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41. 发明授权

US09724800B2 Wafer polishing apparatus 有权
公开(公告)号：US09724800B2
公开(公告)日：2017-08-08
申请号：US14753367
申请日：2015-06-29
申请人： LG SILTRON INCORPORATED
发明人： Kee Yun Han , Eun Suck Choi
IPC分类号： B24B37/08 , B24B49/10 , B24B37/26 , B24B7/22
CPC分类号： B24B49/10 , B24B7/228 , B24B37/08 , B24B37/26
摘要： Disclosed is a wafer polishing apparatus including a base, a lower surface plate disposed on the upper surface of the base, an upper surface plate disposed on the lower surface plate and a first shape adjustment unit configured to deform the shape of the lower surface of the upper surface plate so that the lower surface of the upper surface plate has one of a concave shape, a flat shape and a convex shape in a first direction, and the first direction is a direction from the lower surface plate to the upper surface plate.

42. 发明授权

US09669514B2 System and method for polishing substrate 有权
公开(公告)号：US09669514B2
公开(公告)日：2017-06-06
申请号：US14725367
申请日：2015-05-29
申请人： Taiwan Semiconductor Manufacturing Co., Ltd
发明人： Jiun-Yu Lai , Ying-Hsiu Tsai , Wei-Chen Chang , Yi-Ching Chiou
IPC分类号： B24B49/10 , B24B37/005 , B24B37/04 , B24B53/017 , H01L21/306 , H01L21/67
CPC分类号： B24B49/105 , B24B37/005 , B24B37/042 , B24B53/017
摘要： Polishing systems and methods for polishing a substrate are provided. The polishing system includes a polishing assembly having a platen and a polishing pad over the platen. The polishing system also includes a substrate carrying assembly configured to engage a substrate to the polishing pad. The polishing system further includes a thickness sensing assembly configured to monitor a thickness of the polishing pad.

43. 发明申请

US20170136614A1 ELECTRIC TOOL 审中-公开
公开(公告)号：US20170136614A1
公开(公告)日：2017-05-18
申请号：US15322451
申请日：2015-06-19
申请人： HITACHI KOKI CO., LTD.
发明人： Yuuki TAKEDA
IPC分类号： B25F5/00 , B24B49/10 , B24B23/02
CPC分类号： B25F5/008 , B24B23/02 , B24B23/028 , B24B49/10 , B25F5/00
摘要： An electric tool is provided. The electric tool prevents anomalies in motor rotation due to dust and moisture sucked in together with a cooling wind, and is configured such that rotational position detection operations and switch operations are not affected. In the electric tool which drives a brushless DC motor using a controller, a magnetic body for rotational position detection is provided on a rotation shaft which can rotate integrally with a rotor, Hall ICs are provided to detect the rotational position of the magnetic body and output a position signal to the controller, and the magnetic body and the Hall ICs mounted on a substrate are arranged in a region isolated from the wind path of the cooling wind generated by rotation of a cooling fan. The Hall ICs are accommodated in a housing filled with resin.

44. 发明申请

US20170095901A1 POLISHING APPARATUS 审中-公开
公开(公告)号：US20170095901A1
公开(公告)日：2017-04-06
申请号：US15283212
申请日：2016-09-30
申请人： EBARA CORPORATION
发明人： Akira NAKAMURA
IPC分类号： B24B37/013 , B24B49/10 , B24B37/22 , B24B37/20
CPC分类号： B24B37/013 , B24B37/205 , B24B37/22 , B24B37/26 , B24B49/04 , B24B49/105
摘要： The polishing apparatus has: a polishing pad that has a polishing surface to polish a semiconductor wafer; a polishing table to which a back surface of the polishing pad on an opposite side of the polishing surface can be attached; a top ring that is opposed to the polishing surface, and can hold the semiconductor wafer; and an eddy current sensor that is arranged in the polishing table, and detects an end point of polishing. The polishing table has on an attachment surface a projection member projecting from the attachment surface to which the polishing pad is attached. The back surface of the polishing pad has a concave portion in a portion opposed to the projection member, and at least a part of the eddy current sensor is arranged inside the projection member.

