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    • 52. 发明申请
    • NON-VOLATILE MEMORY AND MANUFACTURING METHOD AND OPERATING METHOD THEREOF
    • 非易失性存储器及其制造方法及其工作方法
    • US20060186481A1
    • 2006-08-24
    • US11161312
    • 2005-07-29
    • Ching-Sung YangWei-Zhe WongChih-Chen Cho
    • Ching-Sung YangWei-Zhe WongChih-Chen Cho
    • H01L29/76
    • G11C16/0483H01L27/115H01L27/11521H01L27/11524H01L27/11568
    • A non-volatile memory having many memory cell columns is provided. Each memory cell column includes a plurality of memory cells formed on a substrate. A deep p-type well is disposed in the substrate and an n-type well is disposed on the deep p-type well. A shallow p-type well isolated by device isolation structures is disposed on the n-type well. A select unit is disposed on one side of each memory cell column. An n-type source region is disposed in the substrate adjacent to the select unit. An n-type drain region is disposed in the substrate on the other side of the memory cell column. A bit line is disposed on the substrate. The bit line connects with the n-type drain region through a conductive plug. The conductive plug penetrates the junction between the n-type drain region and the shallow p-type well and forms a short between them.
    • 提供了具有许多存储单元列的非易失性存储器。 每个存储单元列包括形成在基板上的多个存储单元。 在衬底中设置深p型阱,在深p型阱上设置n型阱。 通过器件隔离结构隔离的浅P型阱设置在n型阱上。 选择单元设置在每个存储单元列的一侧。 n型源极区域设置在与选择单元相邻的衬底中。 在存储单元列的另一侧的衬底中设置n型漏极区。 位线设置在基板上。 位线通过导电插头与n型漏极区域连接。 导电插塞穿透n型漏极区和浅P型阱之间的结,并在它们之间形成短路。
    • 53. 发明申请
    • NON-VOLATILE MEMORY AND MANUFACTURING AND OPERATING METHOD THEREOF
    • 非易失性存储器及其制造和操作方法
    • US20060170038A1
    • 2006-08-03
    • US11161398
    • 2005-08-02
    • Wei-Zhe WongChing-Sung Yang
    • Wei-Zhe WongChing-Sung Yang
    • H01L29/94
    • H01L27/11568H01L27/115H01L27/11521
    • A non-volatile memory is provided. A substrate having a plurality of trenches and a plurality of select gates is provided. The trenches are arranged in parallel and extend in a first direction. Each of the select gates is disposed on the substrate between two adjacent trenches respectively. A plurality of select gate dielectric layers are disposed between the select gates and the substrate. A plurality of composite layers are disposed over the surface of the trenches and each composite layer has a charge trapping layer. A plurality of word lines are arranged in parallel in a second direction, wherein each of the word lines fills the trenches between adjacent select gates and is disposed over the composite layers.
    • 提供非易失性存储器。 提供具有多个沟槽和多个选择栅极的衬底。 沟槽平行布置并沿第一方向延伸。 每个选择栅极分别设置在两个相邻沟槽之间的衬底上。 在选择栅极和衬底之间设置多个选择栅极电介质层。 多个复合层设置在沟槽的表面上,并且每个复合层具有电荷捕获层。 多个字线在第二方向上平行布置,其中每条字线填充相邻选择栅之间的沟槽并且设置在复合层之上。
    • 54. 发明申请
    • NON-VOLATILE MEMORY AND FABRICATING METHOD AND OPERATING METHOD THEREOF
    • 非挥发性记忆及其制作方法及其操作方法
    • US20060170026A1
    • 2006-08-03
    • US11162116
    • 2005-08-29
    • Wei-Zhe WongChing-Sung YangChih-Chen Cho
    • Wei-Zhe WongChing-Sung YangChih-Chen Cho
    • H01L21/336H01L29/76
    • G11C16/0416H01L21/28273H01L27/115H01L27/11521H01L29/42328H01L29/66825H01L29/7887
    • A non-volatile memory is provided. A substrate has at least two isolation structures therein to define an active area. A well is located in the substrate. A shallow doped region is located in the well. At least two stacked gate structures are located on the substrate. Pocket doped regions are located in the substrate at the peripheries of the stacked gate structures; each of the pocket doped regions extends under the stacked gate structure. Drain regions are located in the pocket doped regions at the peripheries of the stacked gate structures. An auxiliary gate layer is located on the substrate between the stacked gate structures. A gate dielectric layer is located between the auxiliary gate layer and the substrate and between the auxiliary gate layer and the stacked gate structure. Plugs are located on the substrate and extended to connect with the pocket doped region and the drain regions therein.
