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41. 发明授权

US06816377B2 Electronic control unit 有权
标题翻译：电子控制单元
公开(公告)号：US06816377B2
公开(公告)日：2004-11-09
申请号：US10393258
申请日：2003-03-21
申请人： Toru Itabashi , Akinobu Makino
发明人： Toru Itabashi , Akinobu Makino
IPC分类号： H05K720
CPC分类号： H05K7/20854 , H01L23/3675 , H01L23/3677 , H01L23/4006 , H01L2224/32188 , H01L2224/48091 , H01L2224/48247 , H01L2924/01019 , H01L2924/181 , H05K1/0206 , H05K1/0207 , H05K3/429 , H05K7/20454 , H05K7/205 , H05K2201/09054 , H05K2201/09309 , H05K2201/09781 , H05K2201/10409 , H05K2201/10689 , H01L2924/00014 , H01L2924/00012
摘要： An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.
摘要翻译：具有高散热能力的电子控制装置包括固定到外壳的印刷电路板，并且通过穿过印刷电路板的螺钉插入在壳体和盖板之间。由铜箔制成的导热性薄膜层平行地形成在印刷电路板的安装面和相对的安装面上以及印刷基板的内部，从而彼此热分离。突起设置在盖上，并突出超过盖的底部朝向安装电子部件的位置。将柔性半固体导热材料放置在突起的端面和印刷电路板的相对的安装面之间，对应于安装电子部件的位置与端面和相对的安装面相接触。

42. 发明申请

US20030227750A1 Liquid cooled metal thermal stack for high-power dies 失效
标题翻译：用于大功率模具的液体冷却金属热堆
公开(公告)号：US20030227750A1
公开(公告)日：2003-12-11
申请号：US10458424
申请日：2003-06-10
申请人： Visteon Global Technologies, Inc.
发明人： Andrew Z. Glovatsky , Vivek Jairazbhoy
IPC分类号： H05K007/20
CPC分类号： H05K7/2049 , H05K1/0206 , H05K7/20454
摘要： The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an electrical component. The system for conducting heat energy in an electronic assembly includes an electrical component, an elastically deformable member, and a housing. The elastically deformable member is placed in a compressed position between the electrical component and the housing such that the elastically deformable member is fixed into an assembled location. The elastically deformable member conducts heat energy away from the electrical component into the housing where it is dissipated into the environment. Since the compressed position fixes the location of the elastically deformable member, the system does not require a mechanical fastening to the electrical component thereby reducing thermo-mechanical fatigue. The elastically deformable member is made of a metal material allowing it to easily conduct the heat energy.
摘要翻译：本发明提供了一种用于从电气部件传导热量的系统，其中系统具有提供与电气部件的热连通的弹性变形部件。用于在电子组件中传导热能的系统包括电气部件，可弹性变形的部件和壳体。可弹性变形的构件被放置在电气部件和壳体之间的压缩位置，使得可弹性变形的构件被固定到组装位置。可弹性变形的构件将热能从电气部件传导到壳体中，在该壳体中被散发到环境中。由于压缩位置固定可弹性变形的构件的位置，系统不需要机械地紧固到电气部件，从而减少热机械疲劳。可弹性变形的构件由允许其容易地传导热能的金属材料制成。

43. 发明授权

US5969945A Electronic package assembly 失效
标题翻译：电子封装组装
公开(公告)号：US5969945A
公开(公告)日：1999-10-19
申请号：US808829
申请日：1997-02-27
申请人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
发明人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
IPC分类号： H01L21/48 , H01L23/367 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/18 , H05K3/00 , H05K3/12 , H05K3/34 , H05K7/20
CPC分类号： H05K7/20454 , H01L21/4857 , H01L21/4867 , H01L23/3672 , H01L23/5387 , H05K1/021 , H05K1/189 , H05K3/0061 , H05K3/1216 , H05K3/4691 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K1/0298 , H05K1/182 , H05K2201/0154 , H05K2201/09063 , H05K2201/096 , H05K2201/09745 , H05K2201/1056 , H05K2201/2009 , H05K2203/1394 , H05K3/3415 , H05K3/3452 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： A screen printing fixture holds a flexible circuit board having components attached to one side, to allow screening a pattern of solder paste onto the second side for subsequent attachment of components to that side. In an electronic package assembly a flexible circuit board with components is wound about a heat spreader assembly having a cavity so that at least one component on the flexible circuit board is positioned within the cavity and in thermal connection to the heat spreader.
摘要翻译：丝网印刷夹具具有安装在一侧的部件的柔性电路板，以允许将焊膏的图案屏蔽到第二侧上，以便随后将部件附接到该侧。在电子封装组件中，具有部件的柔性电路板围绕具有空腔的散热器组件缠绕，使得柔性电路板上的至少一个部件位于腔内并与散热器热连接。

