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    • 51. 发明授权
    • Image processing method and device
    • 图像处理方法及装置
    • US06249272B1
    • 2001-06-19
    • US08702191
    • 1996-08-23
    • Hiroshi YagiKeisuke Yasui
    • Hiroshi YagiKeisuke Yasui
    • G09G536
    • G06T15/80
    • An image processing method and device corrects an empty dot between Polygons on a video screen at high speed without unnecessarily deforming a shape of the Polygons. Three latches 10, 12, 14 are provided, and a pattern detecting and correcting circuit 30 is inserted between the latches 12, 14. Data of a dot is inputted from the latch 10 and shifted to the right in synchronization with clocks. The pattern detecting and correcting circuit 30 checks a pattern of presence of image data of the continuous four dots along a scan line, based on fill data of the dot data D1, D2, D3, D4, and corrects the inputted dot data D3 to dot data D3′ as required to output the corrected dot data D3′ to the latch 14.
    • 图像处理方法和装置在视频屏幕上以高速校正多边形之间的空点,而不会使多边形的形状不必要地变形。 提供三个锁存器10,12,14,并且在锁存器12,14之间插入图案检测和校正电路30.点数据从锁存器10输入并与时钟同步地向右移位。 图案检测和校正电路30基于点数据D1,D2,D3,D4的填充数据,沿着扫描线检查连续的四个点的图像数据的存在的图案,并将输入的点数据D3校正为点 数据D3',以将校正的点数据D3'输出到锁存器14。
    • 54. 发明授权
    • Solder composition of mixed powders
    • 混合粉末的焊料组成
    • US4834794A
    • 1989-05-30
    • US130752
    • 1987-12-09
    • Hiroshi YagiAtsuzo Tamashima
    • Hiroshi YagiAtsuzo Tamashima
    • B23K35/22B23K35/02B23K35/26B23K35/34H05K3/34
    • H05K3/3484B23K35/0244B23K35/26B23K35/264B23K35/266H05K2201/0272H05K3/3463
    • A solder composition having a low melting point and a high remelting point sufficient to permit electronic circuit elements to be fixed on a printed circuit board at a low soldering temperature to prevent thermal damage of the electronic circuit elements during the mounting and prevent the elements from dropping off from the board due to any heat applied thereto after soldering. The solder composition includes a low melting solder powder containing a metal additive for melting-point depression, and a reactive alloy powder. The low melting solder powder is melted to form a soldering layer which serves to mount electronic circuit elements on a printed circuit board at a relatively low soldering temperature. At the soldering temperature, the metal additive is reacted with the reactive alloy powder to cause the soldering layer to have a remelting temperature higher than a melting point of the solder composition or solder powder.
    • 具有低熔点和高重熔点的焊料组合物,其足以允许电子电路元件以低焊接温度固定在印刷电路板上,以防止在安装期间电子电路元件的热损伤并防止元件掉落 由于在焊接后施加于其上的任何热量而从板上脱落。 焊料组合物包括含有用于熔点降低的金属添加剂的低熔点焊料粉末和反应性合金粉末。 将低熔点焊料粉末熔化以形成焊接层,其用于在相对低的焊接温度下将电子电路元件安装在印刷电路板上。 在焊接温度下,金属添加剂与反应性合金粉末反应,导致焊接层的熔融温度高于焊料组合物或焊料粉末的熔点。
    • 56. 发明授权
    • Puncture device
    • 穿刺装置
    • US09358335B2
    • 2016-06-07
    • US11885046
    • 2006-02-16
    • Satoshi WadaKatsuaki SomaHiroshi Yagi
    • Satoshi WadaKatsuaki SomaHiroshi Yagi
    • A61M5/178A61M5/158A61M25/06
    • A61M5/158A61M25/06A61M25/0693A61M2025/0687
    • A puncture device is provided that does not allow an outer needle to collapse or rise at the time of puncture and exhibits small puncture resistance.A puncture device 1 includes: a hollow outer needle 2; an outer needle hub 3 provided at a proximal end portion of the outer needle 2; a hollow inner needle 4 inserted into the outer needle 2 for use; and an inner needle hub 5 provided at a proximal end portion of the inner needle 4. The inner needle 4 includes, from the distal side, a sharp needlepoint 41, a small diameter portion 42 having an almost uniform outer diameter; an intermediate portion 43 formed as a tapered portion which is progressively increased in outer diameter as it goes toward the proximal end; and a larger diameter portion 44 having inner and outer diameters larger than inner and outer diameters, respectively, of the small diameter portion 42. If the puncture device 1 is assembled, the needlepoint 41 is most projected from the distal opening 24 of the outer needle 2 and the proximal end of the small diameter portion 42 and the distal end of the large diameter portion 4 are located inside the outer needle 2. The inner diameter of the outer needle 2 at a portion L1 where the outer needle 2 covers the small diameter portion 42 of the inner needle 4 is smaller than the large diameter portion 44 of the inner needle 4.
