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51. 发明授权

US6104229A High voltage tolerable input buffer and method for operating same 失效
标题翻译：高电压容忍输入缓冲器及其操作方法
公开(公告)号：US6104229A
公开(公告)日：2000-08-15
申请号：US649898
申请日：1996-05-02
申请人： Chuen-Der Lien
发明人： Chuen-Der Lien
IPC分类号： H03K19/003 , H03K19/0185 , H03K19/094
CPC分类号： H03K19/00315
摘要： An input buffer for use in an integrated circuit having a V.sub.CC voltage supply and a V.sub.SS voltage supply. The input buffer includes a p-channel field effect transistor (FET) having a source region coupled to the V.sub.CC voltage supply, a drain region coupled to a bias circuit, and a gate electrode coupled to an input terminal. The bias circuit maintains a voltage at the drain region of the p-channel FET which is slightly greater than the V.sub.SS supply voltage when a logic high voltage is applied to the input terminal. In an alternate embodiment, the input buffer includes an n-channel FET having a drain region coupled to the V.sub.CC voltage supply, a source region coupled to the output terminal and a gate electrode coupled to the input terminal. The bias circuit maintains a voltage at the source of the n-channel FET which is greater than the V.sub.SS supply voltage when a logic low voltage is applied to the input terminal.
摘要翻译：一种用于具有VCC电压源和VSS电压源的集成电路中的输入缓冲器。输入缓冲器包括具有耦合到VCC电压源的源极区域，耦合到偏置电路的漏极区域和耦合到输入端子的栅极电极的p沟道场效应晶体管（FET）。当逻辑高电压施加到输入端子时，偏置电路在p沟道FET的漏极区域保持稍大于VSS电源电压的电压。在替代实施例中，输入缓冲器包括具有耦合到VCC电压源的漏极区域的n沟道FET，耦合到输出端子的源极区域和耦合到输入端子的栅极电极。当向输入端子施加逻辑低电压时，偏置电路在n沟道FET的源极处保持大于VSS电源电压的电压。

52. 发明授权

US5989991A Methods for fabricating a bonding pad having improved adhesion to an underlying structure 失效
标题翻译：用于制造具有改进的与底层结构的粘合性的焊盘的方法
公开(公告)号：US5989991A
公开(公告)日：1999-11-23
申请号：US879562
申请日：1997-06-20
申请人： Chuen-Der Lien
发明人： Chuen-Der Lien
IPC分类号： H01L23/485 , H01L21/44
CPC分类号： H01L24/05 , H01L24/48 , H01L2224/04042 , H01L2224/05124 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/05666 , H01L2224/45124 , H01L2224/45144 , H01L2224/4807 , H01L2224/48453 , H01L2224/48463 , H01L2224/48624 , H01L2224/48666 , H01L2224/48724 , H01L2224/48766 , H01L2224/85201 , H01L2224/85205 , H01L24/45 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/04941 , H01L2924/13091 , H01L2924/14
摘要： An insulating layer having an irregular upper surface is provided to improve the adhesion and increase the coefficient of friction between the insulating layer and a bonding pad formed over the insulating layer. By making the upper surface of the insulating layer irregular, the area of contact between the bonding pad and the insulating layer is increased. As a result, the adhesion between the bonding pad and the insulating layer is also increased. This prevents the bonding pad from being detached from the insulating layer when a bonding wire is later attached to the bonding pad. The upper surface of the insulating layer can be made irregular by etching one or more cavities in the upper surface of the insulating layer. The upper surface of the insulating layer can alternatively be made irregular by forming one or more raised structures beneath the insulating layer. The raised structures cause plateaus to be formed at the upper surface of the insulating layer.
摘要翻译：提供具有不规则上表面的绝缘层以改善粘附性并增加绝缘层和形成在绝缘层上的焊盘之间的摩擦系数。通过使绝缘层的上表面不规则，焊盘和绝缘层之间的接触面积增加。结果，焊盘和绝缘层之间的粘附性也增加。这样当接合线稍后连接到接合焊盘时，这防止了接合焊盘与绝缘层分离。通过蚀刻绝缘层的上表面中的一个或多个空腔，可以使绝缘层的上表面不规则。绝缘层的上表面可以可选地通过在绝缘层下方形成一个或多个凸起结构而制成不规则的。凸起的结构导致在绝缘层的上表面形成高原。

