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51. 发明申请

US20090065593A1 IC CARD AND AN ADAPTER FOR THE SAME 有权
标题翻译： IC卡和适配器
公开(公告)号：US20090065593A1
公开(公告)日：2009-03-12
申请号：US12261993
申请日：2008-10-30
申请人： Akira Higuchi , Hirotaka Nishizawa , Junichiro Osaka , Kenji Osawa
发明人： Akira Higuchi , Hirotaka Nishizawa , Junichiro Osaka , Kenji Osawa
IPC分类号： G06K19/06 , H01R33/00
CPC分类号： G06K19/07732 , G06K19/0719 , G06K19/07733 , G06K19/07741 , G06K19/07743 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H05K1/0268 , H05K1/117 , H01L2924/00014 , H01L2924/00
摘要： An IC card and card adapters are designed so that the IC card of a specific standard (e.g., MMC standard) is compatible with IC cards and terminals of other standards (e.g., MS card standard and USB terminal standard). In the IC card (MMC), a controller IC, which is connected to a flash memory, includes a voltage pull-down detector, a mode controller, a USB-mode interface controller, a MS-mode interface controller, and an MMC/SD-mode interface controller. The card adapters suffice to have component parts which are easy in formation and low in cost such as wiring lines and resistors. The voltage pull-down detector of the IC card detects the voltage pull-down caused by the resistors, and the mode controller selects the USB-mode interface controller, MS-mode interface controller or MMC/SD-mode interface controller so that the IC card becomes compatible with the corresponding IC card standard.
摘要翻译： IC卡和卡适配器被设计成使得特定标准（例如，MMC标准）的IC卡与IC卡和其他标准的终端（例如，MS卡标准和USB终端标准）兼容。在IC卡（MMC）中，连接到闪速存储器的控制器IC包括电压下拉检测器，模式控制器，USB模式接口控制器，MS模式接口控制器和MMC / SD模式接口控制器。卡适配器足以具有易于形成的部件，成本低廉，例如布线和电阻器。 IC卡的电压下拉检测器检测由电阻引起的电压下拉，模式控制器选择USB模式接口控制器，MS模式接口控制器或MMC / SD模式接口控制器，使IC 卡与相应的IC卡标准兼容。

52. 发明申请

US20080225498A1 ADAPTER FOR A MEMORY CARD AND A MEMORY CARD 审中-公开
标题翻译：适用于记忆卡和记忆卡
公开(公告)号：US20080225498A1
公开(公告)日：2008-09-18
申请号：US12125921
申请日：2008-05-23
申请人： JUNICHIRO OSAKO , Hirotaka Nishizawa , Kenji Osawa , Hideo Koike
发明人： JUNICHIRO OSAKO , Hirotaka Nishizawa , Kenji Osawa , Hideo Koike
IPC分类号： H05K1/14
CPC分类号： G06K19/07739 , G06K19/07743 , H01L2224/45144 , H01L2224/48091 , H01L2225/06562 , H01R12/7005 , H01R12/714 , H01R27/00 , H01R31/06 , H01R2201/20 , H05K1/117 , H05K1/142 , H05K3/326 , H01L2924/00014 , H01L2924/00
摘要： An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.
摘要翻译：公开了一种用于存储卡的适配器，其执行尺寸的改变，使得与多媒体卡相比，平面尺寸较小但几乎相等的存储卡可用作多媒体卡。在形成在适配器的背面的多个外部端子之后形成突出部分，由此，当适配器的前侧的厚度保持在多媒体卡的标准厚度时，适配器的后侧制成厚于前侧，并且用于与存储卡的外部端子接触的内部端子设置在适配器的厚部的内部。可以提高极小型存储卡的多功能性。

53. 发明申请

US20080153205A1 SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20080153205A1
公开(公告)日：2008-06-26
申请号：US12037588
申请日：2008-02-26
申请人： Hirotaka NISHIZAWA , Tamaki Wada , Kenji Osawa , Junichiro Osako , Michiaki Sugiyama
发明人： Hirotaka NISHIZAWA , Tamaki Wada , Kenji Osawa , Junichiro Osako , Michiaki Sugiyama
IPC分类号： H01L21/02
CPC分类号： H01L23/49855 , G06K19/07732 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/45144 , H01L2224/48091 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H05K1/145 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wires, a sealing resin for sealing the semiconductor chips and the wires, and a second wiring board having a plurality of contact points on one side and bonded to the top surface of the sealing resin on the other side, whereinthe upper end portions of the loops of the plurality of wires for electrically connecting the first wiring board to the semiconductor chips are exposed from the top surface of the sealing resin and electrically connected to the second wiring board.
摘要翻译：一种半导体器件，包括：一侧具有多个外部连接端子的第一布线板，安装在所述第一布线板的另一侧上并通过多根电线电连接到所述第一布线基板的半导体芯片，用于密封的密封树脂半导体芯片和电线，以及第二配线基板，其在一侧具有多个接触点，并且在另一侧与所述密封树脂的上表面接合，其中，所述多根电线的所述环的上端部，将第一配线基板与半导体芯片电连接，从密封树脂的顶面露出，并与第二配线基板电连接。