45. 发明申请

US20160284615A1 POLISHING WITH MEASUREMENT PRIOR TO DEPOSITION OF OUTER LAYER 审中-公开
标题翻译：在外层沉积之前进行抛光
公开(公告)号：US20160284615A1
公开(公告)日：2016-09-29
申请号：US15173584
申请日：2016-06-03
申请人： Applied Materials, Inc.
发明人： Tomohiko Kitajima , Jeffrey Drue David , Jun Qian , Taketo Sekine , Garlen C. Leung , Sidney P. Huey
IPC分类号： H01L21/66 , H01L21/321 , B24B49/10 , H01L21/311 , B24B37/013 , H01L21/3105 , H01L21/67
CPC分类号： H01L22/26 , B24B37/013 , B24B49/105 , H01L21/31053 , H01L21/3212 , H01L21/67075 , H01L21/67092 , H01L21/67253 , H01L22/14 , H01L22/20 , H01L22/34
摘要： A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of an outer layer over the at least one layer, after deposition of the outer layer over the at least one layer and during polishing of the outer layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.
摘要翻译：控制抛光的方法包括存储基底测量，所述基底测量是沉积覆盖在半导体晶片上的至少一个层之后并且在外层沉积外层之后在所述至少一个层上沉积之后的衬底的测量值层，并且在衬底上的外层的抛光期间，从原位监测系统接收衬底的原始测量序列，对原始测量序列中的每个原始测量进行归一化，以生成标准化的序列使用原始测量和基础测量的测量，以及至少基于归一化测量的顺序来确定抛光终点或抛光速率的调整中的至少一个。

46. 发明申请

US20160229021A1 MOTORIZED BLADE REST APPARATUS AND GRINDING SYSTEM WITH MOTORIZED BLADE REST APPARATUS 审中-公开
标题翻译：带电动叶片休息装置的电动叶片摆放装置和研磨系统
公开(公告)号：US20160229021A1
公开(公告)日：2016-08-11
申请号：US14797854
申请日：2015-07-13
申请人： Glebar Acquisition, LLC
发明人： John Bannayan , Robert C. Gleason
IPC分类号： B24B5/307 , B24B49/10
CPC分类号： B24B5/307 , B24B5/04 , B24B5/18 , B24B5/22 , B24B5/32 , B24B5/37 , B24B5/38 , B24B49/10
摘要： A motorized blade rest apparatus for a grinding system includes a carriage, a ram assembly, a work rest assembly, a motor, and a computer processor. The carriage moves a regulating wheel along a first axis towards and away from a work wheel. The ram assembly, which moves along a second axis parallel to the first axis, supports the carriage and the work rest assembly. The work rest assembly includes first and second slide portions and a work rest blade. The first slide portion is mounted on the ram assembly. The second slide portion, which is movable relative to the first slide portion, moves along a third axis perpendicular to the first axis. The work rest blade is mounted on the second slide portion. The motor is coupled to the second slide portion, and the computer processor controls the motor to move the second slide portion along the third axis.
摘要翻译：一种用于磨削系统的电动刀片固定装置，包括滑架，柱塞组件，工作台组件，马达和计算机处理器。滑架沿着第一轴线将调节轮移动到工作轮和远离工作轮。沿着平行于第一轴线的第二轴线移动的柱塞组件支撑滑架和工作台组件。工作台组件包括第一和第二滑动部分和工作台面。第一滑动部分安装在压头组件上。可相对于第一滑动部分移动的第二滑动部分沿着垂直于第一轴线的第三轴线移动。工作叶片安装在第二滑动部分上。电动机联接到第二滑动部分，并且计算机处理器控制电动机沿着第三轴线移动第二滑动部分。

47. 发明授权

US09321146B1 Systems and methods for shaping leads of electronic lapping guides to reduce calibration error 有权
标题翻译：电子研磨导轨成型导线的系统和方法，以减少校准误差
公开(公告)号：US09321146B1
公开(公告)日：2016-04-26
申请号：US13631802
申请日：2012-09-28
申请人： Western Digital (Fremont), LLC
发明人： Steven C. Rudy , Mahendra Pakala , Prakash Mani , Eric R. McKie
IPC分类号： B24B49/10
CPC分类号： B24B49/10
摘要： Systems and methods for shaping leads of electronic lapping guides to reduce calibration error are provided. One such system includes a device configured to generate predictable resistance for leads of an electronic lapping guide, the device including a lapping surface, and an ELG configured to provide information indicative of a degree of lapping performed on the lapping surface, the ELG including a first electrical lead, a second electrical lead spaced apart from the first electrical lead, and a resistive element between the first electrical lead and the second electrical lead, the resistive element including a right segment, a left segment, and a middle segment that abuts each of the right segment and the left segment, where the right segment is spaced apart from the left segment and the middle segment is adjacent to the lapping surface, where the first and second electrical leads are recessed from the middle segment.
摘要翻译：提供了用于使电子研磨导轨成形引线减少校准误差的系统和方法。一种这样的系统包括被配置为为电子研磨导向器的引线产生可预测电阻的装置，该装置包括研磨表面，以及被配置为提供指示在研磨表面上进行的研磨程度的信息的ELG，所述ELG包括第一电引线，与第一电引线间隔开的第二电引线，以及在第一电引线和第二电引线之间的电阻元件，电阻元件包括右段，左段和中间段，右段和左段，其中右段与左段和中间段间隔开，与研磨表面相邻，其中第一和第二电引线从中间段凹陷。

