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41. 发明授权

US08794981B1 Electrical connector 有权
标题翻译：电连接器
公开(公告)号：US08794981B1
公开(公告)日：2014-08-05
申请号：US14104294
申请日：2013-12-12
申请人： Google Inc.
发明人： Adam Rodriguez , Aaron Leiba , Jeffrey Hayashida
IPC分类号： H01R12/00
CPC分类号： H01R43/24 , H01R9/032 , H01R13/405 , H01R13/6658 , H01R24/60 , H01R2107/00 , H05K1/117 , H05K2201/1031 , H05K2201/1034 , H05K2201/10356 , Y02P70/611
摘要： An electrical connector may include a printed circuit board (PCB), the PCB including a plurality of contacts, a plurality of wires coupled to the plurality of contacts on the PCB, a non-conductive pad extending across the PCB, a plurality of pins extending across the non-conductive pad, and an overmold. The plurality of pins may be coupled to the plurality of contacts. The overmold may cover at least a portion of the PCB and at least a first portion of each of the plurality of pins. The overmold may include a first aperture exposing at least a second portion of each of the plurality of pins.
摘要翻译：电连接器可以包括印刷电路板（PCB），PCB包括多个触点，耦合到PCB上的多个触点的多个导线，跨越PCB延伸的非导电焊盘，多个引脚延伸穿过非导电垫，以及包覆模制。多个销可以联接到多个触点。包覆模制可以覆盖PCB的至少一部分和多个销中的每一个的至少第一部分。包覆模制可以包括暴露多个销中的每一个的至少第二部分的第一孔。

42. 发明申请

US20140203886A1 Communications Connectors Including Transmission Lines Having Impedance Discontinuities that Improve Return Loss And/or Insertion Loss Performance and Related Methods 有权
标题翻译：通信连接器包括具有阻抗不连续性的输电线路，可提高回波损耗和/或插入损耗性能及相关方法
公开(公告)号：US20140203886A1
公开(公告)日：2014-07-24
申请号：US14090073
申请日：2013-11-26
申请人： CommScope, Inc. of North Carolina
发明人： Richard A. Schumacher
IPC分类号： H01P5/02 , H01R13/6473
CPC分类号： H01R13/6473 , H01R13/6461 , H01R13/6466 , H01R24/64 , H05K1/0219 , H05K1/0228 , H05K1/024 , H05K1/0245 , H05K1/117 , H05K2201/0187 , H05K2201/0191 , H05K2201/09672 , H05K2201/09727 , H05K2201/09781 , H05K2201/1034 , H05K2201/10356
摘要： Communications plugs are provided that include a housing that receives the conductors of the communication cable. A printed circuit board is mounted at least partially within the housing. A plurality of plug contacts are on the printed circuit board, and the printed circuit board includes a plurality of conductive paths that electrically connect respective ones of the conductors to respective ones of the plug contacts. First and second of the conductive paths are arranged as a first differential pair of conductive paths that comprise a portion of a first differential transmission line through the communications plug, where the first differential transmission line includes a first transition region where the impedance of the first differential transmission line changes by at least 20% and a second transition region impedance of the first differential transmission line changes by at least 20%.
摘要翻译：提供通信插头，其包括容纳通信电缆的导体的壳体。印刷电路板至少部分地安装在壳体内。多个插头触点位于印刷电路板上，并且印刷电路板包括多个导电路径，其将相应的导体电连接到相应的插头触点。第一和第二导电路径被布置为包括通过通信插头的第一差分传输线的一部分的导电路径的第一差分对，其中第一差分传输线包括第一过渡区，其中第一差分传输线改变至少20％，第一差分传输线的第二过渡区阻抗改变至少20％。

