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41. 发明授权

US08024005B2 Mobile communication terminal which displays screen location information and method of controlling the mobile communication terminal 有权
标题翻译：显示屏幕位置信息的移动通信终端和控制移动通信终端的方法
公开(公告)号：US08024005B2
公开(公告)日：2011-09-20
申请号：US11874504
申请日：2007-10-18
申请人： Jae Do Kwak , Hee Soo Kim
发明人： Jae Do Kwak , Hee Soo Kim
IPC分类号： H04M1/00 , H04B1/38
CPC分类号： H04M1/72561 , G06F3/0485 , H04M1/72544 , H04M2250/16 , Y02D70/164 , Y02D70/26
摘要： A mobile communication terminal which displays screen location information and a method of controlling the mobile communication terminal are provided. When a portion of a display object is displayed on a display screen of a display module, the mobile communication terminal displays screen location information regarding the relative location of the display object portion to the entire display object. Thus, a user can easily determine which part of the display object is currently being displayed. In addition, it is possible to prevent unnecessary power consumption caused by performing screen loading while continuously moving the display object portion.
摘要翻译：提供了显示屏幕位置信息的移动通信终端和控制移动通信终端的方法。当显示对象的一部分被显示在显示模块的显示屏幕上时，移动通信终端显示关于显示对象部分相对于整个显示对象的相对位置的屏幕位置信息。因此，用户可以容易地确定显示对象的哪个部分当前正在显示。此外，可以在连续移动显示对象部分的同时防止由于执行画面加载而引起的不必要的电力消耗。

42. 发明申请

US20100247010A1 AIRFOIL-MAGNETIC HYBRID BEARING AND A CONTROL SYSTEM THEREOF 有权
标题翻译：气动磁悬浮轴承及其控制系统
公开(公告)号：US20100247010A1
公开(公告)日：2010-09-30
申请号：US12739590
申请日：2007-11-19
申请人： Yong Bok Lee , Chang Ho Kim , Seung Jong Kim , Sang Hwa Lee , Hee Soo Kim
发明人： Yong Bok Lee , Chang Ho Kim , Seung Jong Kim , Sang Hwa Lee , Hee Soo Kim
IPC分类号： F16C32/06 , H02K7/09
CPC分类号： F16C32/0444 , F16C17/024 , F16C32/0402 , F16C32/048
摘要： The present invention relates to an airfoil-magnetic hybrid bearing, which is a combination of a magnetic bearing and airfoil bearing. An airfoil-magnetic hybrid bearing of the present invention comprises: a housing around a rotating shaft of a rotation device; an airfoil bearing positioned between the housing and the rotating shaft for forming dynamic pressure to levitate the rotating shaft during rotation of the rotating shaft; a magnetic bearing including a plurality of cores positioned radially between inner surface of the housing and outer surface of the airfoil bearing, the cores being projected to the center of the rotating shaft, and coils wound to the cores to levitate the rotating shaft using a magnetic attractive force generated by a current application thereto; and a coupling segment for coupling the airfoil bearing to the magnetic bearing directly.
摘要翻译：本发明涉及一种磁性轴承和翼型轴承的组合的翼型 - 磁性混合轴承。本发明的翼型磁性混合轴承包括：围绕旋转装置的旋转轴的壳体; 位于所述壳体和所述旋转轴之间的翼型轴承，用于在所述旋转轴的旋转期间形成动态压力以悬浮所述旋转轴; 一种磁性轴承，包括径向位于壳体的内表面和翼型件的外表面之间的多个芯体，芯体突出到旋转轴的中心，线圈缠绕到芯体上以使用磁性悬浮在旋转轴上由当前应用产生的吸引力; 以及用于将翼型轴承直接连接到磁性轴承的联接段。

43. 发明授权

US07674696B2 Method of fabricating semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US07674696B2
公开(公告)日：2010-03-09
申请号：US11962416
申请日：2007-12-21
申请人： Dong Ho Lee , Kwon Hong , Jae Mun Kim , Hee Soo Kim , Jae Hyoung Koo
发明人： Dong Ho Lee , Kwon Hong , Jae Mun Kim , Hee Soo Kim , Jae Hyoung Koo
IPC分类号： H01L21/425
CPC分类号： H01L21/28061 , H01L21/265 , H01L21/324
摘要： In one embodiment, a gate insulating layer, a conductive layer, and a metal layer are formed over a semiconductor substrate. An ion implantation region is formed in an interface of the conductive layer and the metal layer by performing an ion implantation process. A flash annealing process is performed on the ion-implanted semiconductor substrate. The metal layer, the conductive layer, and the gate insulating layer are patterned.
摘要翻译：在一个实施例中，在半导体衬底上形成栅绝缘层，导电层和金属层。通过进行离子注入工艺，在导电层和金属层的界面上形成离子注入区。在离子注入的半导体衬底上进行闪光退火处理。图案化金属层，导电层和栅极绝缘层。

