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41. 发明申请

US20120168215A1 CURABLE RESIN COMPOSITION 审中-公开
标题翻译：可固化树脂组合物
公开(公告)号：US20120168215A1
公开(公告)日：2012-07-05
申请号：US13393659
申请日：2010-08-27
申请人： Touko Shiina , Masao Arima , Shuichi Yamamoto , Masato Yoshida
发明人： Touko Shiina , Masao Arima , Shuichi Yamamoto , Masato Yoshida
IPC分类号： H05K1/00 , B05D3/06 , C08K3/30 , B05D5/00 , C08L63/10 , C09D163/10
CPC分类号： H05K3/287 , C08G59/1466 , C08G59/4215 , C08L63/10 , G03F7/0047 , G03F7/0048 , G03F7/032 , H05K2201/0209
摘要： Provided is a curable resin composition which exhibits improved developability even in through holes and can suppress the generation of development residue and which can yield a cured product with excellent heat resistance and hardness. A curable resin composition which comprises a carboxyl-containing resin, a photopolymerization initiator, and barium sulfate that has been pretreated with a dispersant having an acid group and/or a dispersant having a block copolymer structure, a graft polymer structure, and/or a star polymer structure.
摘要翻译：提供即使在通孔中也显示出改进的显影性的可固化树脂组合物，并且可以抑制显影残渣的产生，并且可以产生具有优异的耐热性和硬度的固化产物。一种固化性树脂组合物，其包含用具有酸基的分散剂和/或具有嵌段共聚物结构的分散剂预处理的含羧基树脂，光聚合引发剂和硫酸钡，接枝聚合物结构和/或星形聚合物结构。

42. 发明授权

US08187788B2 Photosensitive resin composition and photosensitive film 有权
标题翻译：感光树脂组合物和感光膜
公开(公告)号：US08187788B2
公开(公告)日：2012-05-29
申请号：US12226227
申请日：2007-04-24
申请人： Kuon Miyazaki , Takashi Hayakawa
发明人： Kuon Miyazaki , Takashi Hayakawa
IPC分类号： G03F7/022 , G03F7/26 , G03F7/30 , C08F2/42 , G03C1/00 , C08J3/26
CPC分类号： C08L79/08 , C08G73/1046 , C08G73/1067 , C08G73/1071 , G03F7/0233 , G03F7/161 , G03F7/40 , H05K3/287 , Y10S522/91 , Y10T428/24802
摘要： Disclosed is a photosensitive resin composition comprising an alkali-soluble resin, wherein the dissolution rate of the alkali-soluble resin in an aqueous sodium carbonate solution is not less than 0.04 μm/sec. When a photosensitive layer having a thickness of 30 μm is formed by applying the photosensitive resin composition onto a base and removing the solvent by heating, and thus-obtained photosensitive layer is irradiated with an active ray of 1000 mJ/cm2 or less, the dissolution rate of the portion irradiated with the active ray in the photosensitive layer made of the photosensitive resin composition is not less than 0.22 μm/sec and the film residual rate of the portion not irradiated with the active ray is not less than 90%.
摘要翻译：公开了一种包含碱溶性树脂的光敏树脂组合物，其中碱溶性树脂在碳酸钠水溶液中的溶解速率不小于0.04微米/秒。当通过将感光性树脂组合物涂布在基材上并通过加热除去溶剂来形成厚度为30μm的感光层时，用1000mJ / cm 2以下的活性光线照射所得到的感光层，由感光性树脂组合物制成的感光层中用活性射线照射的部分的比例不小于0.22μm/ sec，未用活性射线照射的部分的膜残留率不小于90％。

