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51. 发明授权

US6086383A Coaxial interconnect devices and methods of making the same 失效
标题翻译：同轴互连设备及其制作方法
公开(公告)号：US6086383A
公开(公告)日：2000-07-11
申请号：US103971
申请日：1998-06-24
申请人： Benjamin V. Fasano , Kevin M. Prettyman
发明人： Benjamin V. Fasano , Kevin M. Prettyman
IPC分类号： H01R12/57 , H01R24/50 , H01R43/00 , H05K1/02 , H05K1/14 , H05K3/32 , H05K3/34 , H05K3/40 , H01R12/00
CPC分类号： H01R24/50 , H01R12/57 , H05K1/0243 , H01L2924/0002 , H01R2103/00 , H05K1/0237 , H05K2201/09809 , H05K2201/10325 , H05K2201/10333 , H05K2201/10378 , H05K2201/10962 , H05K3/325 , H05K3/341 , H05K3/4015 , Y10T29/49123 , Y10T29/49147
摘要： A surface mounted electronic interconnect device. The device includes a coaxial electrical pad comprising a plurality of conductive surfaces on a substrate corresponding to the conductor arrangement of a coaxial connector; and, a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces that are planar with the ends of the connector. The dielectric separates the inner conductive surface from the outer conductive surface and is tubularly shaped having an inner wall for the electrically conductive interior surface. The coaxial connector inner and outer conductors may alternatively be comprised of microsprings. The coaxial connector has first and second ends, the first end for attachment to an electronic package and the second end for pluggable attachment to a PC board. A socket for mating with the coaxial connector second end is demonstrated, comprising a body and inner and outer conductors and configured so as to contact the interior and exterior surfaces of the coaxial connector at different times. The inner conductor of the socket is adapted to be received within the electrically conductive interior surface of the coaxial connector.
摘要翻译：表面安装的电子互连器件。该装置包括：同轴电焊盘，其包括在与同轴连接器的导体布置相对应的衬底上的多个导电表面; 以及包括电介质材料的同轴连接器，所述电介质材料具有与所述连接器的端部平坦的中心开口和隔离的导电内部和外部表面。电介质将内部导电表面与外部导电表面分离，并且管状地形成有用于导电内表面的内壁。同轴连接器内外导体也可以由微弹簧构成。同轴连接器具有第一端和第二端，用于附接到电子封装的第一端和用于可插拔连接到PC板的第二端。示出了用于与同轴连接器第二端配合的插座，包括主体和内部和外部导体，并且构造成在不同时间接触同轴连接器的内部和外部表面。插座的内导体适于被容纳在同轴连接器的导电内表面内。

52. 发明授权

US6051330A Solid oxide fuel cell having vias and a composite interconnect 失效
标题翻译：具有通孔和复合互连的固体氧化物燃料电池
公开(公告)号：US6051330A
公开(公告)日：2000-04-18
申请号：US7891
申请日：1998-01-15
申请人： Benjamin V. Fasano , Kevin M. Prettyman
发明人： Benjamin V. Fasano , Kevin M. Prettyman
IPC分类号： H01M8/02 , H01M4/86
CPC分类号： H01M8/0226 , H01M8/006 , H01M8/0208 , H01M8/0215 , H01M8/0243 , H01M8/12 , H01M8/2425 , H01M8/2485 , H01M2300/0074 , Y10T29/49114
摘要： One aspect of the invention relates to an interconnect for an SOFC wherein the interconnect is made from a cermet including partially stabilized tetragonal zirconia and a superalloy that is resistant to oxidizing and reducing conditions. Another aspect of the invention relates to an SOFC having vias for carrying fuel and an oxidant and at least one patterned feature in the anode, electrolyte, cathode and/or interconnect for laterally distributing the fuel or oxidant.
摘要翻译：本发明的一个方面涉及一种用于SOFC的互连，其中所述互连由金属陶瓷制成，所述金属陶瓷包括部分稳定的四方晶氧化锆和耐氧化和还原条件的超合金。本发明的另一方面涉及一种具有用于承载燃料和氧化剂的通孔的SOFC，以及用于横向分配燃料或氧化剂的阳极，电解质，阴极和/或互连中的至少一个图案化特征。

