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41. 发明授权

US06674474B2 Method of controlling transmission light amount and television camera apparatus using the method 失效
标题翻译：使用该方法控制透射光量的方法和电视摄像装置
公开(公告)号：US06674474B2
公开(公告)日：2004-01-06
申请号：US09982165
申请日：2001-10-19
申请人： Yasuhiko Hatae , Akimi Tsukui , Yoshifumi Nakamura
发明人： Yasuhiko Hatae , Akimi Tsukui , Yoshifumi Nakamura
IPC分类号： H04N5238
CPC分类号： H04N5/235 , H04N5/238
摘要： In a television camera apparatus, while a high luminance level range is detected from a picture signal which is acquired by imaging a moving photographing object by using an image pick-up element or acquired by imaging a subject almost in a static state that enters into a visual field of the image pick-up element by remotely rotating or elevating the image pick-up element, such a range which becomes a high luminance level is predicted based upon a temporal change and the like of this detected range, and such a transmission light amount control is carried out in such a manner that a light amount of imaging light of the predicted range, which is received by a light receiving plane of the image pick-up element, is extincted.
摘要翻译：在电视摄像机装置中，在通过使用图像拾取元件对运动拍摄对象进行成像而获取的图像信号中检测到高亮度水平范围，或者通过对进入成为基于该检测范围的时间变化等预测成为高亮度等级的范围，通过远摄旋转或升高摄像元件的图像拾取元件的视场，并且这种传输光进行量控制，使得由摄像元件的受光面接收的预测范围的成像光的光量消失。

42. 发明授权

US06559528B2 Semiconductor device and method for the fabrication thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06559528B2
公开(公告)日：2003-05-06
申请号：US09785503
申请日：2001-02-20
申请人： Kazumi Watase , Hiroaki Fujimoto , Ryuichi Sahara , Nozomi Shimoishizaka , Takahiro Kumakawa , Kazuyuki Kaino , Yoshifumi Nakamura
发明人： Kazumi Watase , Hiroaki Fujimoto , Ryuichi Sahara , Nozomi Shimoishizaka , Takahiro Kumakawa , Kazuyuki Kaino , Yoshifumi Nakamura
IPC分类号： H01L23498
CPC分类号： H01L24/97 , H01L23/3114 , H01L23/3121 , H01L23/49872 , H01L24/45 , H01L24/48 , H01L24/94 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/05599 , H01L2224/05647 , H01L2224/12105 , H01L2224/16145 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73209 , H01L2224/85399 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06524 , H01L2225/06527 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a semiconductor device 10 comprising a first semiconductor element 11 with an arrangement of first element electrodes 12, a second semiconductor element 13 with an arrangement of second element electrodes 14, a connection member 15 electrically connecting together a portion 12b of the first element electrodes 12 and the second element electrodes 14, an insulation layer 17 covering a major surface 11a of the first semiconductor element 11 and a backside surface 13b of the second semiconductor element 13, a wiring layer 22 formed on the insulation layer 17 and electrically connected to the first element electrode portion 12b exposed in an opening portion 21, and an external electrode 23 formed, as a portion of the wiring layer 22, on the insulation layer 17.
摘要翻译：公开了一种半导体器件10，其包括具有第一元件电极12的布置的第一半导体元件11，具有第二元件电极14的布置的第二半导体元件13，将第一元件电极的部分12b电连接在一起的连接构件15 12和第二元件电极14，覆盖第一半导体元件11的主表面11a和第二半导体元件13的背面13b的绝缘层17，形成在绝缘层17上并电连接到第二半导体元件13的布线层22的布线层22。露出在开口部分21中的第一元件电极部分12b和作为布线层22的一部分形成在绝缘层17上的外部电极23。

