专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明授权

US07670565B2 Building decontamination with vaporous hydrogen peroxide 有权
标题翻译：用蒸汽过氧化氢建造净化
公开(公告)号：US07670565B2
公开(公告)日：2010-03-02
申请号：US12074354
申请日：2008-03-03
申请人： Iain F. McVey , Victor M. Selig , Lewis I. Schwartz , Gerald E. McDonnell , Peter A. Burke
发明人： Iain F. McVey , Victor M. Selig , Lewis I. Schwartz , Gerald E. McDonnell , Peter A. Burke
IPC分类号： A61L2/20
CPC分类号： A61L2/208 , A61L2/24 , A61L9/015 , A61L2202/14 , A61L2202/25 , F24F3/16 , F24F2003/1664
摘要： When microbial contamination is introduced into a room (20*) of an enclosure, such as a building, an HVAC system including supply ductwork (16) and a return ductwork (34) is decontaminated with hydrogen peroxide vapor. A decontamination controller (46) operates controllable baffles (22) at outlet registers (20), temporary controllable baffles (44) at inlet registers (30), and a blower system (10) to circulate hydrogen peroxide vapor from hydrogen peroxide vapor generators (42) through the ductwork in both forward and reverse directions. Further, at least portions of the baffles are closed to create dwell times in which the hydrogen peroxide vapor resides in the ductwork with minimal or turbulent flow.
摘要翻译：当将微生物污染物引入诸如建筑物的外壳的房间（20 *）中时，包括供应管道系统（16）和回流管道系统（34）的HVAC系统用过氧化氢蒸气去污。净化控制器（46）在出口寄存器（20），入口寄存器（30）处的临时可控挡板（44）和用于使来自过氧化氢蒸汽发生器的过氧化氢蒸气循环的鼓风机系统（10）上操作可控挡板（22） 42）通过管道系统在正向和反向两个方向。此外，挡板的至少一部分被关闭以产生停留时间，其中过氧化氢蒸汽驻留在具有最小或湍流的管道系统中。

52. 发明申请

US20080157217A1 SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE 有权
标题翻译：半导体元件及其制造方法
公开(公告)号：US20080157217A1
公开(公告)日：2008-07-03
申请号：US11618363
申请日：2006-12-29
申请人： Peter A. Burke , Sallie Hose , Sudhama C. Shastri
发明人： Peter A. Burke , Sallie Hose , Sudhama C. Shastri
IPC分类号： H01L29/94 , H01L21/20
CPC分类号： H01L23/5223 , H01L21/76801 , H01L21/76807 , H01L21/76846 , H01L23/5227 , H01L23/5228 , H01L23/53238 , H01L28/20 , H01L28/40 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor component that includes an integrated passive device and method for manufacturing the semiconductor component. Vertically integrated passive devices are manufactured above a substrate. In accordance with one embodiment, a resistor is manufactured in a first level above a substrate, a capacitor is manufactured in a second level that is vertically above the first level, and a copper inductor is manufactured in a third level that is vertically above the second level. The capacitor has aluminum plates. In accordance with another embodiment, a resistor is manufactured in a first level above a substrate, a copper inductor is manufactured in a second level that is vertically above the first level, and a capacitor is manufactured in a third level that is vertically above the second level. The capacitor may have aluminum plates or a portion of the copper inductor may serve as one of its plates.
摘要翻译：一种包括集成无源器件的半导体部件和用于制造半导体部件的方法。在衬底上方制造垂直集成的无源器件。根据一个实施例，在基板上方的第一电平中制造电阻器，在垂直于第一电平的第二电平上制造电容器，并且在垂直于第二电平的第三电平上制造铜电感器水平。电容器有铝板。根据另一个实施例，在基板上方的第一电平中制造电阻器，在垂直于第一电平的第二电平上制造铜电感器，并且制造在垂直于第二电平的第三电平的电容器水平。电容器可以具有铝板，或者铜电感器的一部分可以用作其板之一。