44. 发明公开

US20240314980A1 COLD PLATE WITH INTEGRATED SLIDING PEDESTAL AND PROCESSING SYSTEM INCLUDING THE SAME 审中-公开
公开(公告)号：US20240314980A1
公开(公告)日：2024-09-19
申请号：US18549342
申请日：2022-03-01
申请人： Tesla, Inc.
发明人： Mohamed Haitham Helmy Nasr , Aydin Nabovati , Aldrich Chester L. Ong , Jeffrey John Miller
IPC分类号： H05K7/20 , H05K1/02
CPC分类号： H05K7/20454 , H05K1/0203 , H05K7/20254 , H05K7/20272
摘要： A cold plate with an integrated sliding pedestal and a processing system including the same are provided. In one aspect, the processing system includes a printed circuit board (PCB), a first electronic component arranged over the PCB, and a thermal interface material (TIM) arranged over the first electronic component. The system includes at least one sliding pedestal arranged over the TIM. The sliding pedestal is configured to be spaced a variable distance from the PCB. The system also includes a cold plate arranged over the sliding pedestal and configured to provide a coolant to the sliding pedestal and to cool a second electronic component.

45. 发明授权

US11990741B2 Device for cooling a bus bar 有权
公开(公告)号：US11990741B2
公开(公告)日：2024-05-21
申请号：US17297286
申请日：2019-10-30
申请人： Siemens Aktiengesellschaft
发明人： Ingolf Hoffmann
IPC分类号： H02G15/10 , H02G5/10 , H05K7/20 , H02B13/00
CPC分类号： H02G5/10 , H05K7/20454 , H05K7/209 , H02B13/00
摘要： A device for cooling a bus bar includes a heat absorption element, a heat transportation system and a heat output element. The heat absorption element and heat output element rest essentially in a form-fit manner on respective heat sources or heat sinks, with additional contact pressure being applied with the heat absorption element and heat output element by compression springs or contact elements.

46. 发明公开

US20230403815A1 HIGH-POWER THERMOELECTRIC CHILLER FOR COMPUTING MACHINES 审中-公开
公开(公告)号：US20230403815A1
公开(公告)日：2023-12-14
申请号：US18333277
申请日：2023-06-12
申请人： Benjamin K. Sharfi , Saul Gonzalez , Kadek W. Hemawan
发明人： Benjamin K. Sharfi , Saul Gonzalez , Kadek W. Hemawan
IPC分类号： H05K7/20
CPC分类号： H05K7/20154 , H05K7/20209 , H05K7/20409 , H05K7/20454 , H05K2201/10219
摘要： A thermoelectric chiller for cooling an electronic device comprising a chassis and a heatsink, the heatsink having a flat side and an opposing side equipped with cooling fins, the chassis and heatsink adapted for cooperative engagement to create an air-sealed chamber with the heatsink cooling fins inside the chamber; a cold air inlet on an inlet side of the chamber, the cold air inlet equipped with one or more fans adapted to force ambient air into the chamber; a hot air exhaust on an exhaust side of the chamber, the hot air exhaust providing an outlet for air to leave the chamber; one or more Peltier effect elements, each having a hot side and a cold side, the one or more Peltier effect elements disposed so that their hot side is in thermal contact with the flat side of the heat sink; a cold plate disposed over the one or more Peltier effect elements and in thermal contact with the cold side of the one or more Peltier effect elements; a controller to control the operation of the one or more fans and the one or more Peltier effect elements.