53. 发明授权

US6051329A Solid oxide fuel cell having a catalytic anode 失效
标题翻译：具有催化阳极的固体氧化物燃料电池
公开(公告)号：US6051329A
公开(公告)日：2000-04-18
申请号：US7890
申请日：1998-01-15
申请人： Benjamin V. Fasano , Kevin M. Prettyman
发明人： Benjamin V. Fasano , Kevin M. Prettyman
IPC分类号： H01M8/12 , H01M8/24 , H01M4/88
CPC分类号： H01M4/9066 , H01M8/1231 , H01M2008/1293 , H01M2300/0074 , H01M4/905 , H01M8/2425 , Y02P70/56 , Y10T29/49114 , Y10T29/49115
摘要： Disclosed is an SOFC having a catalytic anode including a porous, ceramic anode including a catalyst, wherein the catalyst is selected from the group consisting of platinum, rhodium, ruthenium and mixtures thereof; a dense, solid electrolyte adjacent to the porous, ceramic anode; a porous, ceramic cathode adjacent to the dense, solid electrolyte; and a dense, ceramic interconnect adjacent to the porous, ceramic cathode, wherein the dense, ceramic interconnect has nonintersecting passages for the flow of a fuel and an oxidant. Also disclosed is a method to make the SOFC having a catalytic anode.
摘要翻译：公开了具有催化阳极的SOFC，其包括包含催化剂的多孔陶瓷阳极，其中所述催化剂选自铂，铑，钌及其混合物; 邻近多孔陶瓷阳极的致密固体电解质; 与致密的固体电解质相邻的多孔陶瓷阴极; 以及与所述多孔陶瓷阴极相邻的致密的陶瓷互连，其中所述致密陶瓷互连件具有用于燃料和氧化剂流动的非接触通道。还公开了使SOFC具有催化剂阳极的方法。

54. 发明授权

US6004624A Method for the controlling of certain second phases in aluminum nitride 失效
标题翻译：用于控制氮化铝中某些第二相的方法
公开(公告)号：US6004624A
公开(公告)日：1999-12-21
申请号：US887375
申请日：1997-07-02
申请人： Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
发明人： Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
IPC分类号： C04B41/51 , C04B41/88 , H01L23/15 , H05K1/03 , H05K1/09 , B05D3/02 , B05D1/36
CPC分类号： C04B41/009 , C04B41/5133 , C04B41/88 , H01L23/15 , C04B2111/00844 , H01L2924/0002 , H05K1/0306 , H05K1/092 , Y10T428/265
摘要： Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.
摘要翻译：用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。在氮化铝中，这些缺陷可能与液体烧结助剂的分解有关。在该实验中，金属化的独特添加防止了某些陶瓷缺陷的形成。我们的方法涉及在现有过程中使用的独特组合。

55. 发明授权

US5949030A Vias and method for making the same in organic board and chip carriers 失效
标题翻译：在有机板和芯片载体上制作相同的通孔和方法
公开(公告)号：US5949030A
公开(公告)日：1999-09-07
申请号：US971064
申请日：1997-11-14
申请人： Benjamin V. Fasano , Kevin M. Prettyman
发明人： Benjamin V. Fasano , Kevin M. Prettyman
IPC分类号： H01L21/48 , H05K1/11 , H05K3/42 , H05K3/46 , H05K1/02
CPC分类号： H05K3/429 , H01L21/486 , H05K1/115 , H01L2223/6616 , H01L2223/6622 , H05K2201/09536 , H05K2201/0959 , H05K2201/09809 , H05K3/4602 , Y10T29/49165
摘要： Multiple vias are produced coaxially or in axis parallel alignment in a first or primary through-hole in a printed circuit board, chip carrier or like electrical device by producing a primary metallized through hole or via which is then filled or coated with a dielectric material which is also placed on both surfaces of the device at the ends of the via. The dielectric material inside the via can then be provided with at least one coaxial through-hole or multiple axis parallel through holes which can be metallized to form conductive paths between the surfaces of the device. Portions of the dielectric surface layer can be removed to expose contacts to the inner metallized via. Successive coaxial vias can be made in any number by the method of the invention. In addition electrical signal paths can be isolated within voltage or ground co-axial conductors.
摘要翻译：在印刷电路板，芯片载体或类似电气装置中的第一或主要通孔中同轴地或以轴线平行对准地制造多个通孔，通过产生初级金属化通孔或通孔，然后填充或涂覆电介质材料，也放置在通孔两端的设备的两个表面上。通孔内部的电介质材料可以设置有至少一个同轴的通孔或多个平行的通孔，其可以被金属化以在器件的表面之间形成导电路径。电介质表面层的一部分可以被去除以暴露与内部金属化通孔的触点。可以通过本发明的方法以任意数量形成连续的同轴通孔。此外，电信号路径可以在电压或地面同轴导体内隔离。