53. 发明授权

US5949127A Electrically programmable interlevel fusible link for integrated circuits 失效
标题翻译：用于集成电路的电可编程的层间可熔链路
公开(公告)号：US5949127A
公开(公告)日：1999-09-07
申请号：US870333
申请日：1997-06-06
申请人： Chuen-Der Lien , Anita M. Hansen , David J. Pilling
发明人： Chuen-Der Lien , Anita M. Hansen , David J. Pilling
IPC分类号： H01L23/525 , H01L29/94
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/3011
摘要： In a multi-level interconnect structure, a fusible material fills an opening in an isolation layer disposed between two interconnect levels or between an interconnect level and a device layer. The opening which may be, for example, a contact hole or a via, may be fabricated using processes generally used to fabricate normally sized vias and contact holes. The opening has a cross-sectional area A reduced by a factor of x relative to normally sized openings. Because the fusible interlevel interconnection has a reduced cross-sectional area, a programming current develops a destructive programming current density within fusible interlevel interconnection while current densities in coupled conductors, including normally sized vias and contacts, remain within long term reliability limits. Read/write circuitry connected to the fusible interlevel interconnection supports the programming current and supports a read current. The read current is regulated such that a responsive current density in a nonprogrammed fusible interlevel interconnection does not exceed long term reliability limits.
摘要翻译：在多层互连结构中，可熔材料填充设置在两个互连层之间或互连层与器件层之间的隔离层中的开口。可以使用通常用于制造通常尺寸的通孔和接触孔的工艺来制造可以是例如接触孔或通孔的开口。开口具有相对于正常尺寸的开口减小X因子的横截面面积A. 由于易熔层间互连具有减小的横截面积，因此编程电流在易熔层间互连中产生破坏性编程电流密度，而耦合导体（包括通常尺寸的通孔和触点）中的电流密度仍然保持在长期可靠性限度内。连接到易熔层互连的读/写电路支持编程电流并支持读取电流。读取电流被调节，使得非编程的可熔层间互连中的响应电流密度不超过长期可靠性限制。

54. 发明授权

US5834125A Non-reactive anti-reflection coating 失效
标题翻译：非反应性防反射涂层
公开(公告)号：US5834125A
公开(公告)日：1998-11-10
申请号：US78929
申请日：1993-06-16
申请人： Chuen-Der Lien
发明人： Chuen-Der Lien
IPC分类号： G03F7/09 , H01L21/027 , H01L21/3213 , B32B17/00
CPC分类号： G03F7/091 , H01L21/0276 , H01L21/3213 , G03F7/09 , Y10T428/24917 , Y10T428/24926 , Y10T428/31667
摘要： An anti-reflection coating is provided that has a barrier layer and an anti-reflective layer. The barrier layer stops reactions between the anti-reflective layer and underlying layers or substrates, does not make the anti-reflective layer reflective, and preferably does not react with either the reflective layer or the anti-reflective layer. In particular embodiments, the barrier layer is a thin layer of silicon dioxide SiO.sub.2 or silicon nitride Si.sub.3 N.sub.4, and the anti-reflective layer is titanium-tungsten TiW, titanium nitride TiN, or amorphous silicon.
摘要翻译：提供了具有阻挡层和抗反射层的抗反射涂层。阻挡层停止抗反射层与下层或基底之间的反应，不使防反射层反射，并且优选不与反射层或抗反射层反应。在具体实施方案中，阻挡层是二氧化硅SiO 2或氮化硅Si 3 N 4的薄层，抗反射层是钛 - 钨TiW，氮化钛TiN或非晶硅。

55. 发明授权

US5750424A Method for fabricating a CMOS device 失效
标题翻译： CMOS器件制造方法
公开(公告)号：US5750424A
公开(公告)日：1998-05-12
申请号：US764662
申请日：1996-12-10
申请人： Jeong Yeol Choi , Chung-Jen Chien , Chung-Chyung Han , Chuen-Der Lien
发明人： Jeong Yeol Choi , Chung-Jen Chien , Chung-Chyung Han , Chuen-Der Lien
IPC分类号： H01L21/762 , H01L21/8238
CPC分类号： H01L21/823864 , H01L21/76202 , H01L21/823814 , H01L21/823871 , H01L21/823892
摘要： A process for fabricating a CMOS structure using a single masking step to define lightly-doped source and drain regions for both N- and P-channel devices. The process forms disposable spacers adjacent to gate structures and at least one retrograde well. Retrograde wells are formed using one or more charged ions at different energy levels. In addition, heavily-doped source and drain regions are formed using blanket implants of two different conductivities into a semiconductor substrate having two contiguous wells of opposite conductivity type. By blanket implanting a first dopant into both wells, and then selectively implanting a second dopant, the diffusion of the second dopant is partially suppressed by the first dopant. The partial suppression of first dopant results in shallow implants being formed. Also disclosed is a process for forming contact openings and contact implants.
摘要翻译：一种使用单个掩模步骤制造CMOS结构以定义用于N沟道和P沟道器件的轻掺杂源极和漏极区的工艺。该过程形成邻近门结构和至少一个逆行井的一次性间隔物。使用不同能级的一种或多种带电离子形成逆行阱。此外，使用具有两个不同导电性的覆盖植入物形成具有相反导电类型的两个连续的阱的半导体衬底，形成重掺杂源极和漏极区域。通过将第一掺杂剂一次性地注入两个孔中，然后选择性地注入第二掺杂剂，第二掺杂剂的扩散部分被第一掺杂剂抑制。第一掺杂物的部分抑制导致形成浅的植入物。还公开了一种用于形成接触开口和接触植入物的方法。

