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41. 发明授权

US10677533B2 Heat exchange device for artificial satellite, wall and assembly of walls comprising such a heat exchange device 有权
公开(公告)号：US10677533B2
公开(公告)日：2020-06-09
申请号：US15772444
申请日：2016-11-16
申请人： AIRBUS DEFENCE AND SPACE SAS
发明人： Christian Flemin , Typhaine Coquard , Andrew Walker
IPC分类号： F28D15/02 , B64G1/50 , F28F7/02 , F28D15/04 , F28F13/00 , F28D21/00
摘要： Disclosed is a heat exchange device for effecting a heat exchange between a heat transfer fluid of a first network of capillary heat pipes and a heat transfer fluid of a second network of capillary heat pipes. The heat exchange device includes a solid block provided with a first channel and a second channel which are independent of one another, the first channel having at least one opening intended to be connected to a capillary heat pipe of the first network, the second channel having at least one opening intended to be connected to a capillary heat pipe of the second network, the first channel having a portion which lies near a portion of the second channel such that the heat transfer fluid of the first network is able to exchange heat with the heat transfer fluid of the second network via the heat exchanging portions.

42. 发明授权

US10670351B2 Two piece aluminum heat sink 审中-公开
公开(公告)号：US10670351B2
公开(公告)日：2020-06-02
申请号：US15097483
申请日：2016-04-13
申请人： Thomas Tessnow
发明人： Thomas Tessnow
IPC分类号： F28F7/00 , F28F21/08 , F28F13/00 , H01L23/367 , H01L33/64 , F21V29/76 , F28F3/02 , F28D21/00 , H01L21/48 , H01L23/373 , F21Y101/00
摘要： A heat sink includes an extruded component, a cast component, and an interface layer. The extruded component includes a first aluminum material and is configured to be coupled to a solid state light source. The cast component includes a second aluminum material overmolded onto a portion of the extruded component to form the interface layer. The interface layer is formed of at least one of the first and the second aluminum materials and abuts against and couples the extruded component to the cast component.

43. 发明申请

US20200166289A1 MODULAR HEAT EXCHANGER AND METHOD FOR MAKING THE SAME 审中-公开
公开(公告)号：US20200166289A1
公开(公告)日：2020-05-28
申请号：US16621324
申请日：2018-05-15
申请人： Nokia Solutions and Networks Oy
发明人： Nicholas M. JEFFERS , Akshat AGARWAL , Rudi O'REILLY MEEHAN
IPC分类号： F28D15/02 , F28F13/00 , F28F9/26
摘要： The present invention relates to a module (3) comprising a cell having a lattice mesh structure (31) capable of transferring heat and a heat pipe (32) provided within the lattice mesh structure (31), and also to a method for manufacturing a module (3). The present invention also relates to an apparatus comprising a plurality of such modules to a method for manufacturing such an apparatus, and also to a connector (4) suitable for connecting an end of the heat pipe of such module.

44. 发明授权

US10655922B2 Laminated heat sink 有权
公开(公告)号：US10655922B2
公开(公告)日：2020-05-19
申请号：US15754505
申请日：2016-09-14
申请人： T.RAD CO., LTD.
发明人： Takuya Bungo , Atsushi Okubo , Taiji Sakai
IPC分类号： F28F13/00 , H01L23/473 , F28D1/03 , F28F13/08 , F28F3/04 , H05K7/20 , F28F3/08 , F28D21/00
摘要： A heat sink made from laminated plates and formed with spaced apart ribs and slits positioned so as to control circulation of refrigerant over the heat sink during cooling of an object by the heat sink.

45. 发明授权

US10655918B2 Indirect heat exchanger having circuit tubes with varying dimensions 有权
公开(公告)号：US10655918B2
公开(公告)日：2020-05-19
申请号：US15291773
申请日：2016-10-12
申请人： BALTIMORE AIRCOIL COMPANY, INC.
发明人： Andrew Beaver , David Andrew Aaron , Yohann Lilian Rousselet
IPC分类号： F28F13/00 , F28F13/08 , F28D7/00 , F28F9/02 , F28D1/047 , F28F1/02 , F28F1/00
摘要： An improved indirect heat exchanger is provided which is comprised of a plurality of coil circuits, with each coil circuit comprised of an indirect heat exchange section tube run or plate. Each tube run or plate has at least one change in its geometric shape or may have a progressive change in its geometric shape proceeding from the inlet to the outlet of the circuit. The change in geometric shape along the circuit length allows simultaneously balancing of the external airflow, internal heat transfer coefficients, internal fluid side pressure drop, cross sectional area and heat transfer surface area to optimize heat transfer.

46. 发明授权

US10605543B2 Heat transfer device having channels 有权
公开(公告)号：US10605543B2
公开(公告)日：2020-03-31
申请号：US15310952
申请日：2015-04-13
申请人： FRAUNHOFER GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
发明人： Lena Schnabel , Eric Laurenz , Hannes Fugmann , Steffen Kaina , Thomas Studnitzky , Friedrich A. Roell , Kurt Hattler
IPC分类号： F28F1/12 , F28F3/02 , F28F13/00 , F28F21/00
摘要： The invention relates to a heat transfer device with channels for heat-absorbing media and channels for heat-emitting media, at least one of the channels having a textile structure with compressed and non-compressed regions. Whilst the compressed regions are disposed in the transition regions between the channels in order to improve the heat transfer to or across the channel wall, the non-compressed regions are disposed in the flow regions of the channels. This construction enables a large heat transfer to the heat transfer surface with simultaneously good heat conduction from the heat transfer surface to the separating surface. The invention likewise relates to heat exchangers with heat transfer devices of this type.

