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    • 53. 发明授权
    • Optical recording track access driving apparatus
    • 光记录轨道存取驱动装置
    • US5335214A
    • 1994-08-02
    • US923745
    • 1992-07-28
    • Hirotsugu MatobaMasaru NomuraTakeshi Yamaguchi
    • Hirotsugu MatobaMasaru NomuraTakeshi Yamaguchi
    • G11B7/085G11B21/08G11B7/09
    • G11B7/08541
    • An optical recording medium driving apparatus has the first high-pass filter for outputting a low frequency component removed signal by removing a low frequency component from a reproduction signal varying depending on a reflected light beam from the optical recording medium. The low frequency component removed signal changes due to transient response just after an access operation starts. Zero voltage is inputted to the second high-pass filter during a tracking operation while a voltage having a negative polarity which is substantially the same amplitude as the AC component of the low frequency component removed signal is inputted to the second high-pass filter. The first high-pass filter has the same time constant as the second high-pass filter. Just after the access operation starts, the negative voltage has the same transient response as the output of the first high-pass filter. The output of the first high-pass filter is compared to the output of the second high-pass filter in order to have a binary signal of the binary logic condition. A land is discriminated from a groove according to the binary signal, thereby enabling to access a target track in accuracy.
    • 光记录介质驱动装置具有第一高通滤波器,用于通过从根据来自光记录介质的反射光束变化的再现信号中去除低频分量来输出低频分量去除信号。 低频分量消除信号由于在访问操作开始后的瞬态响应而改变。 在跟踪操作期间将零电压输入到第二高通滤波器,而具有与低频分量去除信号的AC分量基本上相同幅度的负极性的电压被输入到第二高通滤波器。 第一高通滤波器具有与第二高通滤波器相同的时间常数。 在访问操作开始之后,负电压具有与第一高通滤波器的输出相同的瞬态响应。 将第一高通滤波器的输出与第二高通滤波器的输出进行比较,以便具有二进制逻辑条件的二进制信号。 根据二进制信号区域与凹槽区分开,从而能够准确地访问目标轨道。
    • 60. 发明授权
    • Method of producing an electrical resistant fluid-permeable heat
generating member
    • 电阻液体渗透发热元件的制造方法
    • US4040823A
    • 1977-08-09
    • US675528
    • 1976-04-09
    • Takeshi Yamaguchi
    • Takeshi Yamaguchi
    • B22F3/11C04B35/565C22C1/05F24H1/10H05B3/14B22F1/00
    • B22F3/1121C04B35/565C22C1/051F24H1/101H05B3/148B22F2998/00H05B2203/021
    • A fluid-permeable electrically energized heat generating member of a desired shape, such as a rectangular brick, is formed by (1) mixing (a) about 87 to 94% by weight of a first material which contains about 80 to 95% by weight of SiC and about 5 to 20% by weight of a mixture of carbonyl iron, nickel-chromium alloy, cobalt and carbon; (b) about 5 to 10% by weight of a second material which contains about 75 to 95% by weight of an organic binder material, such as a linseed oil and about 5 to 25% by weight of a foaming material, such as methylene diphenyl isocyanate; and (c) about 0.2 to 3% by weight of a third material selected from the group consisting of polystyrene preformed powder, sawdust, wood flour, starch, corn flour and mixtures thereof; (2) placing the resultant mixture in a select mold and subjecting the mold to curing conditions sufficient to provide self-sustaining members composed of the foregoing mixture; (3) removing the self-sustaining members from the molds and subjecting them to a heat at a temperature in the range of about 250.degree. to 350.degree. F. for a period of time sufficient to render the bodies electrically conductive; (4) sintering the electrically conductive bodies as by passing a controlled electrical current through each member until a temperature in the range of about 1000.degree. to 1600.degree. F. is achieved within the member; and (5) metallizing terminal sides of each member, as by applying an aluminum layer thereon for contact with a suitable electrical circuit.
    • 通过(1)混合(a)约87至94重量%的含有约80至95重量%的第一材料,形成所需形状的流体可渗透的电能发热元件,例如矩形砖 的SiC和约5-20重量%的羰基铁,镍 - 铬合金,钴和碳的混合物; (b)约5至10重量%的第二材料,其包含约75至95重量%的有机粘合剂材料,例如亚麻籽油和约5至25重量%的起泡材料,例如亚甲基 二苯基异氰酸酯; 和(c)约0.2至3重量%的选自聚苯乙烯预制粉末,锯屑,木粉,淀粉,玉米粉及其混合物的第三材料; (2)将所得混合物置于精选模具中,使模具处于足以提供由上述混合物构成的自持构件的固化条件; (3)将自支撑构件从模具中取出并在约250°至350°F范围内的温度下进行加热,持续一段时间足以使机体导电; (4)通过使受控的电流通过每个部件烧结导电体,直到在该部件内实现约1000°至1600°F范围内的温度; 以及(5)通过在其上施加与合适的电路接触的铝层来金属化每个构件的端子侧。