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    • 51. 发明授权
    • Semiconductor device
    • 半导体器件
    • US06700141B2
    • 2004-03-02
    • US09978847
    • 2001-10-17
    • Susumu IwamotoTatsuhiko FujihiraKatsunori UenoYasuhiko OnishiTakahiro Sato
    • Susumu IwamotoTatsuhiko FujihiraKatsunori UenoYasuhiko OnishiTakahiro Sato
    • H01L2936
    • H01L29/7811H01L29/0634H01L29/7802
    • A reliable super-junction semiconductor device is provided that facilitates relaxing the tradeoff relation between the on-resistance and the breakdown voltage and improving the avalanche withstanding capability under an inductive load. The super-junction semiconductor device includes an active region including a thin first alternating conductivity type layer and a heavily doped n+-type intermediate drain layer between first alternating conductivity type layer and an n++-type drain layer, and a breakdown withstanding region including a thick second alternating conductivity type layer. Alternatively, active region includes a first alternating conductivity type layer and a third alternating conductivity type layer between first alternating conductivity type layer and n++-type drain layer, third alternating conductivity type layer being doped more heavily than first alternating conductivity type layer.
    • 提供了可靠的超结半导体器件,其有助于放松导通电阻和击穿电压之间的折衷关系,并提高在感性负载下的雪崩耐受能力。 超结半导体器件包括在第一交替导电型层和n ++类漏极层之间包括薄的第一交替导电型层和重掺杂n +型中间漏极层的有源区,以及 包括厚的第二交替导电类型层的击穿耐受区域。 或者,有源区包括第一交替导电类型层和第n +型漏极之间的第一交变导电类型层和第三交变导电类型层,第三交变导电类型层比第一交变导电类型层更重掺杂 。
    • 52. 发明授权
    • Super-junction semiconductor device
    • 超结半导体器件
    • US06677643B2
    • 2004-01-13
    • US09811727
    • 2001-03-19
    • Susumu IwamotoTatsuhiko FujihiraKatsunori UenoYasuhiko OnishiTakahiro Sato
    • Susumu IwamotoTatsuhiko FujihiraKatsunori UenoYasuhiko OnishiTakahiro Sato
    • H01L2976
    • H01L21/26513H01L21/266H01L29/0634H01L29/1095H01L29/7802
    • A super-junction semiconductor is provided that facilitates easy mass-production thereof, reducing the tradeoff relation between the on-resistance and the breakdown voltage, obtaining a high breakdown voltage and reducing the on-resistance to increase the current capacity thereof. The super-junction semiconductor device includes a semiconductor chip having a first major surface and a second major surface facing in opposite to the first major surface; a layer with low electrical resistance on the side of the second major surface; a first alternating conductivity type layer on low resistance layer, and a second alternating conductivity type layer on the first alternating conductivity type layer. The first alternating conductivity type layer including regions of a first conductivity type and regions of a second conductivity type arranged alternately with each other. The second alternating conductivity type layer including regions of the first conductivity type and regions of the second conductivity type arranged alternately with each other. The spacing between the pn-junctions in the second alternating conductivity type layer is wider than the spacing between the pn-junctions in the first alternating conductivity type layer.
    • 提供了一种能够容易地进行批量生产,降低导通电阻和击穿电压之间的折衷关系的超结半导体,获得高的击穿电压并降低导通电阻以增加其电流容量。 超结半导体器件包括具有第一主表面和面向第一主表面的第二主表面的半导体芯片; 在第二主表面侧具有低电阻的层; 低电阻层上的第一交替导电类型层和第一交变导电类型层上的第二交变导电类型层。 第一交变导电类型层包括彼此交替排列的第一导电类型的区域和第二导电类型的区域。 包括第一导电类型的区域和第二导电类型的区域的第二交替导电类型层彼此交替排列。 第二交变导电类型层中的pn结之间的间隔比第一交变导电类型层中的pn结之间的间隔宽。
    • 53. 发明授权
    • Surface emitting semiconductor laser, and its fabrication method
    • 表面发射半导体激光器及其制造方法
    • US06639927B2
    • 2003-10-28
    • US09749820
    • 2000-12-28
    • Takahiro SatoHajime Sakata
    • Takahiro SatoHajime Sakata
    • H01S506
    • H01S5/18305H01S5/02272H01S5/02461H01S5/0422H01S5/0425H01S5/18311H01S5/423
    • A surface emitting semiconductor laser includes an active region formed on a growth substrate, upper and lower mirror layers that sandwich the active region to construct a vertical cavity, a selective oxidization layer, and a current injecting unit for injecting a current into the active region. The selective oxidization layer is selectively oxidized and insulated and is provided on the side of the active region opposite to the side of the substrate. In this structure, a post portion is formed by removing semiconductor material formed on the substrate down to an uppermost or halfway level of the selective oxidization layer while the selective oxidization layer is used as an etch stop layer, and the selective oxidization layer acts as both a current confinement layer for the current injection and an insulating layer for the current injecting unit.
