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41. 发明申请

US20060105556A1 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060105556A1
公开(公告)日：2006-05-18
申请号：US11272811
申请日：2005-11-15
申请人： Yuichi Matsui , Motoyasu Terao , Norikatsu Takaura , Takahiro Morikawa , Naoki Yamamoto
发明人： Yuichi Matsui , Motoyasu Terao , Norikatsu Takaura , Takahiro Morikawa , Naoki Yamamoto
IPC分类号： H01L21/20
CPC分类号： C23C14/5806 , C23C14/0623 , C23C14/541 , H01L27/2436 , H01L27/2463 , H01L45/06 , H01L45/144 , H01L45/1625 , H01L45/1641
摘要： The annealing process at 400° C. or more required for the wiring process for a phase change memory has posed the problem in that the crystal grains in a chalcogenide material grow in an oblique direction to cause voids in a storage layer. The voids, in turn, cause peeling due to a decrease in adhesion, variations in resistance due to improper contact with a plug, and other undesirable events. After the chalcogenide material has been formed in an amorphous phase, post-annealing is conducted to form a (111)-oriented and columnarly structured face-centered cubic. This is further followed by high-temperature annealing to form a columnar, hexagonal closest-packed crystal. Use of this procedure makes it possible to suppress the growth of inclined crystal grains that causes voids, since crystal grains are formed in a direction perpendicular to the surface of an associated substrate.
摘要翻译：在相变存储器的布线处理所需的400℃以上所需的退火处理的问题在于，硫属化物材料中的晶粒沿倾斜方向生长，从而在储存层中产生空隙。这些空隙又由于粘合力的降低而导致剥离，由于与插头的不正确接触导致的电阻变化以及其它不期望的事件。在非晶态形成硫族化物材料之后，进行后退火以形成（111）取向和柱状结构的面心立方。此后进一步进行高温退火以形成柱状，六边形最接近填充的晶体。使用该方法可以抑制由于在垂直于相关衬底的表面的方向上形成晶粒而导致空隙的倾斜晶粒的生长。

42. 发明授权

US08427865B2 Semiconductor storage device 有权
标题翻译：半导体存储设备
公开(公告)号：US08427865B2
公开(公告)日：2013-04-23
申请号：US13440225
申请日：2012-04-05
申请人： Akio Shima , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
发明人： Akio Shima , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
IPC分类号： G11C11/00 , H01L29/80
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/003 , G11C2213/71 , G11C2213/75 , G11C2213/79 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1683
摘要： There is provided a semiconductor storage device which is capable of further reducing a size of a memory cell, and increasing a storage capacity. Plural memory cells each including a transistor formed on a semiconductor substrate, and a variable resistive device having a resistance value changed by voltage supply and connected between source and drain terminals of the transistor are arranged longitudinally and in an array to configure a three-dimensional memory cell array. A memory cell structure has a double channel structure in which an inside of a switching transistor is filled with a variable resistance element, particularly, a phase change material. The switching transistor is turned off by application of a voltage to increase a channel resistance so that a current flows in the internal phase change material to operate the memory.
摘要翻译：提供了能够进一步减小存储单元的尺寸并增加存储容量的半导体存储装置。每个包括形成在半导体衬底上的晶体管的多个存储单元以及具有由电压供应改变并连接在晶体管的源极和漏极端子之间的电阻值的可变电阻器件被纵向排列成阵列以构成三维存储器单元格阵列。存储单元结构具有双通道结构，其中开关晶体管的内部填充有可变电阻元件，特别是相变材料。通过施加电压来切换开关晶体管，以增加沟道电阻，使得电流在内部相变材料中流动以操作存储器。

