 , H01L2924/0002 , H05K1/118 , H05K3/326 , H05K3/3436 , H05K2201/0133 , H05K2201/0367 , H05K2201/09063 , H05K2201/09081 , H05K2201/10674 , H01L2924/00
摘要： A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are electrically interconnected with the microelectronic element and the flexible substrate includes a gap extending at least partially around at least one of the conductive terminals. In certain embodiments, the package includes a support layer, such as a compliant layer, disposed between the first face of the microelectronic element and the flexible substrate. In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.
摘要翻译：微电子封装包括具有面和触点的微电子元件，覆盖并与微电子元件的第一面间隔开的柔性基板，以及暴露在柔性基板的表面处的多个导电端子。导电端子与微电子元件电互连，并且柔性基板包括至少部分地围绕至少一个导电端子延伸的间隙。在某些实施例中，封装包括设置在微电子元件的第一面和柔性基板之间的支撑层，例如顺应层。在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

58. 发明申请

US20050040540A1 Microelectronic assemblies with springs 有权
标题翻译：带弹簧的微电子组件
公开(公告)号：US20050040540A1
公开(公告)日：2005-02-24
申请号：US10901407
申请日：2004-07-28
申请人： Belgacem Haba , Jae Park , Teck-Gyu Kang , Nicholas Colella
发明人： Belgacem Haba , Jae Park , Teck-Gyu Kang , Nicholas Colella
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L24/16 , H01L24/11 , H01L24/12 , H01L24/81 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/13655 , H01L2224/81143 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4913 , H01L2924/00015 , H01L2924/00014 , H01L2224/13099
摘要： A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, remote from the microelectronic element, to the panel. The springs can also serve as antennas so as to provide a miniaturized phased array.
摘要翻译：诸如半导体芯片的微电子元件具有弹簧，例如键合到触点的螺旋弹簧，使得弹簧用作与电路板的电连接。该单元可以容易地测试，并且可以通过将远离微电子元件的弹簧的远端粘合到面板上而被表面安装到电路板。弹簧也可以用作天线，以便提供小型化的相控阵列。

59. 发明授权

US09125333B2 Electrical barrier layers 有权
标题翻译：电阻层
公开(公告)号：US09125333B2
公开(公告)日：2015-09-01
申请号：US13183870
申请日：2011-07-15
申请人： Cyprian Uzoh , Vage Oganesian , Ilyas Mohammed , Belgacem Haba , Piyush Savalia , Craig Mitchell
发明人： Cyprian Uzoh , Vage Oganesian , Ilyas Mohammed , Belgacem Haba , Piyush Savalia , Craig Mitchell
IPC分类号： H05K1/03 , H05K1/09 , H05K3/40
CPC分类号： H01L24/05 , H01L2224/04042 , H01L2224/05083 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05169 , H01L2224/056 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01074 , H01L2924/013 , H05K1/09 , H05K3/4007 , H05K2201/032 , H05K2201/0326 , H05K2201/0338
摘要： Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.
摘要翻译：用于电气应用的阻隔层。在一些实施例中，阻挡层是层压阻挡层。在一些实施例中，阻挡层包括梯度阻挡层。

60. 发明授权

US08988895B2 Interconnection elements with encased interconnects 有权
标题翻译：具有封装互连的互连元件
公开(公告)号：US08988895B2
公开(公告)日：2015-03-24
申请号：US13215725
申请日：2011-08-23
申请人： Ilyas Mohammed , Belgacem Haba
发明人： Ilyas Mohammed , Belgacem Haba
IPC分类号： H05K7/04 , H01B7/00 , H01R43/00 , H01L21/50 , H05K3/46 , H01L23/498 , H01L21/48 , H01R12/52
CPC分类号： H05K3/4602 , H01L21/486 , H01L23/49827 , H01L23/49838 , H01L2224/16225 , H01L2924/15311 , H01R12/523 , H05K2201/10378 , H05K2203/0235 , Y10T29/49176
摘要： An interconnection element is disclosed that includes a plurality of drawn metal conductors, a dielectric layer, and opposed surfaces having a plurality of wettable contacts thereon. The conductors may include grains having lengths oriented in a direction between the first and second ends of the conductors. A dielectric layer for insulating the conductors may have first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surface. One or more conductors may be configured to carry a signal to or from a microelectronic element. First and second wettable contacts may be used to bond the interconnection element to at least one of a microelectronic element and a circuit panel. The wettable contacts may match a spatial distribution of element contacts at a face of a microelectronic element or of circuit contacts exposed at a face of component other than the microelectronic element.
摘要翻译：公开了一种互连元件，其包括多个拉制的金属导体，电介质层和在其上具有多个可湿接触点的相对表面。导体可以包括具有沿导体的第一和第二端之间的方向定向的长度的晶粒。用于绝缘导体的电介质层可以具有第一和第二相对表面，并且在第一和第二表面之间可以具有小于1毫米的厚度。一个或多个导体可以被配置为将信号传送到微电子元件或从微电子元件传送信号。可以使用第一和第二可湿触点将互连元件接合到微电子元件和电路板中的至少一个。可湿性触点可以匹配微电子元件的表面处的元件触点的空间分布或暴露在微电子元件以外的部件的表面处的电路触点。

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