会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 55. 发明授权
    • Method of fabricating micro electro mechanical system structure which can be vacuum-packed at wafer level
    • 制造可在晶圆级真空包装的微机电系统结构的方法
    • US06391673B1
    • 2002-05-21
    • US09702849
    • 2000-11-01
    • Byeoung Ju HaSeog-soon BaekHyun-cheol KimHoon SongYong-soo Oh
    • Byeoung Ju HaSeog-soon BaekHyun-cheol KimHoon SongYong-soo Oh
    • H01L2100
    • B81C1/00293G01C19/5769G01P1/02G01P15/0802
    • A method of fabricating a micro electromechanical system (MEMS) structure which can be vacuum-packaged at the wafer level is provided. The method includes the steps of forming a multilayered stack including a signal line on a first wafer; bonding a second wafer to the multilayered stack; polishing the first wafer to a predetermined thickness; forming a MEMS structure in a vacuum area of the first wafer and a pad outside the vacuum area, the MEMS structure and the pad being connected to the signal line; forming a structure in a third wafer to have space corresponding to the vacuum area of the MEMS structure; and bonding the third wafer to the polished surface of the first wafer in a vacuum state. For protection of the structure and maintaining a vacuum level required for operation, the fabricated structure is vacuum-packaged at the wafer level, thereby improving the yield of fabrication. In addition, since a special vacuum packaging process is not necessary, the fabrication can be simplified.
    • 提供了一种制造可在晶片级真空封装的微机电系统(MEMS)结构的方法。 该方法包括以下步骤:在第一晶片上形成包括信号线的多层堆叠; 将第二晶片接合到所述多层堆叠; 将第一晶片抛光至预定厚度; 在第一晶片的真空区域中形成MEMS结构,在真空区域外形成垫,MEMS结构和焊盘连接到信号线; 在第三晶片中形成具有对应于MEMS结构的真空区域的空间的结构; 以及在真空状态下将所述第三晶片接合到所述第一晶片的抛光表面。 为了保护结构并保持操作所需的真空水平,制造的结构在晶片级被真空包装,从而提高了制造的产量。 此外,由于不需要特殊的真空包装处理,因此可以简化制造。