53. 发明授权

US07135142B2 Filter assembly for a reprocessor 有权
标题翻译：用于再处理器的过滤组件
公开(公告)号：US07135142B2
公开(公告)日：2006-11-14
申请号：US10633343
申请日：2003-08-01
申请人： Peter A. Burke , Karl F. Ludwig , Jude A. Kral , Francis J. Zelina
发明人： Peter A. Burke , Karl F. Ludwig , Jude A. Kral , Francis J. Zelina
IPC分类号： A61L2/18
CPC分类号： C02F1/444 , A61L2/022 , A61L2/16 , A61L2/18 , C02F1/001 , C02F1/32 , C02F1/44 , C02F1/50 , C02F1/688 , C02F1/722 , C02F9/00 , C02F2301/08
摘要： A reprocessor having a circulation system for circulating a microbial deactivation fluid through a chamber that forms a part of the circulation system. The reprocessor includes a water filtration system for filtering water used in the reprocessor. The water filtration system includes a fluid feed line connectable to a source of pressurized water. A first filter and second filter elements are disposed in the fluid feed line for filtering fluids flowing therethrough. The second filter element is downstream from the first filter element and has the capacity to filter particles smaller than the first filter element. The fluid feed line forms a fluid path for water entering the reprocessor, and defines a portion of a path for microbial deactivation fluid circulated through the circulation system.
摘要翻译：一种具有循环系统的再处理器，用于使微生物灭活流体循环通过形成循环系统的一部分的室。再处理器包括用于过滤重新处理器中使用的水的过滤系统。水过滤系统包括可连接到加压水源的流体供给管线。第一过滤器和第二过滤器元件设置在流体供给管线中，用于过滤流过其中的流体。第二过滤元件在第一过滤器元件的下游，并且具有过滤小于第一过滤元件的颗粒的能力。流体供给管路形成用于进入再处理器的水的流体路径，并且限定通过循环系统循环的微生物去活化流体的路径的一部分。

54. 发明授权

US07086403B2 Condom with male genital desensitizer lubricant 有权
公开(公告)号：US07086403B2
公开(公告)日：2006-08-08
申请号：US10002442
申请日：2001-11-15
申请人： Michael J. Harrison , Dennis Blum , Gisela McBride , Stephen L. Coulter , Peter A. Burke
发明人： Michael J. Harrison , Dennis Blum , Gisela McBride , Stephen L. Coulter , Peter A. Burke
IPC分类号： A61F6/04
CPC分类号： A61F6/04 , A61F2006/048 , A61K9/0034 , Y10S128/918
摘要： A condom having a first lubricating composition containing a male genitalia desensitizing agent on the inside surface thereof and a second lubricating composition on the outside surface thereof. The first lubricating composition has a higher viscosity than the second lubricating composition so that the first lubricating composition remains on the inside surface of the condom during packaging, shipping, storage, and use.

55. 发明授权

US06964924B1 Integrated circuit process monitoring and metrology system 失效
标题翻译：集成电路过程监控与计量系统
公开(公告)号：US06964924B1
公开(公告)日：2005-11-15
申请号：US09952790
申请日：2001-09-11
申请人： Peter A. Burke , Eric J. Kirchner , James R. B. Elmer
发明人： Peter A. Burke , Eric J. Kirchner , James R. B. Elmer
IPC分类号： H01L21/302 , H01L21/3105 , H01L21/66 , H01L21/76 , H01L23/544
CPC分类号： H01L22/34 , H01L21/31053
摘要： A method for monitoring polishing process parameters for an integrated circuit structure on a substrate. A first metrology site is constructed on the substrate. The first metrology site represents a design extreme of a high density integrated circuit structure. The first metrology site is formed by placing a relatively small horizontal surface area trench within a relatively large surface area field of a polish stop material. A second metrology site is also constructed on the substrate. The second metrology site represents a design extreme of a low density integrated circuit structure. The second metrology site is formed by placing a relatively large horizontal surface area trench within a relatively small surface area field of a polish stop material. The substrate is covered with a layer of an insulating material, thereby at least filling the trenches. A target thickness of the insulating material necessary to leave the trenches substantially filled to a top surface of the field of polish stop material is calculated. The substrate is polished until a first thickness of the insulating material in the trench of the first metrology site is no more than the target thickness. A second thickness of the insulating material in the trench of the second metrology site is measured, and values based on the first thickness and the second thickness are monitored as the polishing process parameters for the integrated circuit structure.
摘要翻译：一种用于监测基板上的集成电路结构的抛光工艺参数的方法。第一个计量站点被构建在基板上。第一个测量站点代表了高密度集成电路结构的设计极限。第一计量站点是通过在抛光停止材料的相对大的表面区域内放置相对较小的水平表面区域沟槽而形成的。第二个计量站点也在基板上构建。第二个测量站点是低密度集成电路结构的设计极限。第二计量站点通过在抛光停止材料的相对小的表面区域内放置相对较大的水平表面区域沟槽而形成。衬底被绝缘材料层覆盖，从而至少填充沟槽。计算出将沟槽基本上填充到抛光停止材料领域的顶表面所需的绝缘材料的目标厚度。抛光衬底直到第一测量点的沟槽中的绝缘材料的第一厚度不超过目标厚度。测量第二测量位置的沟槽中的绝缘材料的第二厚度，并且监测基于第一厚度和第二厚度的值作为用于集成电路结构的抛光工艺参数。

