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51. 发明授权

US5100276A Production system using wafer-like carrier jig 失效
标题翻译：使用晶片状载体夹具的生产系统
公开(公告)号：US5100276A
公开(公告)日：1992-03-31
申请号：US231160
申请日：1988-08-11
申请人： Takemasa Iwasaki , Sadao Shimoyashiro , Haruo Ohya , Hiroshi Kikuchi , Tsutomu Takahashi , Masahiro Watanabe
发明人： Takemasa Iwasaki , Sadao Shimoyashiro , Haruo Ohya , Hiroshi Kikuchi , Tsutomu Takahashi , Masahiro Watanabe
IPC分类号： B65G1/00 , B65G1/07 , B65H1/28 , H01L21/00 , H01L21/673 , H01L21/677
CPC分类号： H01L21/67346 , H01L21/67276 , H01L21/67386 , H01L21/67727
摘要： The present invention provides a carrier jig for use in processing, transporting and stocking a wafer-like material used in manufacture processes of semiconductor products, and a semiconductor production system using the carrier jig. The carrier jig of the present invention comprises a holder for holding and storing therein one wafer, for example, and a container box for loading therein the holder. A mechanism for transferring wafers by the use of the carrier jig is provided in each process, with the result the period of production time can be shortened and the production speed can be enhanced.
摘要翻译：本发明提供一种用于加工，运输和放养半导体产品的制造工艺中使用的晶片状材料的载体夹具，以及使用载体夹具的半导体生产系统。本发明的载体夹具包括用于容纳和存储其中的一个晶片的保持器和用于在其中装载保持器的容器盒。在每个处理中提供了通过使用载体夹具转移晶片的机构，结果可以缩短生产时间的周期并且可以提高生产速度。

52. 发明授权

US5068712A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5068712A
公开(公告)日：1991-11-26
申请号：US409332
申请日：1989-09-19
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/31 , H01L23/495 , H01L25/10 , H01L29/06 , H05K1/14 , H05K1/18 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/05 , H01L24/06 , H01L25/105 , H01L29/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/06136 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73215 , H01L2224/85205 , H01L2224/8592 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , Y10T29/49121
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
摘要翻译：由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小杂散容量，提高信号传输速率和减少电气噪声。

53. 外观设计

USD321716S Toner cartridge 失效
公开(公告)号：USD321716S
公开(公告)日：1991-11-19
申请号：US433831
申请日：1989-11-13
申请人： Hiroshi Kikuchi , Hisao Ono , Yoshiharu Momiyama , Shigeki Nakajima
设计人： Hiroshi Kikuchi , Hisao Ono , Yoshiharu Momiyama , Shigeki Nakajima

54. 发明授权

US5039910A Standing-wave accelerating structure with different diameter bores in bunching and regular cavity sections 失效
标题翻译：驻波和规则空腔截面的不同直径孔的驻波加速结构
公开(公告)号：US5039910A
公开(公告)日：1991-08-13
申请号：US196255
申请日：1988-05-20
申请人： Yusuke Moriguchi , Hiroshi Kikuchi
发明人： Yusuke Moriguchi , Hiroshi Kikuchi
IPC分类号： H05H9/04
CPC分类号： H05H9/04
摘要： A standing-wave accelerating structure for accelerating charged particles wherein a converging force and a diverging force of an electric field to an electron beam are checked to improve the transmittivity of the electron beam through the accelerating structure and production of X-ray leakage is eliminated or minimized. The accelerating structure comprises a buncher section including at least one cavity for mainly bunching charged particles, and a regular section including at least one cavity. The diameter of a bore in the buncher section is smaller than the diameter of another bore in the regular section. A shorting bar for stopping propagation of microwaves is inserted in at least one of the cavities, and a means for accelerating the charged particles and for converging a beam is provided forwardly or rearwardly of the cavity in which the shorting bar is inserted.
摘要翻译：检查用于加速带电粒子的驻波加速结构，其中检查电场对电子束的会聚力和发散力，以提高通过加速结构的电子束的透射率，并且消除X射线泄漏的产生最小化。加速结构包括一个包括至少一个用于主要聚束带电粒子的空腔的整形器部分和包括至少一个空腔的规则部分。聚束器部分中的孔的直径小于常规部分中另一个孔的直径。用于停止微波传播的短路棒被插入到至少一个空腔中，并且用于加速带电粒子和用于会聚束的装置设置在插入有短路棒的空腔的前方或后方。

