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    • 44. 发明授权
    • Recovery of gold in gold plating processes
    • 黄金回收镀金工艺
    • US4372830A
    • 1983-02-08
    • US359285
    • 1982-03-18
    • Henry H. Law
    • Henry H. Law
    • C01C3/11C01G7/00
    • C01G7/003C01C3/11C22B3/42Y02P10/234
    • A process is described involving gold in which gold cyanide ion (e.g., potassium gold cyanide) is removed from an aqueous solution (typically a water rinse solution) by absorption on an anion-exchange resin and the gold cyanide ion is then removed from the resin using an eluent solution comprising organic solvent, water and thiocyanate ion. This procedure is convenient and leads to virtually complete removal of gold from the resin. Because of the low volume of eluent solution required to remove the gold cyanide ion, the procedure can be used to efficiently produce crystalline potassium gold cyanide from highly dilute aqueous solutions.
    • 描述了一种涉及金的方法,其中通过在阴离子交换树脂上的吸收从水溶液(通常为水漂洗溶液)除去氰化金离子(例如,氰化金钾),然后从树脂中除去氰化金离子 使用包含有机溶剂,水和硫氰酸根离子的洗脱液。 该方法方便,导致几乎完全从树脂中除去金。 由于除去氰化金离子所需的洗脱溶液体积小,因此该方法可用于从高度稀释的水溶液中有效地生产结晶的氰化金钾。
    • 45. 发明授权
    • Alkali metal gold cyanide method
    • 碱金属金氰化法
    • US3989800A
    • 1976-11-02
    • US550694
    • 1975-02-18
    • Grant N. Gansinger
    • Grant N. Gansinger
    • C01C3/11C25D3/48
    • C01C3/11C25D3/48C01P2006/80
    • This disclosure relates to a method for preparing alkali metal gold cyanide which has been found to be particularly useful in gold electroplating operations in the semiconductor industry in order to provide electrical contacts to semiconductor devices. In the process, finely divided gold metal particles are reacted with hydrogen peroxide and alkali metal cyanide to produce univalent alkali metal gold cyanide. The alkali metal gold cyanide is then acidified with a mineral acid in order to precipitate out gold cyanide. The gold cyanide is subsequently removed by filtration, washed and redissolved in a solution of alkali metal cyanide thereby yielding the final alkali metal gold cyanide end product in its pure state.
    • 本公开涉及一种制备碱金属金氰化物的方法,已经发现其在半导体工业中的金电镀操作中特别有用,以便提供与半导体器件的电接触。 在此过程中,细金属金属颗粒与过氧化氢和碱金属氰化物反应,产生一价碱金属氰化金。 然后将碱金属氰化金用无机酸酸化以沉淀出氰化金。 随后通过过滤除去氰化金,洗涤并再溶解在碱金属氰化物溶液中,从而在其纯态下产生最终的碱金属氰化金最终产物。