43. 发明授权

US08733974B2 Light emitting diode module and lamp 有权
标题翻译：发光二极管模块和灯
公开(公告)号：US08733974B2
公开(公告)日：2014-05-27
申请号：US13444751
申请日：2012-04-11
申请人： Huan-Hsiang Huang , Chih-Wei Lu
发明人： Huan-Hsiang Huang , Chih-Wei Lu
IPC分类号： F21S2/00 , F21V21/00 , H01R33/00 , H01R33/945
CPC分类号： F21V19/0055 , F21V7/00 , F21V23/06 , F21Y2103/33 , F21Y2105/10 , F21Y2115/10 , H01R12/53 , H05K1/144 , H05K3/3447 , H05K2201/041 , H05K2201/09063 , H05K2201/10106 , H05K2201/10356 , H05K2201/10878
摘要： A light emitting diode module includes a metal substrate, a main circuit, an adapter circuit board, an adapter circuit and a plurality of light emitting diodes, and the main circuit is installed on the metal substrate and includes a plurality of first power points, an adapter circuit installed on the adapter circuit board and including a plurality of second power points, each being electrically coupled to each corresponding first power point, and the light emitting diode is installed on a surface of the metal substrate and electrically coupled to the main circuit. A light emitting diode lamp includes a reflection cover, a light emitting diode module and a plurality of power lines.
摘要翻译：发光二极管模块包括金属基板，主电路，适配器电路板，适配器电路和多个发光二极管，并且主电路安装在金属基板上，并且包括多个第一电源点，适配器电路安装在适配器电路板上并且包括多个第二电源点，每个第二电源点电耦合到每个对应的第一电源点，并且发光二极管安装在金属基板的表面上并电耦合到主电路。发光二极管灯包括反射盖，发光二极管模块和多条电源线。

44. 发明授权

US08672531B2 LED system, LED lamp and method for assembling a LED system 失效
标题翻译： LED系统，LED灯和组装LED系统的方法
公开(公告)号：US08672531B2
公开(公告)日：2014-03-18
申请号：US12275468
申请日：2008-11-21
申请人： Harald Stoyan
发明人： Harald Stoyan
IPC分类号： H01R33/00
CPC分类号： F21V21/002 , F21K9/00 , F21S4/10 , F21S4/28 , F21Y2115/10 , H01R4/24 , H01R12/675 , H01R25/003 , H01R31/085 , H05K1/0295 , H05K1/189 , H05K3/222 , H05K2201/09954 , H05K2201/10106 , H05K2201/10356 , H05K2203/173 , H05K2203/175
摘要： The LED system has a set consisting of multiple LED lamps and an integrally formed electrical connecting member common to the LED lamps, wherein the electrical connecting member has multiple connection points for contacting a respective LED lamp.
摘要翻译： LED系统具有由多个LED灯组成的组和LED灯共用的整体形成的电连接构件，其中电连接构件具有用于接触相应的LED灯的多个连接点。

45. 发明申请

US20140014410A1 MULTI-CORE CABLE ASSEMBLY 有权
标题翻译：多芯电缆总成
公开(公告)号：US20140014410A1
公开(公告)日：2014-01-16
申请号：US13937496
申请日：2013-07-09
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Masato TANAKA
IPC分类号： H01R4/00
CPC分类号： H01R4/00 , H01R9/034 , H05K1/117 , H05K3/3405 , H05K2201/094 , H05K2201/09809 , H05K2201/10356
摘要： A multi-core cable assembly is formed by arranging a plurality of cables side by side and connecting the cables to a substrate 30 which is a connection member. The plurality of cables configure flat cable units 10, 20 for each diameter of cables, and ground bars 16, 27 are fixed thereto so as to be electrically connected with a shield member included in the cable. Each of ground bars 16, 27 are electrically connected to a ground pad 31 of the substrate 30. The ground bars 16, 27 adjacent to each other are disposed to be shifted in a longitudinal direction of the cable. In addition, two ground bars 16, 27 interposing the other one ground bar and positioned at both sides thereof are disposed in a position overlapped in the longitudinal direction of the cables.
摘要翻译：多芯电缆组件通过并排布置多根电缆并将电缆连接到作为连接部件的基板30而形成。多个电缆为每个电缆直径构成扁平电缆单元10,20，并且接地棒16,27被固定到其上以与包括在电缆中的屏蔽构件电连接。接地棒16,27中的每一个电连接到基板30的接地焊盘31.彼此相邻的接地棒16,27设置成沿电缆的纵向移动。另外，插入另一个接地棒并位于其两侧的两个接地棒16,27设置在与电缆的纵向重叠的位置。

