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    • 56. 发明申请
    • HYBRID OPTICAL/ELECTRONIC STRUCTURES FABRICATED BY A COMMON MOLDING PROCESS
    • 由普通模制工艺制成的混合光学/电子结构
    • US20080310799A1
    • 2008-12-18
    • US12143251
    • 2008-06-20
    • Lawrence JacobowitzCasimer DeCusatis
    • Lawrence JacobowitzCasimer DeCusatis
    • G02B6/42B28B13/02G02B27/00
    • B29D11/00365C03B19/02
    • Disclosed is a method of fabricating a molded structure including both micro lenses and metallic pins. The method comprises the steps of providing a mold apparatus having a set of first cavities and a set of second cavities, depositing a first material in the first cavities to form a set of metallic pins, and depositing a second material in the second cavities to form a set of micro lenses. The formed molded structure comprises a substrate, a set of molded microlenses on said substrate, and a set of molded metallic pins on that same substrate. The metallic pins may be formed as alignment pins or as electrical connectors. The invention enables the micro lenses and metallic pins to be manufactured by way of molding on a common substrate for the first time.
    • 公开了一种制造包括微透镜和金属针的模制结构的方法。 该方法包括以下步骤:提供具有一组第一空腔和一组第二空腔的模具设备,在第一空腔中沉积第一材料以形成一组金属销,以及在第二空腔中沉积第二材料以形成 一组微型镜头。 成型的模制结构包括基底,在所述基底上的一组模制的微透镜,以及在同一基底上的一组模制的金属针。 金属销可以形成为对准销或电连接器。 本发明能够通过在公共基板上成型第一次来制造微透镜和金属销。
    • 58. 发明申请
    • Open fiber control and loss of light propagation in time division multiplexed inter-system channel link
    • 在时分复用系统间通道链路中开放光纤控制和光传播损失
    • US20070140696A1
    • 2007-06-21
    • US11314261
    • 2005-12-21
    • Casimer DeCusatisThomas Gregg
    • Casimer DeCusatisThomas Gregg
    • H04J14/08
    • H04J14/08H04J14/02H04J14/0298
    • A method and apparatus for transmitting signals from a plurality of input channels over a TDM optical network, where each of the input channels contains an optical data signal and an electrical control signal containing control information relating to the optical data signal. In accordance with the invention, respective optical receivers convert the optical data signals to respective electrical data signals, which a TDM data multiplexer time-multiplexes to generate a multiplexed data signal. A TDM control signal multiplexer time-multiplexes the electrical control signals to generate a multiplexed control signal that is combined with said multiplexed data signal to generate a composite electrical signal. An optical transmitter generates a composite optical signal from the composite electrical signal that is transmitted over the network, optionally after WDM multiplexing it with other composite optical signals. The corresponding reverse operations are performed at the receiving end to regenerate the original data and control signals.
    • 一种用于通过TDM光网络从多个输入信道传输信号的方法和装置,其中每个输入通道包含光学数据信号和包含与光学数据信号有关的控制信息的电气控制信号。 根据本发明,相应的光接收器将光数据信号转换成相应的电数据信号,TDM数据复用器对其进行时间复用以产生多路复用的数据信号。 TDM控制信号复用器对电气控制信号进行时间复用,以产生与所述多路复用数据信号组合的复用控制信号,以产生复合电信号。 光发射机可以在WDM与其它复合光信号进行多路复用之后,从经网络传输的复合电信号中产生复合光信号。 在接收端执行相应的反向操作,以重新生成原始数据和控制信号。
    • 59. 发明申请
    • Injection molded microoptics
    • 注塑微光学
    • US20070029277A1
    • 2007-02-08
    • US11195147
    • 2005-08-02
    • Lawrence JacobowitzStephen BuchwalterCasimer DeCusatisPeter GruberDa-Yuan Shih
    • Lawrence JacobowitzStephen BuchwalterCasimer DeCusatisPeter GruberDa-Yuan Shih
    • B29D11/00B29C35/08B29C45/00
    • H01L27/14685B29D11/00365B29D11/00461B82Y30/00G02B3/0018G02B3/0056G02F1/137G02F1/29H01L27/14627H01L31/02327H01L33/58
    • A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.
    • 描述了用于在半导体和其他图像显示装置,背板,光电板和集成光学系统上形成,对准和附着微量元件的二维阵列的自动化的晶片级装置和方法。 在有序的制造顺序中,由光学设计的空腔构成的模具板通过反应离子蚀刻或可选的工艺形成,任选地涂覆有释放材料层,并通过自动化流体注入和缺陷检查子系统填充光学特定的材料。 光学校准基准指导所公开的转移和附着过程以实现微光学元件与对应的光电器件和电路之间的特定公差。 本发明适用于光谱滤波器,波导管,光纤模式变压器,衍射光栅,折射透镜,衍射透镜/菲涅耳带片,反射器以及元件和器件的组合,包括微机电系统(MEMS)和液晶器件 (LCD)矩阵,用于自适应,可调元素。 教导界面层性质和附着工艺实施例的制备。