    • 提供非易失性存储器。 衬底在其中具有至少两个隔离结构以限定有效区域。 一个井位于基板中。 浅掺杂区域位于井中。 至少两个堆叠的栅极结构位于衬底上。 袋状掺杂区域位于堆叠栅极结构的周边的衬底中; 每个口袋掺杂区域在堆叠的栅极结构之下延伸。 漏极区位于堆叠栅极结构的周边的口袋掺杂区域中。 辅助栅极层位于堆叠栅极结构之间的衬底上。 栅极电介质层位于辅助栅极层和衬底之间,并且位于辅助栅极层和堆叠栅极结构之间。 插头位于衬底上并延伸以与其中的口袋掺杂区域和漏极区域连接。
    • 57. 发明申请
    • FLASH MEMORY CELL AND FABRICATING METHOD THEREOF
    • 闪存存储单元及其制作方法
    • US20060024887A1
    • 2006-02-02
    • US10904749
    • 2004-11-25
    • Wei-Zhe WongChing-Sung Yang
    • Wei-Zhe WongChing-Sung Yang
    • H01L21/336
    • H01L27/115G11C16/0433G11C16/3468H01L21/28273H01L27/11521H01L27/11526H01L27/11529H01L29/42328H01L29/66825H01L29/7881
    • A flash memory cell is provided. A deep well is disposed in a substrate and a well is disposed within the deep well. A stacked gate structure is disposed on the substrate. A source region and a drain region are disposed in the substrate on each side of the stacked gate structure. A select gate is disposed between the stacked gate structure and the source region. A first gate dielectric layer is disposed between the select gate and the stacked gate structure. A second gate dielectric layer is disposed between the select gate and the substrate. A shallow doped region is disposed in the substrate under the stacked gate structure and the select gate. A deep doped region is disposed in the substrate on one side of the stacked gate structure. The conductive plug on the substrate extends through the drain region and the deep doped region.
    • 提供闪存单元。 将深井设置在基板中,并将井设置在深井内。 层叠栅极结构设置在基板上。 源极区域和漏极区域设置在堆叠栅极结构的每一侧上的衬底中。 选择栅极设置在堆叠的栅极结构和源极区域之间。 第一栅极介电层设置在选择栅极和堆叠栅极结构之间。 第二栅极电介质层设置在选择栅极和衬底之间。 在堆叠栅极结构和选择栅极之下的衬底中设置浅掺杂区域。 在堆叠栅极结构的一侧上的衬底中设置深掺杂区域。 衬底上的导电插塞延伸穿过漏区和深掺杂区。
    • 60. 发明授权
    • Structure of a low-voltage channel write/erase flash memory cell and fabricating method thereof
    • 低电压通道写入/擦除闪存单元的结构及其制造方法
    • US06677198B2
    • 2004-01-13
    • US10064109
    • 2002-06-12
    • Ching-Hsiang HsuChing-Sung Yang
    • Ching-Hsiang HsuChing-Sung Yang
    • H01L21336
    • H01L29/66825H01L21/28273H01L29/7883
    • The present invention relates to a structure of a low-voltage channel write/erase flash memory cell and a fabricating method thereof, which structure comprises an N-substrate, a deep P-well formed on the substrate, and an N-well formed on the deep P-well. A deep p-type region and a shallow p-type region are ion-implanted in the N-well. The deep p-type region is connected to the shallow p-type region. An n-type region is ion-implanted in the deep p-type region to be electrically shorted with the deep p-type region and be used as a drain. Another n-type region is also ion-implanted at one side of the shallow p-type region to be used as a source. The present invention can apply the same voltage to the deep P-well and the N-well on the N-substrate by adding in a triple well architecture so that the leakage current capably generated can be reduced to minimum, thereby effectively reducing end voltages when performing the operation of erasing, simplifying the design complexity of a charge pump circuit required by the whole structure, and enhancing the operating efficiency.
    • 本发明涉及一种低电压通道写入/擦除闪速存储单元的结构及其制造方法,该结构包括N衬底,在衬底上形成的深P阱以及形成在N阱上的N阱 深P井。 将深P型区域和浅P型区域离子注入到N阱中。 深P型区域连接到浅P型区域。 在深p型区域中离子注入n型区域,与深p型区域电短路并用作漏极。 另一个n型区域也被离子注入在用作源的浅P型区域的一侧。 本发明可以通过添加三阱结构将相同的电压施加在N衬底上的深P阱和N阱上,使得可以产生的泄漏电流可以减小到最小,从而有效地减少最终电压,当 执行擦除操作,简化了整个结构所需的电荷泵电路的设计复杂度,提高了运行效率。