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51. 发明申请

US20060029506A1 Peristaltic pump head and tube holder 审中-公开
公开(公告)号：US20060029506A1
公开(公告)日：2006-02-09
申请号：US11157108
申请日：2005-06-20
申请人： David Gibson , Terence Bannister
发明人： David Gibson , Terence Bannister
IPC分类号： F04B43/08 , F04B43/12
CPC分类号： F04B43/1253
摘要： A tube holder for use with a peristaltic pump includes a housing having a recess for receipt of a pump rotor and a tube race around the recess. The tube race has a first race part and a second race part, a first tube inlet into the first race part and a first tube outlet from the first race part, a second tube inlet into the second race part and a second tube outlet from the second race part. The tube is insertable in the tube race by movement in a substantially orthogonal direction relative to the tube race so that it extends in through the first tube inlet, around the first race part, out through the first tube outlet, in through the second tube inlet, around the second race part, and out through the second tube outlet.

52. 发明申请

US20060029505A1 Peristaltic pump head and tube holder 审中-公开
公开(公告)号：US20060029505A1
公开(公告)日：2006-02-09
申请号：US11156683
申请日：2005-06-20
申请人： David Gibson , Terence Bannister
发明人： David Gibson , Terence Bannister
IPC分类号： F04B43/08 , F04B45/06
CPC分类号： F04B43/1253
摘要： A tube holder for use with a peristaltic pump includes a housing having a recess for receipt of a pump rotor and a tube race around the recess. The tube race has a first race part and a second race part, a first tube inlet into the first race part and a first tube outlet from the first race part, a second tube inlet into the second race part and a second tube outlet from the second race part. The tube is insertable in the tube race by movement in a substantially orthogonal direction relative to the tube race so that it extends in through the first tube inlet, around the first race part, out through the first tube outlet, in through the second tube inlet, around the second race part, and out through the second tube outlet.

53. 发明申请

US20050280134A1 Multi-frequency noise suppression capacitor set 审中-公开
标题翻译：多频抑噪电容组
公开(公告)号：US20050280134A1
公开(公告)日：2005-12-22
申请号：US11154395
申请日：2005-06-16
申请人： David Gibson , Andy Stavros , Michael Warner
发明人： David Gibson , Andy Stavros , Michael Warner
IPC分类号： H01L23/02 , H01L23/50 , H01L23/64
CPC分类号： H01L23/66 , H01L23/50 , H01L23/642 , H01L25/105 , H01L2225/1023 , H01L2225/1058 , H01L2924/0002 , H01L2924/15311 , H01L2924/15331 , H01L2924/3011 , H01L2924/00
摘要： A decoupling device (10) includes a plurality of capacitors having different capacitances (14,16,18) physically mounted in a package (12, 212), and terminals including at least one first terminal (24, 224) and at least one second terminal (26, 226) adapted for mounting the package to a circuit panel. The plural capacitors are connected in parallel between the first and second terminals so as to form plural circuits with different self-resonant frequencies. The device can be mounted as a unit on a circuit board with the first terminals connected to a power conductor and the second terminals connected to a ground conductor, and provides low impedance shunting of noise over a wide frequency spectrum.
摘要翻译：解耦装置（10）包括具有物理地安装在封装（12,212）中的不同电容（14,16,18）的多个电容器，以及包括至少一个第一端子（24,224）和至少一个第二端子端子（26,226），适于将封装安装到电路板。多个电容器并联连接在第一和第二端子之间，以形成具有不同自谐振频率的多个电路。该装置可以作为单元安装在电路板上，其中第一端子连接到电源导体，并且第二端子连接到接地导体，并且在宽频谱上提供低阻抗的噪声分流。

54. 发明授权

US06972998B1 Double data rate memory devices including clock domain alignment circuits and methods of operation thereof 有权
标题翻译：双数据速率存储器件，包括时钟域对准电路及其操作方法
公开(公告)号：US06972998B1
公开(公告)日：2005-12-06
申请号：US10774904
申请日：2004-02-09
申请人： David Gibson , Angus David Starr MacAdam , Mike Farrell
发明人： David Gibson , Angus David Starr MacAdam , Mike Farrell
IPC分类号： G11C7/10 , G11C7/22 , G11C11/34 , G11C11/4096 , G11C29/02
CPC分类号： G11C29/028 , G11C7/1051 , G11C7/106 , G11C7/1066 , G11C7/1069 , G11C7/22 , G11C11/401 , G11C11/4096 , G11C29/02 , G11C29/50012
摘要： An integrated circuit memory device includes a memory, a read control circuit operatively associated with the memory and configured to produce data from the memory responsive to an externally-applied input clock signal, and an output latch configured to transfer data at an input thereof to an output pad of the memory device responsive to an externally-applied output clock signal. The device further includes a clock domain alignment circuit configured to receive the data produced by the memory and to responsively provide the data at the input of the output latch based on relative timing of the input clock signal and the output clock signal.
摘要翻译：集成电路存储器件包括存储器，与存储器可操作地相关联并被配置为响应于外部施加的输入时钟信号从存储器产生数据的读取控制电路，以及输出锁存器，被配置为将数据在其输入处传送到存储器件的输出焊盘响应外部施加的输出时钟信号。该器件还包括时钟域对准电路，其被配置为接收存储器产生的数据，并且基于输入时钟信号和输出时钟信号的相对定时响应地在输出锁存器的输入处提供数据。