43. 发明授权

US08604456B2 Nonvolatile memory device and method of manufacturing the same 有权
标题翻译：非易失性存储器件及其制造方法
公开(公告)号：US08604456B2
公开(公告)日：2013-12-10
申请号：US13366544
申请日：2012-02-06
申请人： Masaharu Kinoshita , Yoshitaka Sasago , Norikatsu Takaura
发明人： Masaharu Kinoshita , Yoshitaka Sasago , Norikatsu Takaura
IPC分类号： H01L45/00
CPC分类号： H01L45/144 , G11C11/5678 , G11C13/0004 , G11C2213/72 , H01L27/2409 , H01L27/2481 , H01L45/06 , H01L45/1233 , H01L45/1293 , H01L45/1675 , Y10S438/90
摘要： Provided is a nonvolatile memory device including a phase-change memory configured with cross-point memory cells in which memory elements formed of a phase-change material and selection elements formed with a diode are combined. A memory cell is configured with a memory element formed of a phase-change material and a selection element formed with a diode having a stacked structure of a first polycrystalline silicon film, a second polycrystalline silicon film, and a third polycrystalline silicon film. The memory cells are arranged at intersection points of a plurality of first metal wirings extending along a first direction with a plurality of third metal wirings extending along a second direction orthogonal to the first direction. An interlayer film is formed between adjacent selection elements and between adjacent memory elements, and voids are formed in the interlayer film provided between the adjacent memory elements.
摘要翻译：本发明提供一种非易失性存储装置，其包括：配置有交叉点存储单元的相变存储器，其中由相变材料形成的存储元件和由二极管形成的选择元件组合。存储单元配置有由相变材料形成的存储元件和由具有第一多晶硅膜，第二多晶硅膜和第三多晶硅膜的堆叠结构的二极管形成的选择元件。存储单元布置在沿着第一方向延伸的多个第一金属布线的交点和沿着与第一方向正交的第二方向延伸的多个第三金属布线。在相邻的选择元件之间和相邻的存储元件之间形成中间膜，并且在设置在相邻的存储元件之间的层间膜中形成空隙。

44. 发明申请

US20120211718A1 SEMICONDUCTOR STORAGE DEVICE 有权
标题翻译：半导体存储设备
公开(公告)号：US20120211718A1
公开(公告)日：2012-08-23
申请号：US13440225
申请日：2012-04-05
申请人： AKIO SHIMA , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
发明人： AKIO SHIMA , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
IPC分类号： H01L45/00
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/003 , G11C2213/71 , G11C2213/75 , G11C2213/79 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1683
摘要： There is provided a semiconductor storage device which is capable of further reducing a size of a memory cell, and increasing a storage capacity. Plural memory cells each including a transistor formed on a semiconductor substrate, and a variable resistive device having a resistance value changed by voltage supply and connected between source and drain terminals of the transistor are arranged longitudinally and in an array to configure a three-dimensional memory cell array. A memory cell structure has a double channel structure in which an inside of a switching transistor is filled with a variable resistance element, particularly, a phase change material. The switching transistor is turned off by application of a voltage to increase a channel resistance so that a current flows in the internal phase change material to operate the memory.
摘要翻译：提供了能够进一步减小存储单元的尺寸并增加存储容量的半导体存储装置。每个包括形成在半导体衬底上的晶体管的多个存储单元以及具有由电压供应改变并连接在晶体管的源极和漏极端子之间的电阻值的可变电阻器件被纵向排列成阵列以配置三维存储器单元格阵列。存储单元结构具有双通道结构，其中开关晶体管的内部填充有可变电阻元件，特别是相变材料。通过施加电压来切换开关晶体管，以增加沟道电阻，使得电流在内部相变材料中流动以操作存储器。