    • 提供一种刺穿装置,其不会在穿刺时使外针塌陷或上升,并且具有小的抗穿刺性。 穿刺装置1包括:中空外针2; 设置在外针2的基端部的外针座3; 插入外针2中的中空内针4使用; 以及内针座5,其设置在内针4的基端部。内针4从远端侧包括尖锐的针尖41,具有几乎均匀外径的小直径部42。 形成为锥形部分的中间部分43,其随着朝向近端而在外径上逐渐增加; 以及分别具有大于小直径部42的内径和外径的内径和外径的较大直径部44.如果组装穿刺装置1,则针尖41从外针的远端开口24最突出 小直径部分42的近端和大直径部分4的远端位于外针2的内侧。外针2在外针2覆盖小直径的部分L1处的内径 内针4的部分42比内针4的大直径部44小。
    • 59. 发明授权
    • Fluorescent lamp, luminaire and method for manufacturing fluorescent lamp
    • 荧光灯,灯具和荧光灯制造方法
    • US07938629B2
    • 2011-05-10
    • US12424093
    • 2009-04-15
    • Hiroshi YagiYoshio ManabeTsuyoshi Terada
    • Hiroshi YagiYoshio ManabeTsuyoshi Terada
    • F01B37/02
    • H01J61/72H01J9/247H01J9/395H01J61/28
    • A fluorescent lamp is configured so that a glass bulb has a phosphor film formed on its internal face, and a rare gas and an amalgam pellet are enclosed therein. The amalgam pellet contains zinc, tin, and mercury as principal components, one amalgam pellet is enclosed in the glass bulb, and the amalgam pellet has a weight of not more than 20 mg. The fluorescent lamp satisfies the relationship expressed as: 45×(1−A)≦x≦55×(1−A), 75A≦y≦85A, 45−30A≦z≦55−30A, and x+y+z≦100, where x represents a content of zinc contained in the amalgam pellet in percent by weight, y represents a content of tin therein in percent by weight, and z represents a content of mercury therein in percent by weight. This configuration allows the fluorescent lamp to be characterized in that an amount of released mercury that is necessary for the first lighting of the fluorescent lamp is secured, and that the phosphor film is less prone to being peeled due to the amalgam.
    • 荧光灯被配置为使得玻璃灯泡在其内表面上形成有荧光膜,并且在其中封入稀有气体和汞齐颗粒。 汞齐颗粒含有锌,锡和汞作为主要成分,一个汞齐颗粒被封闭在玻璃泡中,汞齐颗粒的重量不超过20毫克。 荧光灯满足以下关系:45×(1-A)≦̸ x≦̸ 55×(1-A),75A≦̸ y≦̸ 85A,45-30A和n1E; z和nlE; 55-30A,以及x + y + z& ; 100,其中x表示汞齐颗粒中含有的以重量%计含量的锌,y表示其中以重量%计含有的锡含量,z表示其中以重量%计含有的汞含量。 这种结构允许荧光灯的特征在于,确保荧光灯的第一次点亮所需的释放汞量,并且荧光膜不太可能由于汞齐而被剥离。
    • 60. 发明申请
    • SEPARATOR AND SEPARATOR CARTRIDGE
    • 分离器和分离器盒
    • US20110079552A1
    • 2011-04-07
    • US12879445
    • 2010-09-10
    • Hiroshi YAGI
    • Hiroshi YAGI
    • B01D29/00
    • B01L3/502753B01L2300/0816B01L2400/086G01N15/05G01N2001/4088
    • A separator includes: a channel having a first surface; a plurality of columnar members formed on the first surface and having a cross section in the shape of a crescent, the plurality of columnar members being arranged in a row direction along a longitudinal direction of the channel, and in a column direction perpendicular to the longitudinal direction of the channel, the columnar members that belong to the same row from among the plurality of columnar members being disposed so that the crescents face the same direction in the column direction, the columnar members that belong to a single row being disposed so that the crescents face the opposite direction in the column direction with respect to the crescents of the columnar members that belong to the adjacent row; and a substance that specifically binds to a separation target, and is disposed on side surfaces of the plurality of columnar members.
    • 分离器包括:具有第一表面的通道; 多个柱状构件形成在第一表面上并且具有月牙形的横截面,多个柱状构件沿着通道的纵向布置在行方向上,并且在垂直于纵向的列方向上 所述通道的方向,所述多个柱状构件中属于同一行的柱状构件被配置为使得所述新月在列方向上面向相同的方向,所述属于单列的柱状构件被配置为 新月相对于属于相邻行的柱状构件的新月在列方向上相反方向; 以及与分离对象特异性结合的物质,并且设置在多个柱状部件的侧面。