47. 发明授权

US10605429B2 Heat sink having variable thermal resistance 有权
公开(公告)号：US10605429B2
公开(公告)日：2020-03-31
申请号：US16461319
申请日：2017-10-25
申请人： ZKW GROUP GMBH
发明人： Peter Mayer , Michael Brunner , Martin Ebner
IPC分类号： B60Q1/00 , B60Q1/04 , F21S45/10 , F21S45/48 , F21S41/20 , F28F13/00 , F21S41/148
摘要： The invention relates to a motor vehicle headlight (100), comprising a headlight housing (102) and a cover plate (103) having at least one light source (104, 105) arranged in said motor vehicle headlight (100). In order to cool the at least one light source (104, 105), a heat sink device (200) is provided. Said heat sink device (200) comprises two heat sink elements (106, 107, 201, 202, 501, 502, 601, 602, 701, 702, 801, 802, 901, 902, 1001, 1002) that are separated from one another by an air gap (209) and that are arranged in such a way that a first heat sink element (106, 201, 501, 601, 701, 801, 901, 1001) is mounted inside the motor vehicle headlight (100), and a second heat sink element (107, 202, 502, 602, 702, 802, 902, 1002) is mounted outside the motor vehicle headlight (100). The heat sink device (200) is provided with a contacting device (210) that allows a heat exchange between the heat sink elements (106, 107, 201, 202, 501, 502, 601, 602, 701, 702, 801, 802, 901, 902, 1001, 1002) via said contacting device (210), whenever the temperature inside the motor vehicle headlight (100) is higher than the temperature in the area outside the motor vehicle headlight (100), and no heat exchange between the heat sink elements (106, 107, 201, 202, 501, 502, 601, 602, 701, 702, 801, 802, 901, 902, 1001, 1002) is possible whenever the temperature inside the motor vehicle headlight (100) is lower than the temperature in the area outside the motor vehicle headlight (100).

48. 发明授权

US10600721B2 Heat exchanger for dual-sided cooling of electronic modules 有权
公开(公告)号：US10600721B2
公开(公告)日：2020-03-24
申请号：US15840504
申请日：2017-12-13
申请人： Dana Canada Corporation
发明人： Meinrad K. A. Machler , Colin A. Shore , Dale L. Bartnik
IPC分类号： H01L23/40 , F28D1/03 , F28F3/12 , H01L25/11 , H01L25/07 , F28F13/00 , H01L23/467 , H01L23/473 , H05K7/20 , F28D21/00
摘要： A heat exchanger assembly has first and second heat sink elements enclosing fluid flow passages, and a clamping assembly. The heat sink elements are separated by a space in which at least one heat-generating electronic component is located, with outer side surfaces of each electronic component being in thermal contact with the heat sink elements. The clamping assembly has first and second spring elements arranged in contact with an outer surfaces of the heat sink elements. The spring elements are joined together to apply compressive forces to the heat sink elements and to cause the electronic components to be clamped between the heat sink elements. Each spring element has discrete force application regions for applying force to a heat sink element, and a plurality of fastening regions for compressing and maintaining the positions of the spring elements relative to the outer surfaces of the heat sink elements.

49. 发明授权

US10528101B2 Heat control method and device 有权
公开(公告)号：US10528101B2
公开(公告)日：2020-01-07
申请号：US15570594
申请日：2015-08-06
申请人： ZTE Corporation
发明人： Biao Yuan
IPC分类号： G06F1/20 , H05K7/20 , G01B7/02 , F28F13/00
摘要： A heat control method and device are provided. In the method, a distance or distances between one or more regions of a terminal and a predetermined detection object may be detected (S102); heat insulation processing may be performed in a first region of the terminal, where the first region may be a region of which the distance to the predetermined detection object is smaller than a first predetermined threshold; and/or, heat dissipation processing may be performed in a second region of the terminal, where the second region may be a region of which the distance to the predetermined detection object is larger than a second predetermined threshold (S104).

50. 发明授权

US10514207B2 Superconductive nano heat transfer plate type heat exchanger and manufacturing method thereof 有权
公开(公告)号：US10514207B2
公开(公告)日：2019-12-24
申请号：US14435433
申请日：2012-10-22
申请人： Yu Cheng
发明人： Yu Cheng
IPC分类号： B23P15/26 , B21D53/04 , F28D15/02 , B82Y30/00 , F28F13/00
摘要： A superconductive nano heat transfer plate type heat exchanger consisting of a plurality of superconductive nano plate bundles by welding, the plate bundles being formed by welding a plurality of heat transfer plates together and sealed in vacuum, each of the plate bundles comprising an evaporation zone and a condensation zone, inside the plate bundle is padded a superconductive nano medium. The heat exchanger enhances heat transfer efficiency and may perform highly efficient heat transfer at different pressures, different temperatures, within different application scopes.

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