45. 发明授权

US08169819B2 Semiconductor storage device 有权
标题翻译：半导体存储设备
公开(公告)号：US08169819B2
公开(公告)日：2012-05-01
申请号：US12688886
申请日：2010-01-17
申请人： Akio Shima , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
发明人： Akio Shima , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
IPC分类号： G11C11/00 , H01L29/80
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/003 , G11C2213/71 , G11C2213/75 , G11C2213/79 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1683
摘要： There is provided a semiconductor storage device which is capable of further reducing a size of a memory cell, and increasing a storage capacity. Plural memory cells each including a transistor formed on a semiconductor substrate, and a variable resistive device having a resistance value changed by voltage supply and connected between source and drain terminals of the transistor are arranged longitudinally and in an array to configure a three-dimensional memory cell array. A memory cell structure has a double channel structure in which an inside of a switching transistor is filled with a variable resistance element, particularly, a phase change material. The switching transistor is turned off by application of a voltage to increase a channel resistance so that a current flows in the internal phase change material to operate the memory.
摘要翻译：提供了能够进一步减小存储单元的尺寸并增加存储容量的半导体存储装置。每个包括形成在半导体衬底上的晶体管的多个存储单元以及具有由电压供应改变并连接在晶体管的源极和漏极端子之间的电阻值的可变电阻器件被纵向排列成阵列以配置三维存储器单元格阵列。存储单元结构具有双通道结构，其中开关晶体管的内部填充有可变电阻元件，特别是相变材料。通过施加电压来切换开关晶体管，以增加沟道电阻，使得电流在内部相变材料中流动以操作存储器。

46. 发明申请

US20100032637A1 NONVOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：非易失性存储器件及其制造方法
公开(公告)号：US20100032637A1
公开(公告)日：2010-02-11
申请号：US12434633
申请日：2009-05-02
申请人： Masaharu Kinoshita , Yoshitaka Sasago , Norikatsu Takaura
发明人： Masaharu Kinoshita , Yoshitaka Sasago , Norikatsu Takaura
IPC分类号： H01L45/00
CPC分类号： H01L45/144 , G11C11/5678 , G11C13/0004 , G11C2213/72 , H01L27/2409 , H01L27/2481 , H01L45/06 , H01L45/1233 , H01L45/1293 , H01L45/1675 , Y10S438/90
摘要： Provided is a nonvolatile memory device including a phase-change memory configured with cross-point memory cells in which memory elements formed of a phase-change material and selection elements formed with a diode are combined. A memory cell is configured with a memory element formed of a phase-change material and a selection element formed with a diode having a stacked structure of a first polycrystalline silicon film, a second polycrystalline silicon film, and a third polycrystalline silicon film. The memory cells are arranged at intersection points of a plurality of first metal wirings extending along a first direction with a plurality of third metal wirings extending along a second direction orthogonal to the first direction. An interlayer film is formed between adjacent selection elements and between adjacent memory elements, and voids are formed in the interlayer film provided between the adjacent memory elements.
摘要翻译：本发明提供一种非易失性存储装置，其包括：配置有交叉点存储单元的相变存储器，其中由相变材料形成的存储元件和由二极管形成的选择元件组合。存储单元配置有由相变材料形成的存储元件和由具有第一多晶硅膜，第二多晶硅膜和第三多晶硅膜的堆叠结构的二极管形成的选择元件。存储单元布置在沿着第一方向延伸的多个第一金属布线的交点和沿着与第一方向正交的第二方向延伸的多个第三金属布线。在相邻的选择元件之间和相邻的存储元件之间形成中间膜，并且在设置在相邻的存储元件之间的层间膜中形成空隙。

