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    • 51. 发明授权
    • Motherboards with integrated cooling
    • 集成冷却主板
    • US07564685B2
    • 2009-07-21
    • US11618611
    • 2006-12-29
    • Jimmy ClidarasWinnie Leung
    • Jimmy ClidarasWinnie Leung
    • H02K7/20F28F7/00
    • H05K7/20727G06F1/206G06F2200/201H05K7/20772
    • A computer apparatus includes a first motherboard having a top surface and a bottom surface and a second motherboard having a top surface and a bottom surface. The motherboards each have mounted thereto components that generate high thermal loads and components that generate low thermal loads. A heat sink is in conductive thermal contact with the top surfaces of the first and second motherboards. Computer components generating high thermal loads are mounted to the top surfaces of the first and second motherboards, and computer components generating low thermal loads are mounted to the bottom surface of one or more of the first and second motherboards.
    • 计算机装置包括具有顶表面和底表面的第一母板和具有顶表面和底表面的第二母板。 主板各自安装有产生高热负荷的部件和产生低热负荷的部件。 散热器与第一和第二主板的顶表面导电热接触。 产生高热负荷的计算机部件被安装到第一和第二母板的顶表面,并且产生低热负荷的计算机部件安装到第一和第二主板中的一个或多个的底表面。
    • 52. 发明授权
    • Data center uninterruptible power distribution architecture
    • 数据中心不间断配电架构
    • US07560831B2
    • 2009-07-14
    • US11756939
    • 2007-06-01
    • William WhittedMontgomery SykoraKen KriegerBenchiao JaiWilliam HamburgenJimmy ClidarasDonald L. BeatyGerald Aigner
    • William WhittedMontgomery SykoraKen KriegerBenchiao JaiWilliam HamburgenJimmy ClidarasDonald L. BeatyGerald Aigner
    • H02J9/00
    • G06F1/30H02J9/061Y02B10/72Y10T307/615Y10T307/625
    • Apparatus and associated method and computer program products involve a highly efficient uninterruptible power distribution architecture to support modular processing units. As an illustrative example, a modular processing unit includes an corresponding uninterruptible power system in which only one AC-to-DC rectification occurs between the utility AC grid and the processing circuit (e.g., microprocessor) loads. In an illustrative data center facility, a power distribution architecture includes a modular array of rack-mountable processing units, each of which has processing circuitry to handle network-related processing tasks. Associated with each modular processing unit is an uninterruptible power supply (UPS) to supply operating power to the network processing circuitry. Each UPS includes a battery selectively connectable across a DC bus, and a AC-to-DC rectifier that converts an AC input voltage to a single output voltage on the DC bus. The regulated DC bus voltage may be close to the battery's fully charged voltage.
    • 装置和相关方法以及计算机程序产品涉及一种高效的不间断配电架构来支持模块化处理单元。 作为说明性示例,模块化处理单元包括相应的不间断电力系统,其中在公用交流电网和处理电路(例如,微处理器)负载之间仅发生一个AC至DC整流。 在说明性数据中心设施中,配电架构包括可机架安装的处理单元的模块化阵列,每个处理单元具有处理网络相关处理任务的处理电路。 与每个模块化处理单元相关联的是不间断电源(UPS),用于向网络处理电路提供工作电源。 每个UPS包括可以跨DC总线选择性连接的电池,以及将AC输入电压转换为DC总线上的单个输出电压的AC至DC整流器。 调节的直流母线电压可能接近电池的完全充电电压。
    • 56. 发明申请
    • Modular Computing Environments
    • 模块化计算环境
    • US20130083476A1
    • 2013-04-04
    • US13544839
    • 2012-07-09
    • Jimmy ClidarasWilliam WhittedWilliam HamburgenMontgomery SykoraWinnie LeungGerald AignerDonald L. Beaty
    • Jimmy ClidarasWilliam WhittedWilliam HamburgenMontgomery SykoraWinnie LeungGerald AignerDonald L. Beaty
    • H05K7/20
    • H05K7/202G06F1/20G06F2200/201H05K7/1497H05K7/20754H05K7/2079
    • A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releaseably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.
    • 计算机系统可以包括具有多个对接区域并且被配置为向每个对接区域提供电力,数据网络接口,冷却流体供应和冷却流体返回的连接毂; 以及多个运输容器,每个运输容器都包围向计算机系统增加计算能力的模块化计算环境。 每个运输容器可以包括:a)耦合到数据网络接口的多个处理单元,每个处理单元包括微处理器; b)热交换器,其被配置为通过使来自所述供应器的冷却流体通过所述热交换器循环并将其排出到所述回流中来除去由所述多个处理单元产生的热量; 以及c)对接构件,其构造成在一个对接区域处可释放地联接到所述连接毂,以接收电力,连接到所述数据网络接口,以及接收和排出冷却流体。
    • 57. 发明申请
    • Blended Water-Based Data Center Cooling
    • 混合水基数据中心冷却
    • US20110239671A1
    • 2011-10-06
    • US13058576
    • 2011-02-01
    • Christopher G. MaloneJimmy ClidarasMichael C. Ryan
    • Christopher G. MaloneJimmy ClidarasMichael C. Ryan
    • G05D23/19F25B49/02F25D17/02
    • H05K7/2079
    • A method of providing cooling by a cooling system to a computer data center. The method includes providing a plurality of air-and-water radiators and one or more chillers, the chillers each having a first side in fluid communication with a chilled water loop and a second side in communication with a condenser water loop. The method also includes circulating a first portion of return water coming from the computer data center to a first subset of the air-and-water radiators and through the condenser water loop, circulating a second portion of the return water from the computer data center to a second subset of the air-and-water radiators and through the chilled water loop, and circulating the first portion and the second portion of the return water to the computer data center as cooled supply water.
    • 一种通过冷却系统向计算机数据中心提供冷却的方法。 该方法包括提供多个空气 - 水分散器和一个或多个冷却器,所述冷却器各自具有与冷水循环流体连通的第一侧和与冷凝器水回路连通的第二侧。 该方法还包括将来自计算机数据中心的回流水的第一部分循环到空气和水 - 水散热器的第一子集,并通过冷凝器水循环,将第二部分回水从计算机数据中心循环到 空气和水分散热器的第二子集,并通过冷水循环,并将回水的第一部分和第二部分循环到计算机数据中心作为冷却的供水。