56. 发明授权

US5729419A Changed device model electrostatic discharge protection circuit for output drivers and method of implementing same 失效
标题翻译：改变输出驱动器的器件型静电放电保护电路及其实现方法
公开(公告)号：US5729419A
公开(公告)日：1998-03-17
申请号：US560608
申请日：1995-11-20
申请人： Chuen-Der Lien
发明人： Chuen-Der Lien
IPC分类号： H03K17/082 , H02H9/00
CPC分类号： H03K17/0822
摘要： An output circuit for an integrated circuit which provides protection for the integrated circuit during a charged device model (CDM) electrostatic discharge (ESD) event. The output circuit includes a first FET connected across a first voltage supply rail (V.sub.CC or ground) and an output pad. A first driving circuit drives the gate of the first transistor. One or more CDM ESD protection circuits are connected between the gate of the first transistor and the output pad. These protection circuits provide relatively low impedance current paths which minimize current flow through the gate oxide layer of the first FET during a CDM ESD event.
摘要翻译：一种用于集成电路的输出电路，其在充电装置模型（CDM）静电放电（ESD））事件期间为集成电路提供保护。输出电路包括跨第一电压供电轨（VCC或地）连接的第一FET和输出垫。第一驱动电路驱动第一晶体管的栅极。一个或多个CDM ESD保护电路连接在第一晶体管的栅极和输出焊盘之间。这些保护电路提供相对低阻抗的电流路径，其在CDM ESD事件期间最小化通过第一FET的栅极氧化物层的电流。

57. 发明授权

US5723822A Structure for fabricating a bonding pad having improved adhesion to an underlying structure 失效
标题翻译：用于制造具有改进的与底层结构的粘附性的焊盘的结构
公开(公告)号：US5723822A
公开(公告)日：1998-03-03
申请号：US409784
申请日：1995-03-24
申请人： Chuen-Der Lien
发明人： Chuen-Der Lien
IPC分类号： H01L23/485 , H05K1/00
CPC分类号： H01L24/05 , H01L24/48 , H01L2224/04042 , H01L2224/05124 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/05666 , H01L2224/45124 , H01L2224/45144 , H01L2224/4807 , H01L2224/48453 , H01L2224/48463 , H01L2224/48624 , H01L2224/48666 , H01L2224/48724 , H01L2224/48766 , H01L2224/85201 , H01L2224/85205 , H01L24/45 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/04941 , H01L2924/13091 , H01L2924/14
摘要： An insulating layer having an irregular upper surface is provided to improve the adhesion and increase the coefficient of friction between the insulating layer and a bonding pad formed over the insulating layer. By making the upper surface of the insulating layer irregular, the area of contact between the bonding pad and the insulating layer is increased. As a result, the adhesion between the bonding pad and the insulating layer is also increased. This prevents the bonding pad from being detached from the insulating layer when a bonding wire is later attached to the bonding pad. The upper surface of the insulating layer can be made irregular by etching one or more cavities in the upper surface of the insulating layer. The upper surface of the insulating layer can alternatively be made irregular by forming one or more raised structures beneath the insulating layer. The raised structures cause plateaus to be formed at the upper surface of the insulating layer.
摘要翻译：提供具有不规则上表面的绝缘层以改善粘附性并增加绝缘层和形成在绝缘层上的焊盘之间的摩擦系数。通过使绝缘层的上表面不规则，焊盘和绝缘层之间的接触面积增加。结果，焊盘和绝缘层之间的粘附性也增加。这样当接合线稍后连接到接合焊盘时，这防止了接合焊盘与绝缘层分离。通过蚀刻绝缘层的上表面中的一个或多个空腔，可以使绝缘层的上表面不规则。绝缘层的上表面可以可选地通过在绝缘层下方形成一个或多个凸起结构而制成不规则的。凸起的结构导致在绝缘层的上表面形成高原。