54. 发明授权

US07382045B2 IC card and method of manufacturing the same 有权
标题翻译： IC卡及其制造方法
公开(公告)号：US07382045B2
公开(公告)日：2008-06-03
申请号：US11423755
申请日：2006-06-13
申请人： Junichiro Osako , Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi
发明人： Junichiro Osako , Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi
IPC分类号： H01L23/02 , H01L23/12 , H01L23/28
CPC分类号： H05K3/284 , B29C45/14647 , B29C45/14655 , B29C45/1657 , B29C45/1671 , B29C2045/1673 , H01L21/563 , H01L21/565 , H01L23/3121 , H01L23/3135 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K2201/10159 , H05K2203/1316 , H05K2203/1572 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
摘要翻译：将IC体装载到由热固性树脂材料制成的壳体2上并用由热固性树脂材料制成的密封部分密封以一体化，由此制造IC卡。 IC体包括：在其背面形成有外部连接端子的布线基板; 半导体芯片，其负载在所述布线基板的表面上，并且经由互连电连接到所述外部连接端子; 以及由热固性树脂材料制成的密封部分以覆盖半导体芯片和接合线。密封部形成为使外部连接端子露出。本发明可以提高IC卡的强度，同时降低制造成本，提高可靠性。

55. 发明授权

US07325746B2 Memory card and semiconductor device 有权
标题翻译：存储卡和半导体器件
公开(公告)号：US07325746B2
公开(公告)日：2008-02-05
申请号：US10960995
申请日：2004-10-12
申请人： Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人： Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
IPC分类号： G06K19/06
CPC分类号： G06K19/07732 , G06K19/005 , G06K19/077 , G06K19/07749
摘要： An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface.
摘要翻译：通过抑制不对应于非接触式接口的存储卡的引脚布置和引脚形状的修改来提供用于非接触式接口的天线连接功能。具有存储卡的两个天线连接引脚被分成两个区域，其中一个电位引脚的尺寸最大并且用作间隔布置的分离引脚。由于两个天线连接引脚的尺寸与电源引脚的尺寸一样大，所以提供了两个天线连接引脚，并且通过使用具有尺寸的引脚区域来获得与非接触式接口对应的存储卡一个可能的电源引脚与存储卡不对应的非接触式接口。

56. 发明申请

US20080025003A1 MEMORY CARD 审中-公开
标题翻译：存储卡
公开(公告)号：US20080025003A1
公开(公告)日：2008-01-31
申请号：US11864073
申请日：2007-09-28
申请人： Hirotaka Nishizawa , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama , Takashi Totsuka
发明人： Hirotaka Nishizawa , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama , Takashi Totsuka
IPC分类号： H05K5/02
CPC分类号： G06K19/077 , G06K7/0021 , G06K13/06 , G06K19/07732 , G06K19/07741 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/73265 , H01L2225/06562 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , Y10S439/948 , H01L2224/48227 , H01L2924/00012
摘要： This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.
摘要翻译：本发明提供了一种超小型化的小型存储卡，其具有用于防止错误插入到存储卡插槽的机构。多功能存储卡由卡体和用于容纳卡体的盖组成。卡体由密封安装在布线基板主表面上的多个半导体芯片的模塑树脂制成。将卡体容纳在盖中，使布线基板的背面朝外。引导通道设置在盖的两个侧面，以防止卡被倒置插入。此外，在盖的后缘设置凸部，以防止卡以错误的方向插入。

57. 外观设计

USD556764S1 Memory card 有权
公开(公告)号：USD556764S1
公开(公告)日：2007-12-04
申请号：US29274768
申请日：2007-05-22
申请人： Hirotaka Nishizawa , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama , Takashi Totsuka , Yoshitaka Aoki , Keiichi Tsutsui
设计人： Hirotaka Nishizawa , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama , Takashi Totsuka , Yoshitaka Aoki , Keiichi Tsutsui