55. 发明授权

US5037674A Method of chemically vapor depositing a thin film of GaAs 失效
标题翻译：化学气相沉积GaAs薄膜的方法
公开(公告)号：US5037674A
公开(公告)日：1991-08-06
申请号：US462348
申请日：1990-01-03
申请人： Seiji Kojima , Masakiyo Ikeda , Hiroshi Kikuchi , Yuzo Kashiwayanagi
发明人： Seiji Kojima , Masakiyo Ikeda , Hiroshi Kikuchi , Yuzo Kashiwayanagi
IPC分类号： C30B29/42 , C30B25/02 , H01L21/205
CPC分类号： C30B25/02 , C30B29/42 , Y10S438/925
摘要： Doped thin films of GaAs are chemically vapor deposited by depositing a high resistant buffer layer of GaAs on a GaAs substrate by gaseous reaction of a mixture of arsine gas and trimethylgallium in the gas phase over the substrate while the temperature of the substrate is maintained within the range of 600.degree.-700.degree. C., stopping the supply of trimethylgallium to the gas mixture undergoing reaction and increasing the temperature of the substrate to within the range of 700.degree.-800.degree. C., and then resuming the supply of trimethylgallium to and supplying hydrogen sulfide to the gas phase over the substrate at the stated temperature, thereby depositing a doped GaAs layer over the buffer layer on the substrate having a distribution of carrier density of less than 5%.
摘要翻译：掺杂的GaAs的薄膜通过在GaAs衬底上沉积高电阻缓冲层的GaAs来进行化学气相沉积，该衬底通过在衬底上的气相中的胂气体和三甲基镓的混合物的气相反应，同时衬底的温度保持在范围为600°-700℃，停止向经历反应的气体混合物供应三甲基镓，并将基板的温度升高至700-800℃，然后恢复供应三甲基镓在所述温度下在衬底上向气相提供硫化氢，从而在衬底上的缓冲层上沉积载流子密度小于5％的掺杂GaAs层。

56. 发明授权

US5019155A Herbicidal granular compositions 失效
标题翻译：除草颗粒组合物
公开(公告)号：US5019155A
公开(公告)日：1991-05-28
申请号：US380846
申请日：1989-07-14
申请人： Masaomi Kimpara , Kaiji Kawai , Hiroshi Kikuchi , Masai Sato
发明人： Masaomi Kimpara , Kaiji Kawai , Hiroshi Kikuchi , Masai Sato
IPC分类号： A01N25/12 , A01N33/18
CPC分类号： A01N25/12 , A01N33/18
摘要： The present invention provides fine granular compositions of pendimethalin which are non-dusting and non-staining.
摘要翻译：本发明提供了无尘和无染色的二甲戊乐灵细粒状组合物。

57. 发明授权

US5017029A Corrosion suppressing ink ribbon 失效
标题翻译：防腐墨带
公开(公告)号：US5017029A
公开(公告)日：1991-05-21
申请号：US361166
申请日：1989-06-05
申请人： Hirokazu Andou , Hiroshi Kikuchi , Hiroki Murakawa
发明人： Hirokazu Andou , Hiroshi Kikuchi , Hiroki Murakawa
IPC分类号： B41M5/10
CPC分类号： B41M5/10
摘要： Ink in an ink ribbon contains per 100 parts by weight of ink, 0.1-10 parts by weight of an adsorption-type corrosion suppressor. The adsorption-type corrosion suppressor may be one or more of, the following compounds: amines of the formula R--NH.sub.2, RR'--NH, RR'R"--N (where R, R' and RR" are alkyl groups), thiourea and its derivatives, benzotriazole and its derivatives, thiazole, thioamides and thiosemicarbazide. In another aspect of the invention, the ink contains an organic pigment as coloring material, said ink containing 5.0-10.0 parts by weight of graphite per 100 parts by weight of ink.

58. 发明授权

US5002414A Method of automatically inserting printing paper in an automatic paper feeder 失效
标题翻译：自动将打印纸插入自动进纸器的方法
公开(公告)号：US5002414A
公开(公告)日：1991-03-26
申请号：US863254
申请日：1986-05-14
申请人： Hiroshi Kikuchi , Jiro Tanuma , Tadao Shimizu , Akira Nagumo , Shinichi Katakura
发明人： Hiroshi Kikuchi , Jiro Tanuma , Tadao Shimizu , Akira Nagumo , Shinichi Katakura
IPC分类号： B65H7/04 , B41J13/00 , B41J13/10 , B65H3/06 , B65H5/06 , B65H11/00
CPC分类号： B41J13/103
摘要： A method of automatically inserting a printing paper in a hopper of an automatic paper feeder or a manual insertion printing paper inserted from a manual paper input slot. Upon receiving an instruction to insert a printing paper by a printer, a platen is first rotated. Thereupon, provided the presence of the printing paper is detected by a sensor even with the platen being rotated by a prescribed amount, a paper feed motor of the automatic paper feeder is rotated for obtaining a printing paper from the hopper. While, provided the presence of a printing paper is detected before the platen is rotated by the prescribed amount, the paper feed motor is not rotated, it being assumed that the manual insertion of a printing paper has been already performed. After detected the presence of the printing paper, the platen is rotated by a prescribed amount to cause the printing paper to be moved to a position where a first line of the printing paper faces the face of the printing head.
摘要翻译：自动将打印纸插入自动进纸器的料斗或从手动纸输入槽插入的手动插入打印纸的方法。在接收到由打印机插入打印纸的指令时，首先旋转压盘。因此，只要打印纸被转动了规定量，传感器即可检测到打印纸的存在，自动给纸机的供纸马达旋转，从料斗获取打印纸。同时，只要在压板旋转规定量之前检测到打印纸的存在，则进纸电动机不会旋转，假设已经执行了手动插入打印纸。在检测到打印纸的存在之后，压纸盘旋转规定量以使打印纸移动到打印纸的第一行面朝向打印头的表面的位置。