56. 发明授权

US5940966A Method of making an electronic interconnect device 失效
标题翻译：制造电子互连装置的方法
公开(公告)号：US5940966A
公开(公告)日：1999-08-24
申请号：US953546
申请日：1997-10-21
申请人： Benjamin V. Fasano , Kevin M. Prettyman
发明人： Benjamin V. Fasano , Kevin M. Prettyman
IPC分类号： H01R12/57 , H01R24/50 , H01R43/00 , H05K1/02 , H05K1/14 , H05K3/32 , H05K3/34 , H05K3/40 , H01B13/20
CPC分类号： H01R24/50 , H01R12/57 , H05K1/0243 , H01L2924/0002 , H01R2103/00 , H05K1/0237 , H05K2201/09809 , H05K2201/10325 , H05K2201/10333 , H05K2201/10378 , H05K2201/10962 , H05K3/325 , H05K3/341 , H05K3/4015 , Y10T29/49123 , Y10T29/49147
摘要： An electronic interconnect device and methods of making the device. The device comprises a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces. The coaxial connector having first and second ends, the first end for attachment to an electronic package and the second end for pluggable attachment to a PC board.
摘要翻译：一种电子互连装置及其制造方法。该装置包括同轴连接器，其包括具有中心开口和隔离的导电内部和外部表面的电介质材料。该同轴连接器具有第一端和第二端，用于附接到电子封装的第一端和用于可插拔连接到PC板的第二端。

57. 发明授权

US5552107A Aluminum nitride body having graded metallurgy 失效
标题翻译：具有分级冶金的氮化铝体
公开(公告)号：US5552107A
公开(公告)日：1996-09-03
申请号：US437494
申请日：1995-05-09
申请人： Jon A. Casey , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Jonathan H. Harris , Lester W. Herron , Gregory M. Johnson , Niranjan M. Patel , Andrew M. Reitter , Subhash L. Shinde , Rao V. Vallabhaneni , Robert A. Youngman
发明人： Jon A. Casey , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Jonathan H. Harris , Lester W. Herron , Gregory M. Johnson , Niranjan M. Patel , Andrew M. Reitter , Subhash L. Shinde , Rao V. Vallabhaneni , Robert A. Youngman
IPC分类号： B32B18/00 , B22F7/02 , C04B35/581 , C04B37/02 , C04B41/51 , C04B41/52 , C04B41/88 , C04B41/89 , C22C29/16 , H01L21/48 , H01L23/373 , H05K1/03 , H05K3/24 , H05K3/40 , H05K3/46
CPC分类号： C04B41/009 , B22F7/02 , C04B41/5133 , C04B41/52 , C04B41/88 , C04B41/89 , C22C29/16 , H01L21/4846 , H01L21/486 , H01L23/3731 , H05K3/4061 , B22F2998/00 , C04B2111/00405 , C04B2111/00844 , H01L2924/0002 , H05K1/0306 , H05K2201/035 , H05K2201/09981 , H05K3/248 , H05K3/4611 , H05K3/4629 , Y10S428/901 , Y10T428/12021 , Y10T428/12028 , Y10T428/12056 , Y10T428/31678
摘要： Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.
摘要翻译：公开了一种具有分级冶金的氮化铝体及其制造方法。氮化铝体具有至少一个通孔，并且包括与氮化铝体直接接触的第一层和与第一层直接接触并完全封装的第二层。第一层包括30至60体积％的氮化铝和40至70体积％的钨和/或钼，而第二层包括90至100体积％的钨和/或钼和0至10体积％的氮化铝。

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