46. 发明申请

US20140003018A1 WIRING BOARD, MANUFACTURING METHOD FOR WIRING BOARD, AND IMAGE PICKUP APPARATUS 有权
标题翻译：接线板，接线板制造方法及图像拾取装置
公开(公告)号：US20140003018A1
公开(公告)日：2014-01-02
申请号：US14017849
申请日：2013-09-04
申请人： OLYMPUS CORPORATION
发明人： Noriyuki FUJIMORI
IPC分类号： H05K1/18 , H05K3/10
CPC分类号： H05K1/181 , A61B1/0011 , A61B1/051 , H04N5/2251 , H05K1/18 , H05K1/186 , H05K3/0052 , H05K3/10 , H05K3/403 , H05K3/4602 , H05K2201/0919 , H05K2201/10121 , H05K2201/10356 , H05K2201/10416 , H05K2201/10446 , Y10T29/49162
摘要： A wiring board includes a plurality of wiring layers, a plurality of insulating layers, and an electrode member made of a conductive material, the electrode member being incorporated in the wiring board in a state in which the electrode member includes exposed sections on side surfaces that cross the plurality of wiring layers and the plurality of insulating layers.
摘要翻译：布线基板包括多个布线层，多个绝缘层和由导电材料制成的电极构件，该电极构件在电极构件包括在侧面上的暴露部分的状态下结合在布线板中，穿过多个布线层和多个绝缘层。

47. 发明申请

US20130286622A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20130286622A1
公开(公告)日：2013-10-31
申请号：US13828142
申请日：2013-03-14
申请人： Taichi OBARA , Rei YONEYAMA , Hiroyuki OKABE
发明人： Taichi OBARA , Rei YONEYAMA , Hiroyuki OKABE
IPC分类号： H05K1/02 , H05K3/36
CPC分类号： H05K1/0296 , H01L2224/45565 , H01L2224/48091 , H01L2924/13055 , H01L2924/19107 , H05K3/368 , H05K2201/042 , H05K2201/10356 , Y10T29/49126 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film.
摘要翻译：半导体器件包括第一印刷电路板，具有电线的扁平电缆和覆盖除了两端之外的电线的涂膜，每个电线的一端连接到第一印刷电路板，第二印刷电路板印刷电路板连接到每条电线的另一端。扁平电缆以第一印刷电路板和第二印刷电路板彼此面对的方式弯曲。在涂膜的一部分中形成平坦的表面。

48. 发明申请

US20130271976A1 LIGHT EMITTING DIODE MODULE AND LAMP 有权
标题翻译：发光二极管模块和灯
公开(公告)号：US20130271976A1
公开(公告)日：2013-10-17
申请号：US13444751
申请日：2012-04-11
申请人： Huan-Hsiang Huang , Chih-Wei Lu
发明人： Huan-Hsiang Huang , Chih-Wei Lu
IPC分类号： F21V7/00 , F21V21/00
CPC分类号： F21V19/0055 , F21V7/00 , F21V23/06 , F21Y2103/33 , F21Y2105/10 , F21Y2115/10 , H01R12/53 , H05K1/144 , H05K3/3447 , H05K2201/041 , H05K2201/09063 , H05K2201/10106 , H05K2201/10356 , H05K2201/10878
摘要： A light emitting diode module includes a metal substrate, a main circuit, an adapter circuit board, an adapter circuit and a plurality of light emitting diodes, and the main circuit is installed on the metal substrate and includes a plurality of first power points, an adapter circuit installed on the adapter circuit board and including a plurality of second power points, each being electrically coupled to each corresponding first power point, and the light emitting diode is installed on a surface of the metal substrate and electrically coupled to the main circuit. A light emitting diode lamp includes a reflection cover, a light emitting diode module and a plurality of power lines.
摘要翻译：发光二极管模块包括金属基板，主电路，适配器电路板，适配器电路和多个发光二极管，并且主电路安装在金属基板上，并且包括多个第一电源点，适配器电路安装在适配器电路板上并且包括多个第二电源点，每个第二电源点电耦合到每个对应的第一电源点，并且发光二极管安装在金属基板的表面上并电耦合到主电路。发光二极管灯包括反射盖，发光二极管模块和多条电源线。

