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41. 发明授权

US08336205B2 Method of manufacturing printed wiring board with built-in electronic component 有权
标题翻译：制造内置电子部件的印刷电路板的制造方法
公开(公告)号：US08336205B2
公开(公告)日：2012-12-25
申请号：US13209052
申请日：2011-08-12
申请人： Hironori Tanaka , Kazuhiro Yoshikawa , Naoaki Fujii , Atsunari Yamashita
发明人： Hironori Tanaka , Kazuhiro Yoshikawa , Naoaki Fujii , Atsunari Yamashita
IPC分类号： H01K3/10
CPC分类号： H05K1/185 , H01L24/19 , H01L24/82 , H01L2223/54426 , H01L2224/04105 , H01L2224/32225 , H01L2224/82039 , H01L2224/82047 , H01L2224/83132 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3511 , H05K1/036 , H05K1/188 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K3/4611 , H05K2201/0352 , H05K2201/09509 , H05K2201/09536 , H05K2201/0969 , H05K2201/09918 , H05K2201/10636 , Y02P70/611 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49165
摘要： A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.
摘要翻译：通过提供具有第一绝缘层，第二绝缘层和导电膜的基底基板的方法制造印刷线路板。在基于对准标记确定的位置处将电子部件放置在第一绝缘层上。在将电子部件封闭在第二绝缘层的开口内之后，在基于对准标记确定的位置处形成暴露电子部件的端子的通孔，该位置用于确定电子部件的位置。通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

42. 发明申请

US20120293974A1 ELECTRONIC DEVICE MODULE 有权
标题翻译：电子设备模块
公开(公告)号：US20120293974A1
公开(公告)日：2012-11-22
申请号：US13459768
申请日：2012-04-30
申请人： Takuya Asano , Masaki Kondoh
发明人： Takuya Asano , Masaki Kondoh
IPC分类号： H05K1/14
CPC分类号： H05K1/141 , H01L27/3276 , H05K1/0269 , H05K1/144 , H05K3/361 , H05K2201/0108 , H05K2201/09918 , H05K2203/166
摘要： An electronic device module includes a first substrate having a first wiring layer and a first alignment mark, the first alignment mark being transparent in a visible region of the electromagnetic spectrum, and a second substrate facing a part of the first substrate and having a second wiring layer and a second alignment mark facing the first alignment mark.
摘要翻译：电子设备模块包括具有第一布线层和第一对准标记的第一基板，第一对准标记在电磁光谱的可见区域是透明的，第二基板面对第一基板的一部分，并具有第二布线层和面向第一对准标记的第二对准标记。

43. 发明授权

US08269911B2 Liquid crystal display device 有权
标题翻译：液晶显示装置
公开(公告)号：US08269911B2
公开(公告)日：2012-09-18
申请号：US12255115
申请日：2008-10-21
申请人： Saburo Watanabe , Hiroshi Tokuyama , Norihisa Fukayama
发明人： Saburo Watanabe , Hiroshi Tokuyama , Norihisa Fukayama
IPC分类号： G02F1/1333
CPC分类号： H05K1/189 , G02B6/0055 , G02B6/0083 , G02B6/0085 , G02F1/133615 , G02F2001/133628 , H01L2224/48227 , H05K1/0269 , H05K3/303 , H05K2201/09063 , H05K2201/09918 , H05K2201/10106 , H05K2203/168 , Y02P70/613
摘要： In a liquid crystal display device which uses light emitting diodes as a light source, the present invention provides a light source which can be effectively housed in a housing casing of a backlight even when an area of a printed circuit board is increased by taking radiation of heat from the light emitting diodes into consideration. A printed circuit board is formed by arranging light emitting diodes on a flexible substrate. The printed circuit board is formed with an area larger than an area of a light incident surface of a light guide plate, and is arranged to face the light incident surface of the light guide plate in an opposed manner. The light guide plate and the printed circuit board are housed in the inside of a housing casing, the printed circuit board is made foldable by forming slits in the printed circuit board thus enabling housing of the printed circuit board in the housing casing in a folded shape. Due to housing of the printed circuit board in a folded shape, a contact area of the printed circuit board with the housing casing is increased thus enhancing a heat radiation effect.
摘要翻译：在使用发光二极管作为光源的液晶显示装置中，本发明提供一种能够有效地容纳在背光源的壳体中的光源，即使当印刷电路板的面积通过照射考虑到发光二极管的热量。通过在柔性基板上排列发光二极管形成印刷电路板。印刷电路板形成有比导光板的光入射面的面积大的面积，并且相对地配置为与导光板的光入射面相对。导光板和印刷电路板被容纳在壳体的内部，印刷电路板通过在印刷电路板中形成狭缝而被制成可折叠，从而能够将印刷电路板在壳体壳体中以折叠的形状。由于印刷电路板的外壳为折叠形状，印刷电路板与外壳的接触面积增加，从而增强了散热效果。