47. 发明申请

US20100061132A1 SEMICONDUCTOR STORAGE DEVICE 失效
标题翻译：半导体存储设备
公开(公告)号：US20100061132A1
公开(公告)日：2010-03-11
申请号：US12516690
申请日：2006-12-07
申请人： Yoshihisa Fujisaki , Satoru Hanzawa , Kenzo Kurotsuchi , Nozomu Matsuzaki , Norikatsu Takaura
发明人： Yoshihisa Fujisaki , Satoru Hanzawa , Kenzo Kurotsuchi , Nozomu Matsuzaki , Norikatsu Takaura
IPC分类号： G11C11/00 , H01L45/00 , G11C5/02 , G11C7/00
CPC分类号： H01L45/144 , G11C13/0004 , G11C13/0069 , G11C2213/75 , H01L27/2436 , H01L27/2463 , H01L27/2472 , H01L45/06 , H01L45/1233
摘要： In a semiconductor storage device such as a phase change memory, a technique which can realize high integration is provided. The semiconductor storage device includes a phase change thin film 101 having two stable phases of a crystal state with low electric resistance and an amorphous state with high electric resistance, upper plug electrodes 102 and 103 provided on one side of the phase change thin film 101, a lower electrode 104 provided on the other side of the phase change thin film 101, a selecting transistor 114 whose drain/source terminals are connected to the upper plug electrode 102 and the lower electrode 104, and a selecting transistor 115 whose drain/source terminals are connected to the upper plug electrode 103 and the lower electrode 104, and a first memory cell is configured with the selecting transistor 114 and a phase change region 111 in the phase change thin film 101 sandwiched between the upper plug electrode 102 and the lower electrode 104, and a second memory cell is configured with the selecting transistor 115 and a phase change region 112 in the phase change thin film 101 sandwiched between the upper plug electrode 103 and the lower electrode 104.
摘要翻译：在诸如相变存储器的半导体存储装置中，提供了可以实现高集成度的技术。半导体存储装置包括：具有低电阻的晶体状态的两个稳定相和具有高电阻的非晶态的相变薄膜101，设置在相变薄膜101一侧的上部插塞电极102和103，设置在相变薄膜101的另一侧的下部电极104，漏极/源极端子连接到上部插塞电极102和下部电极104的选择晶体管114，以及选择晶体管115，其漏极/源极端子连接到上插头电极103和下电极104，并且第一存储单元配置有夹在上插头电极102和下电极之间的相变薄膜101中的选择晶体管114和相变区域111 104，并且第二存储单元配置有夹在b中的相变薄膜101中的选择晶体管115和相变区域112 在上塞电极103和下电极104之间。

48. 发明申请

US20090052231A1 SEMICONDUCTOR DEVICE 失效
标题翻译：半导体器件
公开(公告)号：US20090052231A1
公开(公告)日：2009-02-26
申请号：US12162702
申请日：2006-02-02
申请人： Kenzo Kurotsuchi , Norikatsu Takaura , Yoshihisa Fujisaki
发明人： Kenzo Kurotsuchi , Norikatsu Takaura , Yoshihisa Fujisaki
IPC分类号： G11C11/00 , G11C7/00
CPC分类号： G11C13/0069 , G11C13/0004 , G11C2013/0073 , G11C2013/0078 , G11C2213/79 , H01L27/24
摘要： A semiconductor device capable of high-speed read and has a high data-retention characteristic is provided. In a semiconductor device including a memory array having a plurality of memory cells provided at intersecting points of a plurality of word lines and a plurality of bit lines, where each memory cell includes an information memory section and a select element, when information is programmed by a first pulse (reset operation) for programming information flowing in the bit line and a second pulse (set operation) different from the first pulse and information is read by a third pulse (read operation), current directions of the second pulse and the third pulse are opposite to each other.
摘要翻译：提供了一种能够高速读取并具有高数据保持特性的半导体器件。在包括具有设置在多个字线和多个位线的交叉点处的多个存储单元的存储器阵列的半导体器件中，其中每个存储单元包括信息存储器部分和选择元件，当信息由用于编程在位线中流动的信息的第一脉冲（复位操作）和与第一脉冲和信息不同的第二脉冲（置位操作）被第三脉冲（读操作）读取，第二脉冲和第三脉冲脉冲彼此相反。