56. 发明授权

US06860802B1 Polishing pads for chemical mechanical planarization 有权
标题翻译：抛光垫用于化学机械平面化
公开(公告)号：US06860802B1
公开(公告)日：2005-03-01
申请号：US09608537
申请日：2000-06-30
申请人： Arun Vishwanathan , David B. James , Lee Melbourne Cook , Peter A. Burke , David Shidner
发明人： Arun Vishwanathan , David B. James , Lee Melbourne Cook , Peter A. Burke , David Shidner
IPC分类号： B24B37/04 , B24D3/28 , B24D13/14 , B24D11/00
CPC分类号： B24B37/26 , B24B37/042 , B24D3/28
摘要： An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning. The benefits of such a polishing pad are low dishing of metal features, low oxide erosion, reduced pad conditioning, longer pad life, high metal removal rates, good planarization, and lower defectivity (scratches and Light Point Defects).
摘要翻译：用于在半导体晶片上抛光金属镶嵌结构的改进的焊盘和工艺。该方法包括以下步骤：将聚合物片材的表面压在聚合物片材的表面上，并与含有亚微米级颗粒的含水基液体组合，并提供在压力下使晶片和抛光垫片相对运动的装置，接触导致平面去除所述晶片的表面，其中抛光垫在去除所述负载时具有低的弹性恢复，使得片材的机械响应大大无弹性。改进的焊盘的特征在于具有高的能量耗散以及高焊盘刚度。该垫具有稳定的形态，可以容易且一致地再现。垫表面抵抗玻璃窗，从而需要较少的频繁和较不积极的调理。这种抛光垫的优点是金属特征的低凹陷，低氧化物侵蚀，减少的焊盘调节，更长的焊盘寿命，高金属去除速率，良好的平坦化和较低的缺陷（划痕和光点缺陷）。

57. 发明授权

US06642597B1 Inter-layer interconnection structure for large electrical connections 有权
标题翻译：用于大型电气连接的层间互连结构
公开(公告)号：US06642597B1
公开(公告)日：2003-11-04
申请号：US10272767
申请日：2002-10-16
申请人： Peter A. Burke , William K. Barth
发明人： Peter A. Burke , William K. Barth
IPC分类号： H01L3100
CPC分类号： H01L23/5226 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the invention include an electrical interconnection structure for connection to large electrical contacts. The electrical interconnection includes a semiconductor substrate having a conductive pad layer formed thereon. A dielectric layer having a plurality of elongate trenches is formed over the conductive pad layer such that the elongate trenches extend through the dielectric layer to the underlying conductive pad layer. Elongate conductive contacts are formed in the elongate trenches to establish electrical connections to the underlying conductive pad layer. The long axes of the elongate bar trenches can be arranged substantially parallel to the long axes of the slots formed in the copper pad. Alternatively, the long axes of the bar trenches can be arranged transversely to the long axes of the slots formed in the copper pad. In some embodiments, the conductive contacts are formed such that they establish electrical connection with sidewalls of the underlying conductive pad layer. Other embodiments address the methods of manufacturing the electrical interconnection structures of the present invention.
摘要翻译：本发明的实施例包括用于连接到大电触头的电互连结构。电互连包括其上形成有导电焊盘层的半导体衬底。具有多个细长沟槽的电介质层形成在导电焊盘层上方，使得细长的沟槽延伸通过介电层延伸到下面的导电焊盘层。在细长的沟槽中形成细长的导电触点以建立与下面的导电焊盘层的电连接。细长条沟的长轴可以布置成基本上平行于形成在铜垫中的槽的长轴。或者，条形沟槽的长轴可以横向于形成在铜垫中的槽的长轴布置。在一些实施例中，导电触点形成为使得它们与下面的导电焊盘层的侧壁建立电连接。其他实施例涉及制造本发明的电互连结构的方法。

58. 发明授权

US06582283B2 Polishing pads for chemical mechanical planarization 有权
公开(公告)号：US06582283B2
公开(公告)日：2003-06-24
申请号：US10193429
申请日：2002-07-11
申请人： David B. James , Arun Vishwanathan , Lee Melbourne Cook , Peter A. Burke , David Shidner
发明人： David B. James , Arun Vishwanathan , Lee Melbourne Cook , Peter A. Burke , David Shidner
IPC分类号： B24B100
CPC分类号： B24B37/26 , B24B37/042 , B24D3/28
摘要： An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning. The benefits of such a polishing pad are low dishing of metal features, low oxide erosion, reduced pad conditioning, longer pad life, high metal removal rates, good planarization, and lower defectivity (scratches and Light Point Defects).