43. 发明申请

US20120118616A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE RESIN FILM USING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD 审中-公开
标题翻译：负光敏树脂组合物，使用其的聚酰胺树脂膜和柔性印刷电路板
公开(公告)号：US20120118616A1
公开(公告)日：2012-05-17
申请号：US13387610
申请日：2010-07-21
申请人： Hideaki Saito , Masaya Kakimoto , Hiroshi Ueda , Sumito Uehara
发明人： Hideaki Saito , Masaya Kakimoto , Hiroshi Ueda , Sumito Uehara
IPC分类号： H05K1/03 , G03F7/004
CPC分类号： H05K3/287 , G03F7/027 , G03F7/037 , G03F7/0382 , G03F7/0387 , H05K1/0393 , H05K2201/0154
摘要： A negative photosensitive resin composition contains a polyimide precursor resin obtained by condensation polymerization of a carboxylic anhydride component containing an aromatic tetracarboxylic dianhydride and a diamine component containing an aromatic diamine, a photopolymerizable monomer, and a photopolymerization initiator, wherein a compound having a photoreactive functional group and a glycidyl group is contained as the photopolymerizable monomer in an amount of 0.05% to 15% by weight relative to the total solid content of the negative photosensitive resin composition. Accordingly, a negative photosensitive resin composition is provided in which non-exposed areas have excellent solubility in a developing solution and degradation of the film located in exposed areas, the degradation being caused by the developing solution, is suppressed. Also provided are a printed circuit board and a polyimide film using the negative photosensitive resin composition.
摘要翻译：负型感光性树脂组合物含有通过使含有芳香族四羧酸二酐的羧酸酐成分和含有芳香族二胺的二胺成分缩聚而获得的聚酰亚胺前体树脂，光聚合性单体和光聚合引发剂，其中具有光反应性官能团的化合物相对于负型感光性树脂组合物的总固体成分，含有0.05〜15重量％的光聚合性单体缩水甘油基。因此，提供了一种负型感光性树脂组合物，其中非曝光区域在显影液中具有优异的溶解性，并且抑制了位于曝光区域中的膜的劣化，从而显影液引起的劣化被抑制。还提供了使用负型感光性树脂组合物的印刷电路板和聚酰亚胺膜。

44. 发明申请

US20120061128A1 PHOTOSENSITIVE RESIN, CURABLE RESIN COMPOSITION CONTAINING THE SAME, DRY FILM THEREOF, AND PRINTED CIRCUIT BOARD USING THEM 有权
标题翻译：感光树脂，含有其的可固化树脂组合物，其干膜和使用它们的印刷电路板
公开(公告)号：US20120061128A1
公开(公告)日：2012-03-15
申请号：US13231498
申请日：2011-09-13
申请人： Nobuhito ITO , Masao Arima , Syouji Nishiguchi , Kouji Ogawa , Masayuki Kobayashi , Atsushi Sakamoto
发明人： Nobuhito ITO , Masao Arima , Syouji Nishiguchi , Kouji Ogawa , Masayuki Kobayashi , Atsushi Sakamoto
IPC分类号： H05K1/03 , G03F7/038 , C08G8/32
CPC分类号： H05K3/287 , C08G8/30 , C08G8/32 , C08L61/14 , G03F7/0388
摘要： A carboxyl group-containing photosensitive resin is obtained by reacting an α,β-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.
摘要翻译：含羧基的感光性树脂通过使含有α，bgr-烯属不饱和基团的一元羧酸（c）与含有下述通式（I）所示的结构的酚类化合物（a）反应而得到，其分子中的两个酚羟基，其中部分或全部酚羟基被修饰成氧烷基，并进一步使多元酸酐（d）与所得反应产物反应; 其中R1表示1〜11个碳原子的烃基，SO2基，氧原子和硫原子，R2表示碳原子数为1〜11的烃基，“a”表示0〜3的整数， “n”表示1〜2的整数，“m”表示1〜10的整数。

45. 发明申请

US20110083884A1 NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF 有权
标题翻译：新型聚酰亚胺前体组合物及其用途
公开(公告)号：US20110083884A1
公开(公告)日：2011-04-14
申请号：US12997151
申请日：2009-07-15
申请人： Koji Okada , Yoshihide Sekito
发明人： Koji Okada , Yoshihide Sekito
IPC分类号： H05K1/00 , C08G73/10 , C08J3/28 , C08L79/08
CPC分类号： C08G73/1035 , C08G18/0823 , C08G18/10 , C08G18/44 , C08G73/1007 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08G73/16 , C08L79/08 , G03F7/037 , G03F7/40 , H05K1/0393 , H05K3/287 , C08G18/346 , C08G18/348
摘要： An object of the present invention is to provide (a) a polyimide precursor solution which is curable at low temperatures (not more than 200° C.) and which has excellent long-term storage stability, (b) a photosensitive resin composition, a photosensitive resin film, a thermosetting resin composition, and a polyimide insulating film, each of which is obtainable from the polyimide precursor solution and each of which is preferably usable as an insulating material for electric and electronic purposes, and (c) a printed wiring board provided with the insulating film. The above object is achievable by use of a polyimide precursor composition solution containing at least a partially imidized polyimide precursor having a urethane bond.
摘要翻译：本发明的目的是提供（a）在低温（不高于200℃）下可固化并具有优异的长期保存稳定性的聚酰亚胺前体溶液，（b）感光性树脂组合物，感光性树脂膜，热固性树脂组合物和聚酰亚胺绝缘膜，其可以从聚酰亚胺前体溶液获得，并且各自优选用作电气和电子目的的绝缘材料，以及（c）印刷线路板设有绝缘膜。上述目的可以通过使用含有至少部分酰亚胺化的具有氨基甲酸酯键的聚酰亚胺前体的聚酰亚胺前体组合物溶液来实现。