55. 发明申请

US20050194672A1 Stacked packages and systems incorporating the same 有权
标题翻译：堆叠的包装和系统结合在一起
公开(公告)号：US20050194672A1
公开(公告)日：2005-09-08
申请号：US10981067
申请日：2004-11-04
申请人： David Gibson , Andy Stavros
发明人： David Gibson , Andy Stavros
IPC分类号： H01L23/02
CPC分类号： H01L25/10 , H01L23/49816 , H01L23/49833 , H01L23/4985 , H01L24/14 , H01L24/17 , H01L25/0655 , H01L25/105 , H01L2224/16225 , H01L2225/0652 , H01L2225/06527 , H01L2225/06548 , H01L2225/06572 , H01L2225/1023 , H01L2225/107 , H01L2924/1437 , H01L2924/15311 , H05K1/112 , H05K1/141 , H05K3/3436 , H05K2201/10378 , H05K2201/10515 , H01L2224/48091 , H01L2924/00014
摘要： A microelectronic assembly incorporates units stacked one above the other and may include a plurality of similar stacks mounted to a circuit board. Some of the stacks may be inverted, rotated or both relative to other stacks so that corresponding edges of the stacks face one another to facilitate communication between the stacks. Communication between the stacks may be carried along traces on one or more interposers intercepting the stacks remote from the circuit board. Within each stack, conducting paths may extend in vertical columns or in other arrangements such as a stair step arrangement wherein each conductive path traverses a series of column positions, or in a crossing arrangement such two conductive paths cross back and forth between column positions along the vertical extend of the stack. A stack may include portions disposed above and below the circuit board.
摘要翻译：微电子组件包括彼此层叠的单元，并且可以包括安装到电路板的多个相似的堆叠。堆叠中的一些可以相对于其他堆叠反转，旋转或两者，使得堆叠的相应边缘彼此面对以便于堆叠之间的连通。堆叠之间的通信可以沿着拦截远离电路板的堆叠的一个或多个插入器上的迹线进行。在每个堆叠内，导电路径可以在垂直列中或在其他布置中延伸，例如阶梯式布置，其中每个导电路径穿过一系列列位置，或者在交叉布置中，这样的两个导电路径沿着沿着该列位置的列位置之间来回交替堆叠的垂直延伸。堆叠可以包括设置在电路板上方和下方的部分。

56. 发明申请

US20050049352A1 Solvent-modified resin compositions and methods of use thereof 审中-公开
标题翻译：溶剂改性树脂组合物及其使用方法
公开(公告)号：US20050049352A1
公开(公告)日：2005-03-03
申请号：US10737943
申请日：2003-12-16
申请人： Slawomir Rubinsztajn , Sandeep Tonapi , David Gibson , John Campbell , Ananth Prabhakumar , Ryan Mills
发明人： Slawomir Rubinsztajn , Sandeep Tonapi , David Gibson , John Campbell , Ananth Prabhakumar , Ryan Mills
IPC分类号： C08K9/06 , C08L63/00 , C09C1/30 , H01L21/56 , H01L23/29 , C08K3/34
CPC分类号： B82Y30/00 , C01P2004/64 , C08K9/06 , C08L63/00 , C09C1/3081 , H01L21/563 , H01L23/293 , H01L23/295 , H01L2224/73203 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/12044 , H01L2924/00
摘要： A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.
摘要翻译：提供了用作底部填充材料的溶剂改性树脂组合物。所述组合物具有至少一种环氧树脂，至少一种溶剂和官能化胶体二氧化硅的填料。溶剂改性树脂组合物可用于制备透明的B阶树脂膜。本公开的实施例包括用作晶片级底部填充物，以及用于电子芯片的密封剂。

57. 发明申请

US20140069040A1 CONTRUCTION PANEL SYSTEM AND METHODS OF ASSEMBLY THEREOF 审中-公开
标题翻译：对接面板系统及其组装方法
公开(公告)号：US20140069040A1
公开(公告)日：2014-03-13
申请号：US14024387
申请日：2013-09-11
申请人： David Gibson
发明人： David Gibson
IPC分类号： E04B1/76
CPC分类号： E04B1/76 , E04B1/14 , E04C2/22 , E04C2/292 , E04C2/52
摘要： Some embodiments provide a construction system that includes a plurality of panels. Moreover, at least some of the plurality of panels may include an upper side, a lower side, an insulation member, and at least one support member that is coupled to the insulation member. In some aspects, the support member may be coupled to the insulation member such that the support member extends from the upper side to the lower side of the panel. In some embodiments, the construction system may also include a plurality of engagement elements that are configured to engage at least some of the panels to assemble the panels into at least a portion of a structure.
摘要翻译：一些实施例提供了包括多个面板的构造系统。此外，多个面板中的至少一些面板可以包括上侧，下侧，绝缘构件以及耦合到绝缘构件的至少一个支撑构件。在一些方面，支撑构件可以联接到绝缘构件，使得支撑构件从面板的上侧延伸到下侧。在一些实施例中，构造系统还可以包括多个接合元件，其被构造成接合至少一些面板以将面板组装成结构的至少一部分。