59. 发明授权

US6106661A Polishing pad having a wear level indicator and system using the same 失效
标题翻译：具有磨损水平指示器的抛光垫和使用它的系统
公开(公告)号：US6106661A
公开(公告)日：2000-08-22
申请号：US74892
申请日：1998-05-08
申请人： Christopher H. Raeder , Kevin D. Shipley , Peter A. Burke
发明人： Christopher H. Raeder , Kevin D. Shipley , Peter A. Burke
IPC分类号： B24B37/26 , B24D13/14 , C23F1/02
CPC分类号： B24B37/26
摘要： A polishing pad having a wear level indicator and a polishing system employing the same is provided. A polishing pad, in accordance with one embodiment of the invention, includes a pad structure and an indicator, disposed in the pad structure, indicating the wear level of the pad structure. The pad structure may, for example, include a top pad and a bottom pad with the indicator being disposed in the top pad. The wear level may, for example, be a critical thickness of the polishing pad which indicates the end of the pad lifetime or which indicates the need to change polishing processing. The use of a wear level indicator allows for efficient and reliable pad wear level indication.
摘要翻译：提供了一种具有磨损水平指示器和使用其的抛光系统的抛光垫。根据本发明的一个实施例的抛光垫包括设置在垫结构中的衬垫结构和指示器，指示衬垫结构的磨损水平。垫结构可以例如包括顶垫和底垫，其中指示器设置在顶垫中。磨损水平可以例如是抛光垫的临界厚度，其指示焊盘寿命的结束或者指示需要改变抛光处理。使用磨损水平指示器可以实现高效可靠的垫磨损水平指示。

60. 发明授权

US5645469A Polishing pad with radially extending tapered channels 失效
标题翻译：具有径向延伸锥形通道的抛光垫
公开(公告)号：US5645469A
公开(公告)日：1997-07-08
申请号：US709179
申请日：1996-09-06
申请人： Peter A. Burke , Bradley J. Yellitz
发明人： Peter A. Burke , Bradley J. Yellitz
IPC分类号： B24B37/26 , B24B1/00
CPC分类号： B24B37/26
摘要： A polishing pad having a polishing surface with radially extending tapered channels is disclosed. The polishing surface includes an inner radius within an outer radius, and the channels extend from the inner radius to the outer radius. Preferably, the outer radius is spaced from an outer circumferential edge of the polishing surface, the inner radius is an inner circumferential edge of the polishing surface, and the channels taper laterally and vertically at the outer radius. The channels are dimensioned and configured to direct slurry from the inner radius to the outer radius. The channels can be shaped with opposing sidewalls that are parallel in a first portion and diagonally converge in a second portion to form a sunburst pattern, or alternatively, with opposing sidewalls that continuously curve in a first rotational direction to form a starfish pattern. A polishing method includes positioning a wafer over the outer radius while introducing a slurry to facilitate polishing the wafer, and positioning the wafer inside the outer radius while introducing a cleaning fluid to facilitate cleaning the wafer.
摘要翻译：公开了具有带径向延伸的锥形通道的抛光表面的抛光垫。抛光表面包括在外半径内的内半径，并且通道从内半径延伸到外半径。优选地，外半径与抛光表面的外圆周边缘间隔开，内半径是抛光表面的内圆周边缘，并且通道在外半径处横向和垂直地缩小。通道的尺寸和构造用于将浆料从内半径引导到外半径。通道可以被成形为具有在第一部分中平行并且在第二部分中对角地会聚以形成阳光照射图案的相对侧壁，或者可选地，具有在第一旋转方向上连续弯曲以形成海星图案的相对侧壁。抛光方法包括将晶片定位在外半径上，同时引入浆料以便于抛光晶片，并且将晶片定位在外半径内，同时引入清洁流体以便于清洁晶片。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式