59. 发明授权

US4929102A Ribbon protector including electro-conductive elements and platen gap adjustment device incorporating the same 失效
标题翻译：带状保护器包括导电元件和包括该导电元件的压板间隙调节装置
公开(公告)号：US4929102A
公开(公告)日：1990-05-29
申请号：US131093
申请日：1987-12-10
申请人： Minoru Mizutani , Hiroshi Kikuchi , Shoichi Watanabe , Kuniharu Hayashi , Masanori Maekawa
发明人： Minoru Mizutani , Hiroshi Kikuchi , Shoichi Watanabe , Kuniharu Hayashi , Masanori Maekawa
IPC分类号： B41J31/12 , B41J35/26
CPC分类号： B41J35/26 , B41J31/12
摘要： A ribbon protector is used for protecting paper from contamination by an ink ribbon in a printer, where the protector is inserted between paper located between a platen and a printing head. The printing head facing the platen performs spacing movement for printing. Two connected plate-like elements are provided with through openings for passage of the pin of the printing head. Mutually engageable electroconductive elements are provided on the inner walls of the two plate-like elements, at least in the area where they are compressed by the tip of the printing head, and spacers which are made from resilient materials are located between the two plate-like elements.
摘要翻译：带状保护器用于防止纸张被打印机中的墨带污染，其中保护器插入在位于压板和打印头之间的纸张之间。面向压盘的打印头执行打印的间隔运动。两个连接的板状元件设置有用于打印头的销通过的通孔。至少在打印头的顶端被压缩的区域中，两个板状元件的内壁上设有相互接合的导电元件，并且由弹性材料制成的间隔件位于两个板状元件之间，像元素。

60. 发明授权

US4750881A Easily assembled carriage mechanism of printer 失效
标题翻译：轻松组装打印机的支架机构
公开(公告)号：US4750881A
公开(公告)日：1988-06-14
申请号：US836511
申请日：1986-03-05
申请人： Hiroshi Kikuchi , Kazuki Obara , Kuniharu Hayashi , Masanori Maekawa , Yukio Ota , Shyoichi Watanabe
发明人： Hiroshi Kikuchi , Kazuki Obara , Kuniharu Hayashi , Masanori Maekawa , Yukio Ota , Shyoichi Watanabe
IPC分类号： B41J19/20 , B41J29/02 , B41J33/14
CPC分类号： B41J19/20
摘要： A carriage mechanism of a printer includes a carriage frame, a printed circuit board mounted on the carriage frame and having an exposed wiring portion and a plurality portion of guide holes, and a cable having at one end thereof an exposed wiring portion to be electrically connected to the exposed wiring portion of the printed circuit board. An inked ribbon feed mechanism has guide projections to be inserted into the guide holes and a plurality of elastic hooks for fastening to the carriage frame. A cable fixing mechanism includes a flexible film member to be superimposed over the end of the flexible cable and fixed thereto. One end of the flexible film member is shaped as the end of the flexible cable and the other end of the flexible film member is progressively narrower and projects toward a folded portion of the flexible cable.
摘要翻译：打印机的滑架机构包括：托架框架，安装在托架框架上的印刷电路板，具有露出的布线部分和多个导向孔;以及电缆，其一端具有裸露的布线部分以进行电连接到印刷电路板的暴露的布线部分。色带输送机构具有插入导向孔中的引导突起和用于紧固到托架框架的多个弹性钩。电缆固定机构包括柔性膜构件，该柔性膜构件叠加在柔性电缆的端部上并固定在其上。柔性膜构件的一端成形为柔性电缆的端部，并且柔性膜构件的另一端逐渐变窄并且朝向柔性电缆的折叠部分突出。

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