43. 发明授权

US06300576B1 Printed-circuit board having projection electrodes and method for producing the same 失效
标题翻译：具有投影电极的印刷电路板及其制造方法
公开(公告)号：US06300576B1
公开(公告)日：2001-10-09
申请号：US09106302
申请日：1998-06-29
申请人： Yoshifumi Nakamura , Minehiro Itagaki , Hiroaki Takezawa , Yoshihiro Bessho , Tsukasa Shiraishi
发明人： Yoshifumi Nakamura , Minehiro Itagaki , Hiroaki Takezawa , Yoshihiro Bessho , Tsukasa Shiraishi
IPC分类号： H01R909
CPC分类号： H01L23/49811 , H01L21/4853 , H01L2924/0002 , H05K1/095 , H05K3/4007 , H05K3/4069 , H05K3/4614 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126 , Y10T29/49149 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24926 , H01L2924/00
摘要： A printed-circuit board, especially a multilayer printed-circuit board, with projection electrodes integrated with via hole conductors. Each of the projection electrodes is highly adhesive to a corresponding one of the via hole conductors and has high strength, and thus the production method of the printed-circuit board is simplified. Projection electrodes formed of a cured conducting paste are formed in such a manner that the electrodes are integrated with the via hole conductors which consist of a conducting paste embedded into the via hole formed in an insulating resin substrate to form a printed board. The method for producing a printed-circuit board, includes making via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via hole with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the film. Thus, projection electrodes with a height corresponding the thickness of the film are formed in a manner such that the projecting electrodes are integrated with the via hole conductors.
摘要翻译：印刷电路板，特别是多层印刷电路板，其具有与通孔导体集成的突出电极。每个突起电极与相应的一个通孔导体高度粘合，并且具有高强度，因此简化了印刷电路板的制造方法。由固化导电膏形成的投影电极以这样的方式形成，使得电极与通孔导体集成，通孔导体包括嵌入到形成在绝缘树脂基板中的通孔中的导电膏，以形成印刷板。制造印刷电路板的方法包括制造穿透预浸料的通孔，其中涂覆有分离膜的表面; 用导电膏填充通孔; 在加热下压制预浸料以固化预浸料和糊料; 然后剥离胶片。因此，以使得突出电极与通孔导体一体化的方式形成具有与膜的厚度对应的高度的突起电极。

44. 发明授权

US5940679A Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage 失效
标题翻译：检查半导体器件电路和导电胶的检查方法
公开(公告)号：US5940679A
公开(公告)日：1999-08-17
申请号：US577485
申请日：1995-12-22
申请人： Yoshihiro Tomura , Yoshihiro Bessho , Yoshifumi Nakamura
发明人： Yoshihiro Tomura , Yoshihiro Bessho , Yoshifumi Nakamura
IPC分类号： H01L21/60 , G01R1/073 , G01R31/26 , G01R31/28 , H01L21/66 , H01L23/12 , H01R4/04 , H05K3/34
CPC分类号： H01R4/04 , G01R1/07314 , G01R31/2886 , H01L22/20 , H01L2224/1134 , H01L2224/11822 , H01L2224/13099 , H01L2224/16225 , H01L2924/00013 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/15311
摘要： Conductive adhesive for checking electric circuits is formed on contact electrodes of a chip package or a multi-chip module. After contact electrodes of the chip package or the multi-chip module are set on terminal electrodes of a checking device in a correct position, the chip package or the multi-chip module is mounted on the checking device, so that the contact electrodes are electrically connected to the terminal electrodes with the conductive adhesive in-between, and thus the electric circuits of the chip package or the multi-chip module are checked.
摘要翻译：用于检查电路的导电粘合剂形成在芯片封装或多芯片模块的接触电极上。在芯片封装或多芯片模块的接触电极设置在正确位置的检查装置的端子电极上之后，芯片封装或多芯片模块安装在检查装置上，使得接触电极电连接到端子电极，导电粘合剂在其间，从而检查芯片封装或多芯片模块的电路。

45. 发明授权

US5407473A Conductive ink 失效
标题翻译：导电油墨
公开(公告)号：US5407473A
公开(公告)日：1995-04-18
申请号：US174807
申请日：1993-12-29
申请人： Kazuhiro Miura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Yoshifumi Nakamura , Akihiko Miyoshi
发明人： Kazuhiro Miura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Yoshifumi Nakamura , Akihiko Miyoshi
IPC分类号： H01B1/14 , H01L23/498 , H05K1/09 , C09D11/02
CPC分类号： H01B1/14 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/092
摘要： Conductive ink has an inorganic compound comprising 70.0-95.0 wt. % of CuO which is conductive and 5.0-30.0 wt. % of inorganic binder mixed with each other, and solvent and organic binder in which the inorganic compound is dispersed. The inorganic binder consists of lead borosilicate crystalline glass or aluminum borosilicate crystalline glass soften and crystallizes at 850.degree.-950.degree. C. The diameter of CuO powder of the inorganic compound is 100-7.0 .mu.m. The diameter of the lead borosilicate crystalline glass powder or the aluminum borosilicate crystalline glass powder of the inorganic compound is 1.0-5.0 .mu.m. The organic binder consists of ethyl cellulose or copolymer of polyisobytylmethacrylate and poly.alpha.-methylstyrene. The conductive ink contains the organic binder at 0.5-2.0 wt. %.
摘要翻译：导电油墨具有70.0-95.0重量％的无机化合物。导电的CuO％和5.0-30.0wt。相互混合的无机粘合剂的％，以及其中分散无机化合物的溶剂和有机粘合剂。无机粘合剂由硼硅酸铅晶体玻璃或硼硅酸铝晶体玻璃软化并在850-950℃下结晶。无机化合物的CuO粉末的直径为100-7.0μm。硼硅酸铅晶体玻璃粉末或无机化合物的硼硅酸铝结晶玻璃粉末的直径为1.0-5.0μm。有机粘合剂由乙基纤维素或聚甲基丙烯酸异丁酯和聚α-甲基苯乙烯的共聚物组成。导电油墨含有0.5-2.0重量％的有机粘合剂。％。