46. 发明申请

US20110061914A1 NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE OF THE SAME, AND PRODUCTION METHOD OF THE SAME 有权
标题翻译：新型聚酰亚胺前体组合物，其使用及其生产方法
公开(公告)号：US20110061914A1
公开(公告)日：2011-03-17
申请号：US12992450
申请日：2009-05-14
申请人： Yoshihide Sekito
发明人： Yoshihide Sekito
IPC分类号： H05K1/00 , C08G18/00 , C08G77/26 , C09D179/08 , C08F2/50 , H05K3/00
CPC分类号： G03F7/037 , C08G18/341 , C08G18/346 , C08G18/758 , C08G18/7621 , C08G73/10 , C08G73/1046 , C08G73/106 , C09D179/08 , H05K1/0346 , H05K3/287
摘要： An object of the present invention is to provide (i) a polyimide precursor composition which is curable at a low temperature (not more than 250° C.) and which has a low viscosity despite having a high concentration, and a production method thereof, (ii) a polyimide coating film obtained from the polyimide precursor composition and having good properties, and a production method thereof, (iii) a photosensitive resin composition prepared by use of the polyimide precursor composition, and a production method thereof. The object of the present invention can be attained by a polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and an isocyanate compound having a specific structure, or optionally a diamine.
摘要翻译：本发明的目的是提供（i）聚酰亚胺前体组合物及其制造方法，该聚酰亚胺前体组合物在低温（不高于250℃）下可固化并且尽管浓度高，但粘度低。（ii）由聚酰亚胺前体组合物获得并具有良好性能的聚酰亚胺涂膜及其制备方法，（iii）使用聚酰亚胺前体组合物制备的感光性树脂组合物及其制备方法。本发明的目的可以通过含有具有特定结构的酰亚胺化四羧酸和具有特定结构的异氰酸酯化合物或任选的二胺的聚酰亚胺前体组合物来实现。

47. 发明授权

US07812063B2 Flame-retardant resin formulation and its use 有权
标题翻译：阻燃树脂配方及其用途
公开(公告)号：US07812063B2
公开(公告)日：2010-10-12
申请号：US12008602
申请日：2008-01-11
申请人： Mathias Dietz , Harald Bauer , Werner Krause
发明人： Mathias Dietz , Harald Bauer , Werner Krause
IPC分类号： C08F2/50 , C08J7/18 , C08J7/04 , C09K21/00
CPC分类号： H05K3/287 , C08K5/5313 , H05K2201/012 , C08L63/10
摘要： The invention relates to a flame-retardant resin formulation comprising respectively at least one flame-retardant component, one alkali-soluble component, one polymerizable monomer, one photoinitiator, and one epoxy component, which comprises, as flame-retardant component, a phosphinic salt of the formula (I), in which R1 and R2 are identical or different and, independently of one another, are C1-C6-alkyl, linear or branched, and/or aryl; M is Mg, Ca, Al, Sb, Sn, Ge, Ti, Zn, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na, K, and/or a protonated nitrogen base, and m is from 1 to 4. This novel flame-retardant resin formulation is preferably used as solder resist.
摘要翻译：本发明涉及一种阻燃树脂配方，其分别包含至少一种阻燃组分，一种碱溶性组分，一种可聚合单体，一种光引发剂和一种环氧组分，其包含作为阻燃组分的次膦酸盐式（I）的化合物，其中R 1和R 2相同或不同并且彼此独立地为C 1 -C 6 - 烷基，直链或支链和/或芳基; M是Mg，Ca，Al，Sb，Sn，Ge，Ti，Zn，Fe，Zr，Ce，Bi，Sr，Mn，Li，Na，K和/或质子化的氮碱，m是1〜该新型阻燃树脂配方优选用作阻焊剂。

