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    • 55. 发明申请
    • Solid-state imaging device and its manufacturing method
    • 固态成像装置及其制造方法
    • US20070020795A1
    • 2007-01-25
    • US10568961
    • 2005-01-07
    • Mitsuyoshi MoriTakumi YamaguchiShinji Yoshida
    • Mitsuyoshi MoriTakumi YamaguchiShinji Yoshida
    • H01L21/00
    • H01L27/1463H01L21/76205H01L27/14689
    • In a method for manufacturing a solid-state imaging device of the present invention, a pad insulting film 2 made of an oxide film and an anti-oxidizing film 3 made of a nitride film are deposited on a n-type semiconductor substrate 1. Then, an opening 4 is formed to expose an element isolation formation region of the semiconductor substrate 1. Next, an anti-oxidizing film (not shown) for burying the opening 4 is formed on the substrate and anisotropic etching is performed to form a sidewall 5. Subsequently, a trench 6 is formed using the anti-oxidizing film 3 and the sidewall 5 as a mask. Then, a p-type impurity is implanted into a part of the semiconductor substrate 1 which is exposed at the side face of the trench 6 and a thermal oxide film is formed in the surface portion of the trench 6 in the semiconductor substrate 1. Thereafter, the trench 6 is buried with a burying film 8.
    • 在本发明的固体摄像装置的制造方法中,在n型半导体基板1上沉积由氧化膜构成的焊盘绝缘膜2和由氮化物膜构成的抗氧化膜3。 然后,形成开口4以露出半导体衬底1的元件隔离形成区域。 接下来,在基板上形成用于埋入开口4的抗氧化膜(未示出),并执行各向异性蚀刻以形成侧壁5。 随后,使用抗氧化膜3和侧壁5作为掩模形成沟槽6。 然后,将p型杂质注入到在沟槽6的侧面露出的半导体衬底1的一部分中,并且在半导体衬底1中的沟槽6的表面部分中形成热氧化膜。 此后,沟槽6被埋入掩埋膜8。
    • 60. 发明申请
    • Image pickup device
    • 图像拾取装置
    • US20060152611A1
    • 2006-07-13
    • US10534892
    • 2003-11-17
    • Koujirou YonedaToshiya FujiiTakahiro IwasawaTakumi Yamaguchi
    • Koujirou YonedaToshiya FujiiTakahiro IwasawaTakumi Yamaguchi
    • H04N5/335
    • H04N5/3741H04N5/359
    • An imaging element includes a photoelectric conversion element, a readout transistor, an accumulated element, a detection transistor, and a reset transistor. The readout transistor reads a signal charge when a gate potential to be supplied to the gate terminal is changed from a first state to a second state. The detection transistor detects a voltage signal after the gate potential to be supplied to the gate terminal of the readout transistor is changed from the second state to the first state. A reset potential supplied from the reset transistor to the accumulated element has an intermediate potential between the gate potential in the first state that is supplied to the gate terminal of the readout transistor and a predetermined VDD potential.
    • 成像元件包括光电转换元件,读出晶体管,累积元件,检测晶体管和复位晶体管。 当提供给栅极端子的栅极电位从第一状态改变到第二状态时,读出晶体管读取信号电荷。 在提供给读出晶体管的栅极端子的栅极电位从第二状态变为第一状态之后,检测晶体管检测电压信号。 从复位晶体管向累积元件提供的复位电位在提供给读出晶体管的栅极端子的第一状态下的栅极电位与预定的VDD电位之间具有中间电位。