47. 发明公开

US20230269913A1 ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURING METHOD 审中-公开
公开(公告)号：US20230269913A1
公开(公告)日：2023-08-24
申请号：US18043640
申请日：2021-06-01
申请人： HITACHI ASTEMO, LTD.
发明人： Kumiko YOSHINAGA
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20454 , G06F1/20
摘要： An electronic device and an electronic device manufacturing method according to the present invention include, as a mode thereof, a substrate on which an element that produces heat, which is rectangular, is mounted, a radiator member disposed at a position facing the element that produces heat, and a heat conductive material filling a gap between the element that produces heat and the radiator member. The radiator member includes a rectangular frame that surrounds an arrangement region of the heat conductive material in a position of a surface facing the element that produces heat outside a peripheral edge of the element that produces heat, and has a cutout in at least one of four corners of the frame. With this configuration, when assembling the substrate onto the radiator member, excess heat conductive material flows out of the frame from the cutout.

48. 发明公开

US20230200028A1 COMPUTING APPARATUS AND VEHICLE 审中-公开
公开(公告)号：US20230200028A1
公开(公告)日：2023-06-22
申请号：US18169888
申请日：2023-02-16
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： Nengwu Xiang , Xiaolin Jia , Shuncheng Pan , Pinqiang Liu , Jianqiang Yin
IPC分类号： H05K7/20
CPC分类号： H05K7/20854 , H05K7/20872 , H05K7/20863 , H05K7/20254 , H05K7/20454
摘要： An in-vehicle computing apparatus comprises a mainboard, a heat dissipation component, and a target printed circuit board (PCB). A system on chip (SOC) and a connection component are disposed on the target PCB. A side of the mainboard is attached to the heat dissipation component. The target PCB is located on a side of the heat dissipation component that faces away from the mainboard, and is detachably connected to the heat dissipation component by using the connection component.

49. 发明授权

US11644660B2 Cooling device for an endoscope or an exoscope 有权
公开(公告)号：US11644660B2
公开(公告)日：2023-05-09
申请号：US17080074
申请日：2020-10-26
申请人： KARL STORZ SE & Co. KG
发明人： Lawrence Geafer , Andreas Heni , Markus Kupferschmid
IPC分类号： G02B23/24 , A61B1/12 , H05K7/20
CPC分类号： G02B23/2476 , A61B1/12 , H05K7/20336 , H05K7/20454
摘要： A cooling device is provided having a heat source arranged on a support element, the support element arranged on a rigid heat barrier element and the heat barrier element arranged on a housing such that the support element, the heat barrier element and the housing form a mechanically rigid unit, the heat barrier element having a low heat conductivity, wherein a heat conducting element, arranged between the housing and the support element, bears against a first surface of the support element with a second surface and faces a fourth surface of the housing with a third surface, wherein the heat conducting element has a high heat conductivity, the second surface is at an angle to the third surface, and the heat conducting element is formed separately from the support element and the housing.

50. 发明申请

US20190230808A1 TWO-PHASE FLUID-ACTUATED COOLING DEVICE, SYSTEM, AND METHOD 审中-公开
公开(公告)号：US20190230808A1
公开(公告)日：2019-07-25
申请号：US15875538
申请日：2018-01-19
申请人： Lockheed Martin Corporation
发明人： John Ditri , Jay H. Ambrose
IPC分类号： H05K7/14 , H05K7/20
CPC分类号： H05K7/1404 , H05K7/20336 , H05K7/20454 , H05K7/20672
摘要： An electronics circuit card system includes a flexible elongated hollow receptacle; a working fluid disposed within the flexible elongated hollow receptacle; one or more wicking structures formed within an interior hollow region of the flexible elongated hollow receptacle, wherein the one or more wicking structures are configured to circulate the working fluid within the flexible elongated hollow receptacle and expand the flexible elongated hollow receptacle against an electronics circuit card; and a chassis configured to hold the flexible elongated hollow receptacle against the electronics circuit card.

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