44. 发明授权

US06629812B1 Method and apparatus for circulating pallets in an elevator unit of the module IC handler 失效
标题翻译：在模块IC处理机的电梯单元中循环托盘的方法和装置
公开(公告)号：US06629812B1
公开(公告)日：2003-10-07
申请号：US09455467
申请日：1999-12-06
申请人： Sang Soo Lee , Wan Gu Le , Jong Won Kim , Hee Soo Kim , Young Hak Oh , Dong Chun Lee
发明人： Sang Soo Lee , Wan Gu Le , Jong Won Kim , Hee Soo Kim , Young Hak Oh , Dong Chun Lee
IPC分类号： B65G6000
CPC分类号： B65G65/00 , G01R31/2808 , H01L21/67778
摘要： A module IC handler used for testing module Ics is disclosed in which the handler enables loading and unloading operations for module ICs, without further elevating pallet over an installation plate, and provides sequential transferring operations for the pallet on which test or customer tray is placed. To this end, after all module Ics 1 are loaded from the test tray 6 exposed to the loading or unloading position 19 or 26 by the loading and unloading elevator units 18a, 18b, or the test-finished module Ics are filled in the customer tray 17, the pallet 5 is moved to a rotation position 30 by a transfer 31, and then can be circulated to an upper side of the loading or unloading elevation plate 36 by the downer 32.
摘要翻译：公开了用于测试模块Ic的模块IC处理器，其中处理器能够对模块IC进行加载和卸载操作，而不需要在安装板上进一步提升托盘，并为放置测试或客户托盘的托盘提供顺序传送操作。为此，在所有模块Ics 1从装载和卸载电梯单元18a，18b暴露于装载或卸载位置19或26的测试托盘6装载之后，或者测试完成的模块Ics填充在顾客托盘如图17所示，托板5通过转移件31移动到旋转位置30，然后可以通过下降器32循环到装载或卸载升降板36的上侧。

45. 发明授权

US06498472B1 Method for handling a module IC and a carrier of a module IC handler 失效
标题翻译：用于处理模块IC和模块IC处理程序的载体的方法
公开(公告)号：US06498472B1
公开(公告)日：2002-12-24
申请号：US09449636
申请日：1999-11-30
申请人： Sang Soo Lee , Wan Gu Lee , Jong Won Kim , Hee Soo Kim , Young Hak Oh , Dong Chun Lee
发明人： Sang Soo Lee , Wan Gu Lee , Jong Won Kim , Hee Soo Kim , Young Hak Oh , Dong Chun Lee
IPC分类号： G01R3102
CPC分类号： H01L21/67271 , G01R31/2887
摘要： There is disclosed a method for handling a module IC and a carrier of a module IC handler used for transferring the carrier containing a plurality of module ICs between the processes. While a separate carrier containing the produced module ICs is transferred between the processes, the tests for the module ICs are performed. Thus, the reliability of the product discharged can be further improved, and the operation rate of a high-cost test apparatus is maximized. For this, a plurality of module ICs 1 vertically loaded in the carrier are transferred inside a heating chamber 22, the tests for the module ICs 1 are conducted at a test site 7 under the state that the module ICs 1 are contained in the carrier 18, and then at an unloading position 20, the module ICs having been tested are held by pick-up means 8 in an unloading side and classified based upon the test results and the classified module ICs are placed in customer trays 9.
摘要翻译：公开了一种用于处理模块IC的模块IC的处理器的方法和用于在所述处理之间传送包含多个模块IC的载体的模块IC处理器的载体。虽然在这些过程之间传送包含所产生的模块IC的单独的载体，但是对模块IC进行测试。因此，可以进一步提高放电产品的可靠性，并且使成本高的测试装置的操作率最大化。为此，垂直装载在载体上的多个模块IC1被传送到加热室22内，模块IC1的测试在模块IC1被包含在载体18中的状态下在测试地点7进行，然后在卸载位置20，已经被测试的模块IC由卸载侧的拾取装置8保持，并且基于测试结果进行分类，并且将分类的模块IC放置在客户托盘9中。

46. 发明授权

US06471462B1 Carrier handling apparatus of an IC module handler 失效
标题翻译： IC模块处理器的载体处理装置
公开(公告)号：US06471462B1
公开(公告)日：2002-10-29
申请号：US09449573
申请日：1999-11-29
申请人： Sang Soo Lee , Wan Gu Lee , Jong Won Kim , Hee Soo Kim , Young Hak Oh , Dong Chun Lee
发明人： Sang Soo Lee , Wan Gu Lee , Jong Won Kim , Hee Soo Kim , Young Hak Oh , Dong Chun Lee
IPC分类号： G01R3126
CPC分类号： H01L21/68 , G01R31/2808 , H01L21/67766
摘要： A carrier handling apparatus of an IC module handler includes a carrier transferring unit for holding one side of the carrier to transfer the same between the various processes, and a carrier positioning unit for precisely positioning the carrier. The carrier handling apparatus includes a carrier for transferring predetermined modules, a carrier transferring unit for transferring the carrier from a loading location to an unloading location, and a carrier positioning unit for precisely positioning the carrier in the loading and unloading locations, thereby allowing IC modules contained in a tray to be accurately loaded into the carrier or unloaded therefrom by a pick-up means. According to another aspect of the present invention, a slider is installed to be moved along the traveling path of the carrier, and is provided with a pair of fingers that can be withdrawn or spread by one cylinder, so that the area required to install the carrier transferring apparatus can be minimized. Further, since the carrier is accurately positioned before the pick-up means loads and unloads the IC modules in the loading and unloading locations, any troubles which may be caused due to position inaccuracies during the loading and unloading of the IC modules can be prevented in advance, thereby maximizing the operation rate of the apparatus.
摘要翻译： IC模块处理器的载体处理装置包括载体传送单元，用于保持载体的一侧在各种处理之间传送载体;以及载体定位单元，用于精确地定位载体。载体处理装置包括用于传送预定模块的载体，用于将载体从装载位置转移到卸载位置的载体传送单元和用于将载体精确地定位在装载和卸载位置的载体定位单元，由此允许IC模块容纳在托盘中以被精确地装载到托架中或通过拾取装置从其中卸载。根据本发明的另一方面，滑块被安装成沿着承载件的移动路径移动，并且设置有可以由一个气缸抽出或扩展的一对手指，使得安装载体传送装置可以最小化。此外，由于在拾取装置在装载和卸载位置装载和卸载IC模块之前载体被准确定位，所以可以防止由于在IC模块的装载和卸载期间的位置不准确而引起的任何故障从而使设备的操作速度最大化。

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