58. 发明授权

US08255904B2 System and method for generating a distributable software package 有权
标题翻译：用于生成可分发软件包的系统和方法
公开(公告)号：US08255904B2
公开(公告)日：2012-08-28
申请号：US11635906
申请日：2006-12-08
申请人： Robert F. Sheppard , Stuart De Wavrin , David Gibson , Drew Dubber
发明人： Robert F. Sheppard , Stuart De Wavrin , David Gibson , Drew Dubber
IPC分类号： G06F9/445
CPC分类号： G06F8/61
摘要： A system, method, and computer program product for generating a distributable software package, including loading a template/profile; loading at least one module; receiving configuration options over a network connection; and assembling a distributable software package according to the profile, template(s), modules, and the configuration options.
摘要翻译：一种用于生成可分发软件包的系统，方法和计算机程序产品，包括加载模板/简档; 加载至少一个模块; 通过网络连接接收配置选项; 并根据配置文件，模板，模块和配置选项组装可分发的软件包。

59. 发明授权

US07939934B2 Microelectronic packages and methods therefor 有权
标题翻译：微电子封装及其方法
公开(公告)号：US07939934B2
公开(公告)日：2011-05-10
申请号：US11315466
申请日：2005-12-22
申请人： Belgacem Haba , David Gibson
发明人： Belgacem Haba , David Gibson
IPC分类号： H01L23/48 , H01L23/14
CPC分类号： G01R1/0483 , G01R1/0735 , G01R1/07378 , H01L23/13 , H01L23/3128 , H01L23/49811 , H01L23/49827 , H01L23/4985 , H01L2224/05001 , H01L2224/05023 , H01L2224/05147 , H01L2224/05548 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2924/00013 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/19041 , H01L2924/3011 , H05K3/3436 , H05K3/3447 , H05K2201/0367 , H05K2203/0455 , Y02P70/613 , H01L2924/00 , H01L2224/29099 , H01L2224/05599
摘要： An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The assembly also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements.
摘要翻译：用于测试微电子器件的组件包括具有面和触点的微电子元件，与微电子元件的第一面间隔开并且覆盖微电子元件的第一面的柔性基板，以及从柔性基板延伸并远离第一面微电子元件，至少一些导电柱与微电子元件电互连。组件还包括设置在微电子元件和衬底之间的多个支撑元件，用于将柔性衬底支撑在微电子元件上。至少一些导电柱从支撑元件偏移。

60. 发明申请

US20100013108A1 STACKED PACKAGES AND MICROELECTRONIC ASSEMBLIES INCORPORATING THE SAME 有权
标题翻译：包装包装和微电子组装
公开(公告)号：US20100013108A1
公开(公告)日：2010-01-21
申请号：US12551807
申请日：2009-09-01
申请人： David Gibson , Andy Stavros
发明人： David Gibson , Andy Stavros
IPC分类号： H01L23/50
CPC分类号： H01L25/10 , H01L23/49816 , H01L23/49833 , H01L23/4985 , H01L24/14 , H01L24/17 , H01L25/0655 , H01L25/105 , H01L2224/16225 , H01L2225/0652 , H01L2225/06527 , H01L2225/06548 , H01L2225/06572 , H01L2225/1023 , H01L2225/107 , H01L2924/1437 , H01L2924/15311 , H05K1/112 , H05K1/141 , H05K3/3436 , H05K2201/10378 , H05K2201/10515 , H01L2224/48091 , H01L2924/00014
摘要： A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and bottom surfaces. Top unit terminals are exposed at the top surfaces and bottom unit terminals are exposed at the bottom surfaces. The top and bottom unit terminals are provided at a set of ordered column positions. Each top unit terminal of the set, except the top unit terminals at the highest ordered column position, is connected to a respective bottom unit terminal of the same unit at a next higher ordered column position. Each bottom unit terminal of the set, except the bottom unit terminals of the lowest unit in the stack, is connected to a respective upper unit terminal of the next lower unit in the stack at the same column position.
摘要翻译：微电子组件包括彼此叠置以形成具有垂直方向的至少一个堆叠的单元。每个单元包括一个或多个微电子器件，并且具有顶表面和底表面。顶部单元端子在顶部表面露出，底部单元端子暴露在底部表面。顶部和底部单元端子设置在一组有序列位置。除了在最高有序列位置的顶部单元端子之外，组件的每个顶部单元端子在下一个更高排序的列位置处连接到同一单元的相应底部单元端子。除了堆叠中最低单元的底部单元端子之外，组件的每个底部单元端子连接到堆叠中的下一个下部单元的相应上部单元端子处于相同的列位置。

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