44. 发明申请

US20120216694A1 Method For Centering A Print Track 审中-公开
标题翻译：打印轨道居中的方法
公开(公告)号：US20120216694A1
公开(公告)日：2012-08-30
申请号：US13394134
申请日：2010-09-02
申请人： Marco Galiazzo , Andrea Baccini , Giorgio Cellere , Luigi De Santi , Gianfranco Pasqualin , Tommaso Vercesi
发明人： Marco Galiazzo , Andrea Baccini , Giorgio Cellere , Luigi De Santi , Gianfranco Pasqualin , Tommaso Vercesi
IPC分类号： B41F33/00
CPC分类号： H05K1/0269 , H01L31/1876 , H05K3/12 , H05K2201/0969 , H05K2201/09727 , H05K2201/09918 , H05K2203/1476 , H05K2203/166 , H05K2203/173 , Y02E10/50 , Y02P70/521
摘要： A method for depositing a material on a surface of a substrate includes depositing a first print material and a second print material on the surface of the substrate using a printing apparatus, and depositing a marker element on a portion of the substrate surface. The deposited first print material forms a plurality of first print tracks in a pattern and the deposited second print material forms one or more second print tracks on the surface of the substrate. In addition, the second print tracks includes a centering feature, where there is no second print material within the centering feature and at least a portion of the centering feature is disposed on the portion of the surface of the substrate having the marker element. Further, at least a portion of the second print tracks cover at least a portion of the plurality of first print tracks.
摘要翻译：一种用于在衬底的表面上沉积材料的方法包括：使用印刷设备在衬底的表面上沉积第一印刷材料和第二印刷材料，以及在衬底表面的一部分上沉积标记元件。沉积的第一印刷材料以图案形成多个第一印刷轨迹，并且沉积的第二印刷材料在基板的表面上形成一个或多个第二印刷轨迹。此外，第二打印轨迹包括定心特征，其中在定心特征内不存在第二打印材料，并且定心特征的至少一部分设置在具有标记元件的基底表面的部分上。此外，第二打印轨道的至少一部分覆盖多个第一打印轨道的至少一部分。

45. 发明申请

US20120186868A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20120186868A1
公开(公告)日：2012-07-26
申请号：US13435450
申请日：2012-03-30
申请人： Kota Noda , Tsutomu Yamauchi
发明人： Kota Noda , Tsutomu Yamauchi
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166 , Y10T29/49124 , Y10T29/49155 , Y10T29/49165
摘要： A wiring board having a penetrating hole formed by forming holes with different shapes from both surfaces of a substrate. In such a penetrating hole, the depth of a first opening portion formed in the first-surface side of the substrate is shallower than the depth of a second opening portion formed in the second-surface side, and the diameter of a first opening is greater than the diameter of a second opening. Even if the gravity line of the first opening portion and the gravity line of the second opening portion are shifted from each other, the region of the second opening portion inserted into the inner space of the first opening portion may be made larger.
摘要翻译：一种布线板，具有通过从基板的两个表面形成具有不同形状的孔而形成的贯通孔。在这样的贯通孔中，形成在基板的第一表面侧的第一开口部的深度比形成在第二表面侧的第二开口部的深度浅，第一开口的直径更大比第二开口的直径。即使第一开口部分的重力线和第二开口部分的重力线彼此偏移，可以使插入第一开口部分的内部空间的第二开口部分的区域更大。