48. 发明申请

US20160074988A1 PROCESSING MODULE, PROCESSING APPARATUS, AND PROCESSING METHOD 审中-公开
标题翻译：加工模块，加工设备和加工方法
公开(公告)号：US20160074988A1
公开(公告)日：2016-03-17
申请号：US14849500
申请日：2015-09-09
申请人： EBARA CORPORATION
发明人： Kuniaki YAMAGUCHI , Toshio MIZUNO , Itsuki KOBATA
IPC分类号： B24B37/005 , B24B49/12 , H01L21/66 , H01L21/67 , H01L21/306 , B24B49/10 , B24B49/02
CPC分类号： B24B37/005 , B24B49/02 , B24B49/105 , B24B49/12 , H01L21/30625 , H01L21/67046 , H01L21/67051 , H01L21/67178 , H01L21/67219 , H01L22/26
摘要： PROBLEMAn upper treatment module performs polishing treatment by, while bringing a pad smaller in diameter than a wafer into contact with the wafer, relatively moving the wafer and the pad.MEANS FOR SOLVINGThe upper treatment module includes a state detecting section configured to detect states of a polishing treatment surface of the wafer before the polishing treatment or during the polishing treatment and a control section configured to control conditions of the polishing treatment in a portion of the surface of the wafer according to the states of the polishing treatment surface detected by the state detecting section.
摘要翻译：问题上处理模块通过在使晶片直径小于晶片的晶片与晶片接触的同时进行抛光处理，相对移动晶片和焊盘。解决方案上述处理模块包括状态检测部，其被配置为检测在抛光处理之前或抛光处理期间的晶片的抛光处理表面的状态;以及控制部，其被配置为控制所述抛光处理的一部分中的抛光处理的条件根据由状态检测部检测到的抛光处理面的状态，晶片的表面。

49. 发明授权

US09283651B2 Apparatus including electrical lapping guide and methods of using the same 有权
标题翻译：装置包括电研磨引导件及其使用方法
公开(公告)号：US09283651B2
公开(公告)日：2016-03-15
申请号：US14019903
申请日：2013-09-06
申请人： Seagate Technology LLC
发明人： Yongjun Zhao , David C. Seets , Mark Ostrowski
IPC分类号： B24B37/10 , B24B49/10 , B24B37/013 , G11B5/31
CPC分类号： B24B49/10 , B24B37/013 , G11B5/3169 , G11B5/3173
摘要： An electrical lapping guide has a body with a thickness along a wafer axis, the body comprising a layer of conductive material having a resistivity. The conductive material layer comprises a first contact region and a second contact region, the first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads. A lapping edge comprises an air-bearing plane axis perpendicular to a lapping axis, and a back edge opposite the lapping edge, the back edge comprising a plurality of notches.
摘要翻译：电研磨引导件具有沿着晶片轴线的厚度的主体，主体包括具有电阻率的导电材料层。导电材料层包括第一接触区域和第二接触区域，第一和第二接触区域被配置为将电研磨引导件电连接到电引线。研磨边缘包括垂直于研磨轴线的空气轴承平面轴线和与研磨边缘相对的后边缘，后边缘包括多个凹口。

50. 发明授权

US09275917B2 Determination of gain for eddy current sensor 有权
标题翻译：确定涡流传感器的增益
公开(公告)号：US09275917B2
公开(公告)日：2016-03-01
申请号：US14066509
申请日：2013-10-29
申请人： Applied Materials, Inc.
发明人： Kun Xu , Shih-Haur Shen , Boguslaw A. Swedek , Ingemar Carlsson , Doyle E. Bennett , Wen-Chiang Tu , Hassan G. Iravani , Tzu-Yu Liu
IPC分类号： H01L21/66 , H01L21/321 , B24B37/013 , B24B49/10
CPC分类号： H01L22/26 , B24B37/013 , B24B49/105 , H01L21/3212 , H01L22/14
摘要： In one aspect, a method of controlling polishing includes receiving a measurement of an initial thickness of a conductive film on a first substrate prior to polishing the first substrate from an in-line or stand-alone monitoring system, polishing one or more substrates in a polishing system, the one or more substrates including the first substrate, during polishing of the one or more substrates, monitoring the one or more substrates with an eddy current monitoring system to generate a first signal, determining a starting value of the first signal for a start of polishing of the first substrate, determining a gain based on the starting value and the measurement of the initial thickness, for at least a portion of the first signal collected during polishing of at least one substrate of the one or more substrates, and calculating a second signal based on the first signal and the gain.
摘要翻译：一方面，一种控制抛光的方法包括：在从第一基板或独立监视系统抛光第一基板之前，在第一基板上接收导电膜的初始厚度的测量，在一个或多个基板中抛光一个或多个基板抛光系统，所述一个或多个衬底包括第一衬底，在一个或多个衬底的抛光期间，用涡流监视系统监测该一个或多个衬底以产生第一信号，确定第一信号的起始值开始抛光第一衬底，对于在一个或多个衬底的至少一个衬底的抛光期间收集的第一信号的至少一部分，基于起始值和初始厚度的测量来确定增益，并且计算基于第一信号和增益的第二信号。

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