49. 发明申请

US20120132879A1 NONVOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：非易失性存储器件及其制造方法
公开(公告)号：US20120132879A1
公开(公告)日：2012-05-31
申请号：US13366544
申请日：2012-02-06
申请人： MASAHARU KINOSHITA , Yoshitaka Sasago , Norikatsu Takaura
发明人： MASAHARU KINOSHITA , Yoshitaka Sasago , Norikatsu Takaura
IPC分类号： H01L45/00
CPC分类号： H01L45/144 , G11C11/5678 , G11C13/0004 , G11C2213/72 , H01L27/2409 , H01L27/2481 , H01L45/06 , H01L45/1233 , H01L45/1293 , H01L45/1675 , Y10S438/90
摘要： Provided is a nonvolatile memory device including a phase-change memory configured with cross-point memory cells in which memory elements formed of a phase-change material and selection elements formed with a diode are combined. A memory cell is configured with a memory element formed of a phase-change material and a selection element formed with a diode having a stacked structure of a first polycrystalline silicon film, a second polycrystalline silicon film, and a third polycrystalline silicon film. The memory cells are arranged at intersection points of a plurality of first metal wirings extending along a first direction with a plurality of third metal wirings extending along a second direction orthogonal to the first direction. An interlayer film is formed between adjacent selection elements and between adjacent memory elements, and voids are formed in the interlayer film provided between the adjacent memory elements.
摘要翻译：本发明提供一种非易失性存储装置，其包括：配置有交叉点存储单元的相变存储器，其中由相变材料形成的存储元件和由二极管形成的选择元件组合。存储单元配置有由相变材料形成的存储元件和由具有第一多晶硅膜，第二多晶硅膜和第三多晶硅膜的堆叠结构的二极管形成的选择元件。存储单元布置在沿着第一方向延伸的多个第一金属布线的交点和沿着与第一方向正交的第二方向延伸的多个第三金属布线。在相邻的选择元件之间和相邻的存储元件之间形成中间膜，并且在设置在相邻的存储元件之间的层间膜中形成空隙。

50. 发明授权

US08129705B2 Nonvolatile memory device and method of manufacturing the same 有权
标题翻译：非易失性存储器件及其制造方法
公开(公告)号：US08129705B2
公开(公告)日：2012-03-06
申请号：US12434633
申请日：2009-05-02
申请人： Masaharu Kinoshita , Yoshitaka Sasago , Norikatsu Takaura
发明人： Masaharu Kinoshita , Yoshitaka Sasago , Norikatsu Takaura
IPC分类号： H01L45/00
CPC分类号： H01L45/144 , G11C11/5678 , G11C13/0004 , G11C2213/72 , H01L27/2409 , H01L27/2481 , H01L45/06 , H01L45/1233 , H01L45/1293 , H01L45/1675 , Y10S438/90
摘要： Provided is a nonvolatile memory device including a phase-change memory configured with cross-point memory cells in which memory elements formed of a phase-change material and selection elements formed with a diode are combined. A memory cell is configured with a memory element formed of a phase-change material and a selection element formed with a diode having a stacked structure of a first polycrystalline silicon film, a second polycrystalline silicon film, and a third polycrystalline silicon film. The memory cells are arranged at intersection points of a plurality of first metal wirings extending along a first direction with a plurality of third metal wirings extending along a second direction orthogonal to the first direction. An interlayer film is formed between adjacent selection elements and between adjacent memory elements, and voids are formed in the interlayer film provided between the adjacent memory elements.
摘要翻译：本发明提供一种非易失性存储装置，其包括：配置有交叉点存储单元的相变存储器，其中由相变材料形成的存储元件和由二极管形成的选择元件组合。存储单元配置有由相变材料形成的存储元件和由具有第一多晶硅膜，第二多晶硅膜和第三多晶硅膜的堆叠结构的二极管形成的选择元件。存储单元布置在沿着第一方向延伸的多个第一金属布线的交点和沿着与第一方向正交的第二方向延伸的多个第三金属布线。在相邻的选择元件之间和相邻的存储元件之间形成中间膜，并且在设置在相邻的存储元件之间的层间膜中形成空隙。

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