46. 发明申请

US20120170240A1 METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD FOR PROVIDING AN ELECTRONIC COMPONENT THEREIN 审中-公开
标题翻译：制造用于提供电子元件的多层印刷线路板的方法
公开(公告)号：US20120170240A1
公开(公告)日：2012-07-05
申请号：US13416560
申请日：2012-03-09
申请人： Hironori Tanaka
发明人： Hironori Tanaka
IPC分类号： H05K7/06 , H05K1/16
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2223/54426 , H01L2223/5448 , H01L2223/54486 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/2518 , H01L2224/2919 , H01L2224/83192 , H01L2224/838 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/19041 , H05K1/0231 , H05K1/0269 , H05K3/0035 , H05K3/4602 , H05K3/4644 , H05K2201/09036 , H05K2201/09918 , H05K2201/10636 , H05K2201/10674 , H05K2201/10727 , H05K2203/1469 , H05K2203/166 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/01028
摘要： A multilayer printed wiring board and method for manufacturing a multilayer printed wiring board. One method include a method for manufacturing a multilayer printed wiring board having an electronic component housed therein. The method includes forming a conduction circuit on a core substrate and forming an alignment mark on the core substrate separate from the conduction circuit. Also included is forming a concavity in the core substrate, the concavity being formed in an area of the core substrate not including the conductor circuit and alignment mark, and inserting the electronic component into the concavity in the core substrate by using the alignment mark on the core substrate to align the electronic component with the concavity.
摘要翻译：一种多层印刷线路板及其制造方法。一种方法包括制造其中容纳有电子部件的多层印刷线路板的方法。该方法包括在芯基板上形成导通电路，并在芯基板上形成与导通电路分离的对准标记。还包括在芯基板中形成凹部，凹部形成在不包括导体电路的芯基板的区域和对准标记中，并且通过使用在芯基板上的对准标记将电子部件插入芯基板的凹部芯基板以使电子部件与凹部对准。

47. 发明授权

US08161639B2 Method for fabricating an interlayer conducting structure of an embedded circuitry 有权
标题翻译：一种用于制造嵌入式电路的层间导电结构的方法
公开(公告)号：US08161639B2
公开(公告)日：2012-04-24
申请号：US12895824
申请日：2010-09-30
申请人： Chien-Wei Chang , Ting-Hao Lin , Yu-Te Lu
发明人： Chien-Wei Chang , Ting-Hao Lin , Yu-Te Lu
IPC分类号： H01K3/10
CPC分类号： H05K3/4679 , H05K1/0269 , H05K3/0035 , H05K3/421 , H05K3/4658 , H05K2201/09918 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , Y10T29/49155 , Y10T29/49165
摘要： A method for fabricating an interlayer conducting structure of an embedded circuitry is disclosed. In accordance with the method for fabricating an interlayer conducting structure of an embedded circuitry of the present invention, there is no laser conformal mask formed prior to laminating the first and second lamination plates. Instead, after the first and second lamination plates are laminated, a laser boring process is directly conducted to form a via hole. In such a way, even when there is an offset between the first and the second lamination plates in alignment, the risk of short circuit between different layers of lamination plates can be lowered without improving an interlayer offset value.
摘要翻译：公开了一种用于制造嵌入式电路的层间导电结构的方法。根据本发明的嵌入式电路的层间导电结构的制造方法，在层叠第一和第二层压板之前不形成激光共形掩模。相反，在第一和第二层压板层压之后，直接进行激光钻孔工艺以形成通孔。以这种方式，即使在第一和第二层压板之间存在偏移对准的情况下，也可以在不改善层间偏移值的情况下降低层压板的不同层之间短路的风险。

