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    • 51. 发明授权
    • Packaged MEMS device and method for making the same
    • 封装的MEMS器件及其制造方法
    • US06519075B2
    • 2003-02-11
    • US09769192
    • 2001-01-25
    • Dustin W. CarrDennis S. GreywallSungho JinFlavio PardoHyongsok Soh
    • Dustin W. CarrDennis S. GreywallSungho JinFlavio PardoHyongsok Soh
    • G02B2600
    • G02B6/266B81B2201/042B81C3/002B81C2203/035G02B6/3518G02B6/3556G02B6/356G02B6/357G02B6/3584G02B6/3594G02B26/0841G02B2006/12104
    • A MEMs device comprises a component layer including a frame structure and at least one component movably coupled to the frame and an actuator layer including at least one conductive path and at least one actuator for moving the component. The component layer and the actuator layer are bonded together with solder or other materials in lateral alignment. Advantageously the layers are provided with metallization pads and are bonded together in lateral alignment with predetermined vertical gap spacing by solder bonds between the pads. In a preferred embodiment the MEMs device, however bonded, comprises a component layer, an actuator layer and an intervening spacer. The spacer provides the walls of a cavity between the component and the pertinent actuators to permit movement of the component. The walls cover the bulk of the peripheral boundary of the cavity to provide aerodynamic isolation. Advantageously the walls are conductive to provide electrostatic isolation. The device has particular utility in optical cross connection, variable attenuation and power gain equalization.
    • MEM器件包括包括框架结构的组件层和可移动地联接到框架的至少一个部件和包括至少一个导电路径的致动器层和用于移动部件的至少一个致动器。 组件层和致动器层用焊料或其它材料以横向对准结合在一起。 有利地,这些层设置有金属化焊盘,并且通过焊盘之间的焊接接合以预定的垂直间隙间隔横向对准地结合在一起。 在优选实施例中,MEM装置(然而粘合的)包括部件层,致动器层和中间间隔件。 间隔件提供组件和相关致动器之间的空腔的壁,以允许部件移动。 墙壁覆盖了空腔的周边边界的大部分,以提供空气动力隔离。 有利地,壁是导电的以提供静电隔离。 该器件在光交叉连接,可变衰减和功率增益均衡方面具有特殊的用途。
    • 52. 发明授权
    • Optical microstructure and method of manufacture
    • 光学微观结构和制造方法
    • US06321010B1
    • 2001-11-20
    • US09385751
    • 1999-08-30
    • James A. WalkerKeith W. GoossenDennis S. GreywallAlexandru PaunescuJohn V. Gates, II
    • James A. WalkerKeith W. GoossenDennis S. GreywallAlexandru PaunescuJohn V. Gates, II
    • G02B630
    • H04R23/008G02B26/001
    • An article and method including an optical fiber coupled to a microstructure which is easily manufactured. The microstructure is comprised of a plurality of layers including a receptacle layer and a movable layer. The optical fiber has a high reflectivity terminal end forming the non-movable layer. The receptacle layer has an opening aligned with the movable layer for receiving the terminal end of the optical fiber. The optical fiber is inserted into the opening and the receptacle layer and fixed in relation to the microstructure, so as to form cavity between the terminal end of the fiber and the movable layer of the microstructure. The movable layer is physically adapted for moving relative to the non-movable layer under the influence of an actuating force. Additionally a method of manufacture of forming a microstructure comprising a receptacle layer having an opening therein and a movable layer, inserting a terminal end of an optical fiber into the opening, and affixing the optic fiber to the microstructure.
    • 一种包括耦合到容易制造的微结构的光纤的制品和方法。 微结构由包括容纳层和可移动层的多个层构成。 光纤具有形成不可移动层的高反射率终端。 插座层具有与可移动层对准的开口,用于接收光纤的终端。 光纤被插入到开口和插座层中并相对于微结构固定,以便在纤维的末端和微结构的可移动层之间形成空腔。 可移动层物理地适于在致动力的影响下相对于不可移动层移动。 另外,一种制造微结构的方法,该微结构包括其中具有开口的插座层和可移动层,将光纤的末端插入开口中,并将该光纤固定在微结构上。
    • 53. 发明授权
    • Gas-damped micromechanical structure
    • 气体阻尼微机械结构
    • US5786927A
    • 1998-07-28
    • US815774
    • 1997-03-12
    • Dennis S. Greywall
    • Dennis S. Greywall
    • G02B26/00F16F9/02G02B26/02
    • F16F9/02G02B26/02
    • An improved squeeze-type micromechanical structure for high speed operation, i.e., greater than 1 MHz, is disclosed. The structure has a movable member possessing damping holes. The porosity, 1/(.omega..sub.o .tau.), of the movable member is at least about 1.4. The structure is hermetically sealed and is maintained above atmospheric pressure and at a minimum reduced pressure or gas frequency, .omega..sub.g /.omega..sub.o, of about 1.3. To operate with less than 10 percent "ringing," .omega..sub.g /.omega..sub.o >1.3 and 0.25+0.7(.omega..sub.g /.omega..sub.o).sup.2 -0.8(.omega..sub.g /.omega..sub.o -1.25).ltoreq.1/(.omega..sub.o .tau.).ltoreq.0.25+0.7(.omega..sub.g /.omega..sub.o).sup.2 +(.omega..sub.g /.omega..sub.o -1.25).
    • 公开了一种用于高速操作,即大于1MHz的改进的挤压型微机械结构。 该结构具有具有阻尼孔的可动构件。 可移动构件的孔隙率1 /(ωωτ)至少约为1.4。 该结构被气密密封,并保持在大气压以上,压力或气体的最小频率ωg /ωo约为1.3。 使用少于10%的“振铃”操作,ωg / omega o> 1.3和0.25 + 0.7(ωg /ωo)2-0.8(ωg /ωo-1.25)1 /(ωω )