48. 发明申请

US20100218984A1 PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD 审中-公开
标题翻译：光敏干胶片，印刷线路板及其制造方法，以及生产印刷线路板的工艺
公开(公告)号：US20100218984A1
公开(公告)日：2010-09-02
申请号：US12223196
申请日：2007-01-23
申请人： Toshio Yamanaka , Koji Okada , Kohei Kojima , Hitoshi Nojiri
发明人： Toshio Yamanaka , Koji Okada , Kohei Kojima , Hitoshi Nojiri
IPC分类号： H05K1/00 , G03F7/004
CPC分类号： G03F7/0955 , G03F7/037 , G03F7/161 , H05K3/287 , H05K2201/012 , H05K2201/0195
摘要： The present invention is to provide (i) a photosensitive dry film resist which allows water system development and which is excellent in resolution, flame retardancy, adhesiveness, moisture resistance, electric reliability, and preservation stability, (ii) a method for producing the photosensitive dry film resist, and (iii) usage thereof.The foregoing object can be achieved by using a multi-layer photosensitive dry film resist comprising at least: a first photosensitive layer which essentially includes a binder polymer (A1), a (meth)acrylic compound (B1), a photoreaction initiator (C1), and a flame retardant (D1), and a second photosensitive layer which essentially includes a binder polymer (A2), a (meth)acrylic compound (B2), a photoreaction initiator (C2) and which substantially does not include a flame retardant (D2), wherein: when a weight ratio of the flame retardant (D1) to an entire weight of the first photosensitive layer is defined as a first photosensitive layer flame retardant content and a weight ratio of the flame retardant (D2) to an entire weight of the second photosensitive layer is defined as a second photosensitive layer flame retardant content, the second photosensitive layer flame retardant content is 0 wt % or more and 10 wt % or less, and in case where the first photosensitive layer flame retardant content is 100, the second photosensitive layer flame retardant content is 0 wt % or more and 50 wt % or less.
摘要翻译：本发明提供（i）允许水系开发并且分辨率，阻燃性，粘合性，耐湿性，电可靠性和保存稳定性优异的感光性干膜抗蚀剂，（ii）感光性的制造方法干膜抗蚀剂，和（iii）使用。上述目的可以通过使用多层感光性干膜抗蚀剂来实现，该抗蚀剂至少包括：基本上包含粘合剂聚合物（A1），（甲基）丙烯酸类化合物（B1），光反应引发剂（C1），和阻燃剂（D1）和基本上包含粘合剂聚合物（A2），（甲基）丙烯酸化合物（B2），光反应引发剂（C2），并且基本上不包含阻燃剂的第二感光层 D2），其中：当阻燃剂（D1）与第一感光层的整体重量的重量比定义为第一感光层阻燃剂含量和阻燃剂（D2）与总重量的重量比第二感光层被定义为第二感光层阻燃剂含量，第二感光层阻燃剂含量为0重量％以上且10重量％以下，并且在第一感光层阻燃剂 t含量为100，第二感光层阻燃剂含量为0重量％以上且50重量％以下。

49. 发明申请

US20090292038A1 Flame Retardant Photoimagable Coverlay Compositions and Methods Relating thereto 审中-公开
标题翻译：阻燃可光成像覆盖物组合物及其相关方法
公开(公告)号：US20090292038A1
公开(公告)日：2009-11-26
申请号：US12083988
申请日：2006-12-21
申请人： Mutoh Tsutomu
发明人： Mutoh Tsutomu
IPC分类号： C08J3/28
CPC分类号： G03F7/027 , G03F7/029 , H05K3/287 , H05K3/389 , H05K2201/012 , H05K2203/124
摘要： The present invention is directed to phosphorus containing (or “halogen free”) flame retardant photoimagable compositions useful as a coverlay material in a flexible electronic circuitry package. These compositions are generally photosensitive and comprise phosphorus containing acrylates and phosphorus-containing photo-initiators mixed with a polymer binder. The compositions of the present invention typically comprise elemental phosphorus in an amount between, and including, any two of the following numbers 2.0, 2.2, 2.4, 2.6, 2.8, 3.0, 3.2, 3.4, 3.6, 3.8, 4.0, 4.2, 4.4, 4.6, 4.8, 5.0, 5.2, 5.4, 5.6, 5.8 and 6.0 weight percent.
摘要翻译：本发明涉及用作柔性电子电路封装中的覆盖材料的含磷（或“无卤素”）阻燃光可光成像组合物。这些组合物通常是光敏的，并且包含与聚合物粘合剂混合的含磷丙烯酸酯和含磷光引发剂。本发明的组合物通常包含以下数量中的任何两个之间的量的元素磷，包括以下数字中的任何两个：2.0,2.2,2.4,2.6,2.8,3.0,3.2,3.4,3.6,3.8,4.0,4.2,4.4， 4.6,4.8,5.0,5.2,5.4,5.6,5.8和6.0重量％。

50. 发明授权

US07524617B2 Low-temperature curable photosensitive compositions 有权
公开(公告)号：US07524617B2
公开(公告)日：2009-04-28
申请号：US10997701
申请日：2004-11-23
申请人： Thomas E. Dueber , Michael W. J. West , Kuppusamy Kanakarajan , Brian C. Auman
发明人： Thomas E. Dueber , Michael W. J. West , Kuppusamy Kanakarajan , Brian C. Auman
IPC分类号： G03F7/028 , G03F7/20 , G03F7/30 , G03F7/32 , G03F7/40
CPC分类号： H05K3/287 , G03F7/037 , Y10S430/106 , Y10S430/117 , Y10S430/127
摘要： The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160° C. and up to 200° C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.

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