58. 发明授权

US07296754B2 IC card module 有权
标题翻译： IC卡模块
公开(公告)号：US07296754B2
公开(公告)日：2007-11-20
申请号：US11125197
申请日：2005-05-10
申请人： Hirotaka Nishizawa , Takashi Totsuka , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人： Hirotaka Nishizawa , Takashi Totsuka , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
IPC分类号： G06K19/06 , G06F13/00 , G06F12/00 , G06F13/28 , H05K7/10 , H04B1/38 , H04M1/00 , G11C11/34 , G11C16/04
CPC分类号： G06K19/07743 , G06K19/072 , G06K19/077 , G06K19/07732 , G06K19/07739 , H01L24/73 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06562 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K3/284 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An IC card module includes first external connecting terminals and second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10). The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals include signal terminals electrically separated from one another.
摘要翻译： IC卡模块包括暴露于卡片基板的一个表面的第一外部连接端子和第二外部连接端子，连接到第一外部连接端子的微型计算机，连接到第二外部连接端子的存储器控制器和连接到第二外部连接端口的易失性存储器到内存控制器。卡基板的形状和第一外部连接端子的布局基于ETSI TS 102 221 V4.4.0（2001-10）的插件UICC的标准。第二外部连接端子基于第一外部连接端子的标准设置在端子布局的最小范围之外。第一和第二外部连接端子包括彼此电分离的信号端子。

59. 发明授权

US07239011B2 Memory card with a cap having indented portions 有权
标题翻译：带有凹痕部分的盖子的存储卡
公开(公告)号：US07239011B2
公开(公告)日：2007-07-03
申请号：US11204047
申请日：2005-08-16
申请人： Tamaki Wada , Hirotaka Nishizawa , Masachika Masuda , Kenji Osawa , Junichiro Osako , Satoshi Hatakeyama , Haruji Ishihara , Kazuo Yoshizaki , Kazunori Furusawa
发明人： Tamaki Wada , Hirotaka Nishizawa , Masachika Masuda , Kenji Osawa , Junichiro Osako , Satoshi Hatakeyama , Haruji Ishihara , Kazuo Yoshizaki , Kazunori Furusawa
IPC分类号： H01L23/02 , H05K1/14
CPC分类号： G06K19/077 , G06K19/07732 , G06K19/07737 , G06K19/07739 , G06K19/07743 , G11C5/04 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/18 , H01L2224/05554 , H01L2224/05599 , H01L2224/45144 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/181 , H05K5/026 , H05K5/0282 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.
摘要翻译：在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为整体单元形成在可更换的方式。因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。

60. 发明申请

US20070001279A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20070001279A1
公开(公告)日：2007-01-04
申请号：US10550278
申请日：2004-09-24
申请人： Hirotaka Nishizawa , Kenji Osawa , Hideo Koike , Junichiro Osako , Tamaki Wada
发明人： Hirotaka Nishizawa , Kenji Osawa , Hideo Koike , Junichiro Osako , Tamaki Wada
IPC分类号： H01L23/02
CPC分类号： H01R12/721 , H01R12/7076 , H01R13/7036
摘要： A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. Thus, a time period till the cutoff of the power source is easily made comparatively long. The power source feeding terminals should preferably be extended onto the insertion side of the semiconductor device, but an extendible distance is sometimes liable to be limited. In order to ensure the necessary time period without changing the length and shape of the power source feeding terminals on the semiconductor device side, each of the power source feeding terminals may be formed so as to have two, front and rear touch points with the corresponding connector terminal of the host equipment side, but complicated improvements are necessitated for the construction of the connector terminal of the host equipment side. According to the semiconductor device, the time period required till the power source cutoff is easily ensured, and the complicated improvements are not required for the construction of the corresponding connector terminals of the host equipment side.
摘要翻译：半导体器件包括外部接口端子和处理电路，并且当可拆卸地设置在主机设备中时，其被馈送有工作电源。外部接口端子之间的电源馈送端子（VCC，VSS）足够长以至少在从外部接口端子之间分离提取检测端子至少预定的时间段内接触主机设备的相应端子，从主机设备的相应终端，它们形成为比提取检测终端在半导体器件的提取方向上更长。因此，直到电源截止的时间段容易变得相当长。电源馈电端子优选地延伸到半导体器件的插入侧，但是可延伸距离有时容易受到限制。为了在不改变半导体器件侧的电源馈送端子的长度和形状的情况下确保必要的时间周期，每个电源馈电端子可以形成为具有两个相应的前后接触点主机设备侧的连接器端子，但是主机设备侧的连接器端子的构造需要复杂的改进。根据半导体装置，能够容易地确保电源切断所需的时间，并且不需要对主机设备侧的对应的连接器端子的构造进行复杂的改进。

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