58. 发明授权

US5654213A Method for fabricating a CMOS device 失效
标题翻译： CMOS器件制造方法
公开(公告)号：US5654213A
公开(公告)日：1997-08-05
申请号：US538533
申请日：1995-10-03
申请人： Jeong Yeol Choi , Chung-Jen Chien , Chung-Chyung Han , Chuen-Der Lien
发明人： Jeong Yeol Choi , Chung-Jen Chien , Chung-Chyung Han , Chuen-Der Lien
IPC分类号： H01L21/762 , H01L21/8238 , H01L21/265
CPC分类号： H01L21/823864 , H01L21/76202 , H01L21/823814 , H01L21/823871 , H01L21/823892
摘要： A process for fabricating a CMOS structure using a single masking step to define lightly-doped source and drain regions for both N- and P-channel devices. The process forms disposable spacers adjacent to gate structures and at least one retrograde well. Retrograde wells are formed using one or more charged ions at different energy levels. In addition, heavily-doped source and drain regions are formed using blanket implants of two different conductivities into a semiconductor substrate having two contiguous wells of opposite conductivity type. By blanket implanting a first dopant into both wells, and then selectively implanting a second dopant, the diffusion of the second dopant is partially suppressed by the first dopant. The partial suppression of first dopant results in shallow implants being formed. Also disclosed is a process for forming contact openings and contact implants.
摘要翻译：一种使用单个掩模步骤制造CMOS结构以定义用于N沟道和P沟道器件的轻掺杂源极和漏极区的工艺。该过程形成邻近门结构和至少一个逆行井的一次性间隔物。使用不同能级的一种或多种带电离子形成逆行阱。此外，使用具有两个不同导电性的覆盖植入物形成具有相反导电类型的两个连续的阱的半导体衬底，形成重掺杂源极和漏极区域。通过将第一掺杂剂一次性地注入两个孔中，然后选择性地注入第二掺杂剂，第二掺杂剂的扩散部分被第一掺杂剂抑制。第一掺杂物的部分抑制导致形成浅的植入物。还公开了一种用于形成接触开口和接触植入物的方法。

59. 发明授权

US5514613A Parallel manufacturing of semiconductor devices and the resulting structure 失效
标题翻译：并联制造半导体器件及其结构
公开(公告)号：US5514613A
公开(公告)日：1996-05-07
申请号：US189024
申请日：1994-01-27
申请人： Joseph F. Santadrea , Ji-Min Lee , Chuen-Der Lien , Alan H. Huggins
发明人： Joseph F. Santadrea , Ji-Min Lee , Chuen-Der Lien , Alan H. Huggins
IPC分类号： H01L21/66 , H01L21/68 , H01L21/768
CPC分类号： H01L21/6835 , H01L22/20 , H01L2221/68359 , H01L2221/68363 , H01L2924/014 , H01L2924/10253 , H01L2924/19041 , H01L2924/30105
摘要： In accordance with this invention, integrated circuits are manufactured using parallel processing to manufacture separately selected parts of finished integrated circuits. Upon completion of the parts, the parts are joined together to form the completed integrated circuit. For example, a semiconductor wafer containing active and passive semiconductor regions is fabricated through the first layer of insulation and first conductive contacts. Separately, an interconnect structure is fabricated on a separate fabrication line to include all the layers of interconnects required to form a completed integrated circuit when joined to the wafer. The interconnect structure is joined to the wafer to form the complete integrated device. The interconnect structure can be fabricated to exclude from the integrated circuit those portions of the wafer which have been determined by test to be defective.
摘要翻译：根据本发明，使用并行处理制造集成电路，以制造成品集成电路的分开选择的部分。零件完成后，零件连接在一起形成完整的集成电路。例如，通过第一绝缘层和第一导电触点制造包含有源和无源半导体区域的半导体晶片。另外，在单独的制造线上制造互连结构，以包括当连接到晶片时形成完整的集成电路所需的所有互连层。互连结构连接到晶片以形成完整的集成器件。可以制造互连结构以从集成电路排除已经通过测试确定为缺陷的晶片的那些部分。

60. 发明授权

US5471094A Self-aligned via structure 失效
标题翻译：自对准通孔结构
公开(公告)号：US5471094A
公开(公告)日：1995-11-28
申请号：US201437
申请日：1994-02-24
申请人： Chuen-Der Lien
发明人： Chuen-Der Lien
IPC分类号： H01L23/522 , H01L27/11 , H01L23/48 , H01L23/52 , H01L29/76
CPC分类号： H01L27/1112 , H01L23/5226 , H01L27/11 , H01L2924/0002 , Y10S257/903
摘要： A self-aligned via between interconnect layers in an integrated circuit allows a less precise masking alignment to be used to fabricate an integrated circuit with increased packing density and improved yield. In one embodiment, self-aligned vias are used to connect first and second interconnect layers in an SRAM memory cell.
摘要翻译：集成电路中的互连层之间的自对准通孔允许使用较不精确的掩模对准来制造具有增加的封装密度和提高的产量的集成电路。在一个实施例中，自对准通孔用于连接SRAM存储单元中的第一和第二互连层。

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