49. 发明申请

US20130210289A1 Communications Plugs Having Plug Blades with Staggered Current-Carrying Paths and Controlled Offending Crosstalk and Patch Cords Including Such Plugs 有权
标题翻译：具有插头叶片的通信插头具有交错的电流携带路径和受控的违规串扰和包括这种插头的跳线
公开(公告)号：US20130210289A1
公开(公告)日：2013-08-15
申请号：US13802882
申请日：2013-03-14
申请人： CommScope, Inc. of North Carolina
发明人： Richard A. Schumacher , Amid I. Hashim , Brian J. Fitzpatrick , Bryan S. Moffitt , Wayne D. Larsen
IPC分类号： H01R24/00
CPC分类号： H01R13/6469 , H01R12/53 , H01R13/6461 , H01R13/6466 , H01R13/6658 , H01R23/005 , H01R24/28 , H01R24/64 , H01R2107/00 , H01R2201/04 , H05K1/0228 , H05K1/0245 , H05K1/117 , H05K1/162 , H05K2201/09181 , H05K2201/0949 , H05K2201/1034 , H05K2201/10356
摘要： Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conductive paths that connect the first through fourth conductors to the respective first through fourth plug contacts. The first and second conductors, conductive paths, and plug contacts form a first differential transmission line, and the third and fourth conductors, conductive paths, and plug contacts form a second differential transmission line. Each of the first through fourth plug contacts has a first segment that extends longitudinally along a first surface of the printed circuit board, and the signal current injection point into the first segment of at least some of the first through fourth plug contacts is into middle portions of their respective first segments.
摘要翻译：提供了包括至少具有第一至第四导体的通信电缆和附接到电缆的插头的跳线。插头包括容纳电缆的外壳，印刷电路板，第一至第四插头触头以及将第一至第四导体连接到相应的第一至第四插头触头的第一至第四导电路径。第一和第二导体，导电路径和插头触点形成第一差分传输线，并且第三和第四导体，导电路径和插头触点形成第二差分传输线。第一至第四插头触点中的每一个具有沿着印刷电路板的第一表面纵向延伸的第一段，并且进入第一至第四插头触点中的至少一些的第一段的信号电流注入点进入中间部分的各自的第一部分。

50. 发明申请

US20130192887A1 FLAT WIRING MATERIAL AND MOUNTING BODY USING THE SAME 审中-公开
标题翻译：平面接线材料和使用它的安装体
公开(公告)号：US20130192887A1
公开(公告)日：2013-08-01
申请号：US13713739
申请日：2012-12-13
申请人： Hitachi Cable, Ltd.
发明人： Akihiro YAGUCHI , Takumi KOBAYASHI , Yuju ENDO , Hiroaki KOMATSU , Kenichi MURAKAMI , Rikio SAITO
IPC分类号： H01B7/08
CPC分类号： H01B7/0823 , H01B7/0846 , H01R12/62 , H01R12/7029 , H05K1/0215 , H05K1/148 , H05K3/303 , H05K3/3421 , H05K3/363 , H05K2201/10356 , H05K2201/1059 , H05K2201/10757 , H05K2201/2009 , Y02P70/613
摘要： A flat wiring material includes a plurality of conductors arranged in parallel, an insulating covering member covering collectively the plurality of conductors while allowing both end portions of the plurality of conductors to be exposed, an engaging member disposed at a position on the covering member and close to at least one of the exposed both end portions of the plurality of conductors and including an insertion portion that is formed at an end portion extending in the width direction for being inserted into and engaged with a through-hole formed on a mounting substrate, and a fixing member fixing the engaging member to the covering member. The insertion portion of the engaging member includes an opening allowing an elastic deformation thereof upon the insertion into the through-hole and a protruding portion for preventing disengagement in a direction opposite to the insertion direction after being inserted into the through-hole.
摘要翻译：扁平布线材料包括平行配置的多个导体，绝缘覆盖部件，其共同地覆盖多个导体，同时允许多个导体的两个端部露出，接合部件设置在覆盖部件上的位置并且闭合涉及多个导体的暴露的两个端部中的至少一个，并且包括形成在沿宽度方向延伸的端部的插入部分，以插入并与形成在安装基板上的通孔接合，固定构件将接合构件固定到覆盖构件。接合构件的插入部分包括允许在插入通孔中时弹性变形的开口和用于在插入通孔中之后防止在与插入方向相反的方向上脱离的突出部分。

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