46. 发明授权

US09670856B2 Control apparatus for automatically restarting an internal combustion engine 有权
公开(公告)号：US09670856B2
公开(公告)日：2017-06-06
申请号：US14386702
申请日：2013-03-13
申请人： Akito Uchida , Hiroshi Enomoto , Yoshifumi Nakamura
发明人： Akito Uchida , Hiroshi Enomoto , Yoshifumi Nakamura
IPC分类号： F02D41/06 , F02D41/00 , F02N11/08 , F02D29/02 , F02D41/30
CPC分类号： F02D41/065 , F02D29/02 , F02D41/009 , F02D41/30 , F02D2041/0092 , F02D2700/07 , F02N11/0814 , F02N2200/021 , F02N2300/2002 , Y02T10/48
摘要： When a stop position of a piston resulting from the automatic stop is in a range that is on an advance side of a threshold in terms of crank angle, fuel injection is performed at beginning of the automatic restart-up in the cylinder that is in the intake stroke and an ignition is performed in a subsequent initial compression stroke in the same cylinder. When the stop position of the piston resulting is in a range that is on a retard side of the threshold in terms of crank angle, initial fuel injection is performed in the cylinder that next enters an intake stroke among the cylinders of the internal combustion engine after the beginning of automatic restart-up and initial ignition is performed in a subsequent compression stroke in the same cylinder. The threshold is determined in accordance with an amount of deviation of a crank angle.

47. 发明申请

US20140071509A1 SCANNING OPTICAL APPARATUS AND IMAGE FORMING APPARATUS 有权
标题翻译：扫描光学装置和图像形成装置
公开(公告)号：US20140071509A1
公开(公告)日：2014-03-13
申请号：US14014674
申请日：2013-08-30
申请人： Hitoshi Fujino , Hiroyuki Ominato , Yoshifumi Nakamura
发明人： Hitoshi Fujino , Hiroyuki Ominato , Yoshifumi Nakamura
IPC分类号： G02B26/12
CPC分类号： G02B26/125
摘要： In a scanning optical apparatus including a single lens configured to convert a beam deflected by a polygon mirror into a spot-like image on a to-be-scanned surface, the lens satisfies the conditions: −0.59
摘要翻译：在包括单个透镜的扫描光学装置中，所述单一透镜被配置为将由多面镜偏转的光束转换成被扫描表面上的斑点状图像，所述透镜满足以下条件：-0.59 <0≤0.46< β2@0.2，-0.6@D1 <0.43和-0.17 @ D2 @ 0.16其中β1表示在第一光轴和垂直于被扫描表面的参考线之间的主扫描平面中形成的角度[deg] β2表示在第一光轴和第二光轴之间的主扫描平面中形成的角度[deg]，D1表示主扫描平面中的第一光轴之间的交点和来自基准线的入射侧透镜表面，D2表示第二光轴和出射侧透镜表面之间的交点相对于主扫描平面中的偏移量[mm] 光轴。

48. 发明授权

US08520281B2 Scanning optical apparatus 有权
标题翻译：扫描光学仪器
公开(公告)号：US08520281B2
公开(公告)日：2013-08-27
申请号：US13072693
申请日：2011-03-26
申请人： Hitoshi Fujino , Yoshifumi Nakamura , Hiroyuki Ominato , Hiroki Yukawa
发明人： Hitoshi Fujino , Yoshifumi Nakamura , Hiroyuki Ominato , Hiroki Yukawa
IPC分类号： G02B26/08
CPC分类号： G02B27/0031 , B41J2/471 , G02B3/04 , G02B13/0005 , G02B26/125
摘要： In a scanning optical apparatus, a third optical element is configured such that a first optical axis defined as an optical axis of an incident-side lens surface of the third optical element is inclined in a main scanning plane with respect to a normal line extending from a scanning center on a target surface to be scanned and an intersection point between the first optical axis and the incident-side lens surface is shifted with respect to the normal line, and that a second optical axis defined as an optical axis of an emission-side lens surface is inclined in the main scanning plane with respect to the first optical axis and an intersection point between the second optical axis and the emission-side lens surface is shifted with respect to the first optical axis.
摘要翻译：在扫描光学装置中，第三光学元件被配置为使得被定义为第三光学元件的入射侧透镜表面的光轴的第一光轴相对于从第二光学元件延伸的法线在主扫描平面中倾斜要扫描的目标表面上的扫描中心和第一光轴与入射侧透镜表面之间的交点相对于法线移动，并且被定义为发射 - 侧面透镜表面相对于第一光轴在主扫描平面中倾斜，并且第二光轴和发射侧透镜表面之间的交点相对于第一光轴移动。