48. 发明授权

US08079142B2 Printed circuit board manufacturing method 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US08079142B2
公开(公告)日：2011-12-20
申请号：US12273939
申请日：2008-11-19
申请人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
发明人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
IPC分类号： H01K3/10 , H05K1/16 , H05K7/10
CPC分类号： H01L24/29 , H01L21/4846 , H01L21/4857 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/03 , H01L25/18 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2223/54486 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/16227 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/83192 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/18162 , H01L2924/30107 , H05K1/185 , H05K3/4602 , H05K2201/09036 , H05K2201/09563 , H05K2201/096 , H05K2201/09918 , H05K2201/10674 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2224/82 , H01L2924/3512 , H01L2924/00
摘要： A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer insulating layer over the core substrate and the electronic component, forming a via hole opening connecting to the die pad of the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate, and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the die pad.
摘要翻译：一种制造印刷电路板的方法，包括提供芯基板和包含在芯基板中的电子部件，具有芯片焊盘的电子部件，在芯基板上形成定位标记，在芯基板上形成层间绝缘层和所述电子部件，根据所述芯基板上的定位标记，通过所述层间绝缘层形成连接到所述电子部件的所述管芯焊盘的通孔开口，以及在所述层间绝缘体的通孔开口部形成通孔结构使得通孔结构电连接到管芯焊盘。

49. 发明申请

US20110289773A1 METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT 有权
标题翻译：使用内置电子元件制造印刷电路板的方法
公开(公告)号：US20110289773A1
公开(公告)日：2011-12-01
申请号：US13209052
申请日：2011-08-12
申请人： Hironori Tanaka , Kazuhiro Yoshikawa , Naoaki Fujii , Atsunari Yamashita
发明人： Hironori Tanaka , Kazuhiro Yoshikawa , Naoaki Fujii , Atsunari Yamashita
IPC分类号： H05K3/30
CPC分类号： H05K1/185 , H01L24/19 , H01L24/82 , H01L2223/54426 , H01L2224/04105 , H01L2224/32225 , H01L2224/82039 , H01L2224/82047 , H01L2224/83132 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3511 , H05K1/036 , H05K1/188 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K3/4611 , H05K2201/0352 , H05K2201/09509 , H05K2201/09536 , H05K2201/0969 , H05K2201/09918 , H05K2201/10636 , Y02P70/611 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49165
摘要： A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.
摘要翻译：通过提供具有第一绝缘层，第二绝缘层和导电膜的基底基板的方法制造印刷线路板。在基于对准标记确定的位置处将电子部件放置在第一绝缘层上。在将电子部件封闭在第二绝缘层的开口内之后，在基于对准标记确定的位置处形成暴露电子部件的端子的通孔，该位置用于确定电子部件的位置。通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

50. 发明申请

US20110262868A1 METHOD OF DETECTING ALIGNMENT MARK AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD 有权
标题翻译：检测对准标记的方法和制造印刷电路板的方法
公开(公告)号：US20110262868A1
公开(公告)日：2011-10-27
申请号：US13085251
申请日：2011-04-12
申请人： Kousuke MURAKAMI , Akira ARIMA , Tomohiro HATTORI , Shuuhei MIYAZAKI
发明人： Kousuke MURAKAMI , Akira ARIMA , Tomohiro HATTORI , Shuuhei MIYAZAKI
IPC分类号： G03F7/20 , G06K9/00
CPC分类号： H05K1/0269 , G03F9/00 , H05K3/0097 , H05K2201/09918 , H05K2203/166
摘要： When an alignment mark does not exist within an area of an image obtained by a camera, the coordinate of the alignment mark is calculated based on an identification mark existing in the area of the image and a previously stored positional relationship between the alignment mark and the identification mark. A distance by which a long-sized base material is to be moved for causing the alignment mark to be positioned within the imaging area of the camera is calculated based on the calculated coordinate of the alignment mark, and the long-sized base material is moved by the calculated distance.
摘要翻译：当通过照相机获得的图像的区域内不存在对准标记时，基于存在于图像的区域中的识别标记和对准标记与对准标记之间的先前存储的位置关系来计算对准标记的坐标识别标志。基于所计算的对准标记的坐标，计算要使移动用于使对准标记位于摄像机的摄像区域内的长度的基材的距离，并且移动长尺寸的基材按计算距离。

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