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    • 55. 发明授权
    • Method for producing semiconductor device with capacitor stacked
    • 制造具有电容器的半导体器件的方法
    • US06048764A
    • 2000-04-11
    • US800121
    • 1997-02-13
    • Hiroshi SuzukiAkira Kubo
    • Hiroshi SuzukiAkira Kubo
    • H01L27/04H01L21/822H01L21/8242H01L27/108
    • H01L27/10852
    • In forming a storage node with sidewalls on interlayer dielectric layer of a semiconductor device, the interlayer dielectric layer having an uppermost silicon oxide film, a silicon nitride film is formed as a protective film on the storage node of poly-silicon formed on the interlayer dielectric layer, and thereafter a poly-silicon layer is deposited and then subjected to an anisotropic etching to partially remove the polysilicon layer to remain, as the side walls, portions of the poly-silicon layer on side surfaces of the storage node, with protecting the storage node by the protective film from the etching and without etching the uppermost silicon oxide film. Alternatively, the uppermost silicon oxide film is subjected to a nitrogen plasma treatment before forming the storage node, and a silicon oxide film can be used as the protective film. The storage node with the side walls can be used as a lower electrode of a stack type capacitor in the semiconductor device after removing the protective film.
    • 在形成具有半导体器件的层间电介质层上的侧壁的存储节点的情况下,在层间电介质上形成的多晶硅的存储节点上形成具有最上层氧化硅膜的层间绝缘层,氮化硅膜作为保护膜 然后沉积多晶硅层,然后进行各向异性蚀刻以部分去除多晶硅层,以保留作为侧壁的存储节点的侧表面上的多晶硅层的部分,同时保护 存储节点由保护膜从蚀刻而不蚀刻最上面的氧化硅膜。 或者,在形成存储节点之前,对最上面的氧化硅膜进行氮等离子体处理,可以使用氧化硅膜作为保护膜。 在去除保护膜之后,具有侧壁的存储节点可用作半导体器件中的堆叠型电容器的下电极。
    • 57. 发明授权
    • Method for manufacture of color filter and liquid crystal display
    • US5503952A
    • 1996-04-02
    • US404741
    • 1995-03-15
    • Tameyuki SuzukiAkira KuboYoshikatsu Okada
    • Tameyuki SuzukiAkira KuboYoshikatsu Okada
    • G02B5/20G03F9/00
    • G02B5/201
    • A color filter having discrete color layers arrayed on a substrate and light screening coating films interlaced between the color layers and if desired seal part having no coating film thereon, with high precision is industrially advantageously manufactured by (a) forming a transparent electroconductive layer on a transparent substrate, (b) coating the transparent electroconductive layer with a positive photoresist composition to form a photoresist layer, (c) exposing the photoresist layer to light through a photomask and developing the light-exposed photoresist layer to form a circuit-form photoresist layer, (d) etching and eliminating the transparent electroconductive layer bared in the gaps between the circuit-form photoresist layer to obtain a substrate having thereon a circuit-form laminate, (e) exposing the laminate to light through a photomask and developing the light-exposed laminate to bare the transparent electroconductive layer discretely, (f) carrying out electrodeposition using a thermosetting or photosensitive resin material-containing electro-deposition bath to form colored layers on the discretely bared transparent electroconductive layers, (g) eliminating the photoresist layer remaining after the development of step (e) to obtain a substrate having discrete color layers, the gaps being bared substrate surface and bared transparent electroconductive layer, (h) coating the substrate with a light screening material-containing photosensitive resin composition to form a light screening resin layer, and (i) exposing the light screening resin layer to light from the back side and developing the substrate to eliminate the unexposed part of the light screening resin layer. The color filter is well prevented from leakage of light and clear in coloration and superior in optical properties. A liquid crystal display of high image quality is manufactured by the use of this color filter.