49. 发明授权

US07250575B2 Wiring board, semiconductor device and display module 失效
标题翻译：接线板，半导体器件和显示模块
公开(公告)号：US07250575B2
公开(公告)日：2007-07-31
申请号：US11441678
申请日：2006-05-26
申请人： Kouichi Nagao , Yoshifumi Nakamura , Hiroyuki Imamura , Michinari Tetani
发明人： Kouichi Nagao , Yoshifumi Nakamura , Hiroyuki Imamura , Michinari Tetani
IPC分类号： H05K3/46
CPC分类号： H05K1/028 , H01L2224/73204 , H05K1/111 , H05K1/189 , H05K3/025 , H05K3/243 , H05K3/28 , H05K3/382 , H05K3/4007 , H05K2201/0367 , H05K2201/10674 , Y02P70/611
摘要： A wiring board includes: a flexible insulating base 1; a plurality of conductive wirings 2 arranged on the flexible insulating base 1; protruding electrodes 3 provided respectively at an end portion of the same side of each of the conductive wirings; external terminals 4, 5 formed respectively at the other end portions of each of the conductive wirings; metal plating layers applied on the conductive wirings, the protruding electrodes and the external terminals; and solder resist layers 7 formed respectively by coating the conductive wirings in regions between the end portions at which the protruding electrodes are provided and the external terminals. In the regions where the solder resist layers are formed, no metal plating layers are formed on the conductive wirings, and the surfaces of the conductive wirings to be contacted with the flexible insulating base are rougher than the surfaces not to be contacted with the flexible insulating base. Even when a film base is thin, bending stress applied to the conductive wirings is relieved sufficiently, and thus breaks in the wirings are suppressed.
摘要翻译：布线板包括：柔性绝缘基座1; 布置在柔性绝缘基座1上的多个导电布线2; 突出电极3分别设置在每个导电布线的同一侧的端部处; 外部端子4,5分别形成在每个导电布线的另一端部; 施加在导电布线，突出电极和外部端子上的金属镀层; 以及分别通过在设置有突出电极的端部与外部端子之间的区域中涂覆导电布线而形成的阻焊层7。在形成阻焊层的区域中，在导电布线上不形成金属镀层，与挠性绝缘基体接触的导电配线的表面比不与柔性绝缘体接触的表面更粗糙基础。即使当薄膜基底较薄时，施加到导电布线的弯曲应力被充分地减轻，因此抑制布线中断。

50. 发明申请

US20060267219A1 Wiring board and semiconductor device 审中-公开
标题翻译：接线板和半导体器件
公开(公告)号：US20060267219A1
公开(公告)日：2006-11-30
申请号：US11442185
申请日：2006-05-26
申请人： Yoshifumi Nakamura , Kouichi Nagao , Hiroyuki Imamura
发明人： Yoshifumi Nakamura , Kouichi Nagao , Hiroyuki Imamura
IPC分类号： H01L23/52
CPC分类号： H01L23/49838 , H01L23/49816 , H01L23/4985 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flexible insulating base, a plurality of conductor wirings provided on the base, and a plurality of bump electrodes that are formed on the plurality of conductor wirings, respectively, are provided. A semiconductor chip having electrode pads is to be mounted by placing the semiconductor chip on the bump electrodes and bonding the electrode pads and the bump electrodes, respectively. The bump electrodes are placed on the conductor wirings, respectively, in edge portions of at least two sides of a chip mounting region in which the semiconductor chip is to be mounted. The conductor wiring corresponding to at least one of the bump electrodes placed in the edge portions of the two sides passes through the chip mounting region so as to be routed via a side different from the side on which the at least one of the bump electrodes is placed, and then led to an outside of the chip mounting region. It is possible to route wirings more freely for leading conductor wirings from bump electrodes placed in an edge portion of a semiconductor chip mounting region to an outside of the chip mounting region.
摘要翻译：提供柔性绝缘基座，设置在基座上的多个导体布线和分别形成在多个导体布线上的多个凸块电极。通过将半导体芯片放置在凸块电极上并分别结合电极焊盘和凸块电极来安装具有电极焊盘的半导体芯片。凸起电极分别放置在芯片安装区域的至少两侧的边缘部分中，半导体芯片将要安装在其中。对应于放置在两侧边缘部分中的凸起电极中的至少一个凸起电极的导体布线通过芯片安装区域，以便经由与其中至少一个凸起电极的侧面不同的一侧放置，然后引导到芯片安装区域的外部。可以更加自由地将布线布线从位于半导体芯片安装区域的边缘部分中的凸起电极引导到芯片安装区域的外部。

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