    • 表面发射半导体激光器包括形成在生长衬底上的有源区,夹持有源区以构成垂直腔的上镜和下镜层,选择性氧化层和用于将电流注入到有源区中的电流注入单元。 选择性氧化层被选择性地氧化和绝缘,并且设置在与衬底侧相对的有源区的一侧。 在这种结构中,通过将形成在衬底上的半导体材料移除到选择性氧化层的最上层或中间层,同时选择性氧化层用作蚀刻停止层,并且选择性氧化层用作两者 用于电流注入的电流限制层和用于电流注入单元的绝缘层。
    • 56. 发明授权
    • Gas-type power breaker
    • 燃气式断路器
    • US06519128B1
    • 2003-02-11
    • US09639638
    • 2000-08-16
    • Goro NakamuraTakahiro Sato
    • Goro NakamuraTakahiro Sato
    • H01H7300
    • H01H39/00H01H2039/008
    • A reset knob 20 is mounted to a tip end of a shaft. A front cover 24 having a resilient locking arm 23 is mounted to the reset knob 20. The base body 15 is formed with an engaging projection 25. The resilient locking arm 23 and the engaging projection 25 are engaged with each other at an initial position of the shaft, thereby forming an engaging portion B between the base body 15 and the front cover 24. Therefore, it is possible to prevent the shaft from sliding by factor such as impact and vibration other than sublimation of the gas-starting agent, and to prevent the power circuit from being interrupted.
    • 复位旋钮20安装到轴的末端。 具有弹性锁定臂23的前盖24安装到复位旋钮20.基体15形成有接合突起25.弹性锁定臂23和接合突起25在初始位置处彼此接合 轴,从而在基体15和前盖24之间形成接合部分B.因此,除了气体起动剂的升华之外,可以防止轴因冲击和振动等因素而滑动,并且 防止电源电路中断。
    • 57. 发明授权
    • Methods of solidifying low-boiling-point hydrocarbon and handling the same, and regeneration thereof
    • 凝固低沸点烃并进行处理的方法及其再生
    • US06417415B1
    • 2002-07-09
    • US09539717
    • 2000-03-31
    • Hiroshi SakaguchiTomokazu YoshimuraRumiana TzonevaTakashi MasudaTakahiro SatoAkio Matsuda
    • Hiroshi SakaguchiTomokazu YoshimuraRumiana TzonevaTakashi MasudaTakahiro SatoAkio Matsuda
    • C07C720
    • C07C9/00Y10S585/932
    • Disclosed are a method of solidifying a low-boiling-point hydrocarbon, wherein the low-boiling-point hydrocarbon (including hydrocarbons which are gaseous at ordinary temperature) is brought into contact with a metal salt of an aliphatic carboxylic acid, and if necessary a high-boiling-point hydrocarbon, suspended in water, to form a solid aggregate substance, a method of handling the low-boiling-point hydrocarbon, wherein the solid aggregate substance is stored or transported, and a method of regenerating the low-boiling-point hydrocarbon, wherein the solid aggregate substance is decomposed by opening or heating, to obtain the low-boiling-point hydrocarbon. According to the methods, a wide variety of gaseous and highly volatile liquid hydrocarbons can be safely and easily solidified without using harmful reagent, and during storage, transportation, etc., the gaseous hydrocarbons and highly volatile liquids can be handled as a solid material. Further, by releasing under atmospheric pressure at room temperature or by heating if necessary, the original hydrocarbons can be easily obtained.
    • 公开了一种固化低沸点烃的方法,其中低沸点烃(包括常温下为气态的烃)与脂族羧酸的金属盐接触,如果需要, 悬浮在水中的高沸点烃形成固体骨料物质,其中贮存或运输固体骨料物质的低沸点烃的处理方法,以及低沸点烃的再生方法, 其中固体骨料通过开放或加热分解,得到低沸点烃。 根据该方法,可以在不使用有害试剂的情况下安全且容易地固化各种气态和高挥发性液体烃,并且在储存,运输等期间,气态烃和高挥发性液体可以作为固体材料处理。 此外,通过在常压下在室温下放出或者根据需要进行加热,可以容易地获得原始的碳氢化合物。