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    • 43. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US07382651B2
    • 2008-06-03
    • US11616122
    • 2006-12-26
    • Osamu NagaoYasuyuki FukudaHideo Mukai
    • Osamu NagaoYasuyuki FukudaHideo Mukai
    • G11C16/00
    • G11C16/16G11C16/0483
    • In a control order of non-selected blocks at the time of data erase operation of one or a plurality of blocks, the control gate line is controlled to ground potential at first, then subsequently, a transfer transistor of the non-selected blocks is set to be an off-state. Next, high voltage is supplied to the well region and the data of the selected block is erased. Then, the control gate line is charged to the voltage which is used, for instance, at the time of reading out, or to the voltage (Vcg) which is used at the verification (Vcg). After the control gate line is charged to Vcg, the erase voltage supplied to the well region is discharged. Then, the control gate line is returned to ground potential after completing the discharge of the well region, and thus the data erase operation of the block is completed.
    • 在一个或多个块的数据擦除操作时以非选择的块的控制顺序,首先将控制栅极线控制为接地电位,然后设置未选择块的传输晶体管 成为一个离开的国家。 接下来,向阱区域提供高电压,并且擦除所选块的数据。 然后,控制栅极线被充电到例如在读出时使用的电压或者在验证时使用的电压(Vcg)(Vcg)。 在控制栅极线被充电到Vcg之后,提供给阱区的擦除电压被放电。 然后,在完成了阱区的放电之后,控制栅极线返回到接地电位,从而完成了块的数据擦除操作。
    • 44. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20070147117A1
    • 2007-06-28
    • US11616122
    • 2006-12-26
    • Osamu NagaoYasuyuki FukudaHideo Mukai
    • Osamu NagaoYasuyuki FukudaHideo Mukai
    • G11C16/04G11C16/06G11C11/34
    • G11C16/16G11C16/0483
    • In a control order of non-selected blocks at the time of data erase operation of one or a plurality of blocks, the control gate line is controlled to ground potential at first, then subsequently, a transfer transistor of the non-selected blocks is set to be an off-state. Next, high voltage is supplied to the well region and the data of the selected block is erased. Then, the control gate line is charged to the voltage which is used, for instance, at the time of reading out, or to the voltage (Vcg) which is used at the verification (Vcg). After the control gate line is charged to Vcg, the erase voltage supplied to the well region is discharged. Then, the control gate line is returned to ground potential after completing the discharge of the well region, and thus the data erase operation of the block is completed.
    • 在一个或多个块的数据擦除操作时以非选择的块的控制顺序,首先将控制栅极线控制为接地电位,然后设置未选择块的传输晶体管 成为一个离开的国家。 接下来,向阱区域提供高电压,并且擦除所选块的数据。 然后,控制栅极线被充电到例如在读出时使用的电压或者在验证时使用的电压(Vcg)(Vcg)。 在控制栅极线被充电到Vcg之后,提供给阱区的擦除电压被放电。 然后,在完成了阱区的放电之后,控制栅极线返回到接地电位,从而完成了块的数据擦除操作。
    • 46. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06567322B1
    • 2003-05-20
    • US09528177
    • 2000-03-17
    • Hideo MukaiKaoru Nakagawa
    • Hideo MukaiKaoru Nakagawa
    • G11C700
    • G11C29/785G11C29/81
    • In a DRAM semiconductor memory device, a DRAM semiconductor memory device disclosed herein comprises a first spare element SWL provided for each of a plurality of normal banks BANK0-BANK15 formed by dividing a memory cell array into a plurality of sections, a second spare element SWL provided for a spare bank BANKSP different from the normal banks, a plurality of first spare decoders SRD0-SRD3 for selectively operating the first spare element, a plurality of second spare decoders SRD0-SRD3 for selectively operating the second spare element, and a substitution-control circuits FS0a-FS27a, RWLON1-RWLON2, SRDact0-SRDact3 for selectively assigning the second spare elements to arbitrary banks of the plurality of normal banks. With the above structure, the total number of the spare elements of the defective memory cells of the DRAM can be reduced while the relieving ratio is being maintained. As a result, the area efficiency of the redundant circuit on the chip can be improved.
    • 在DRAM半导体存储器件中,本文公开的DRAM半导体存储器件包括:通过将存储单元阵列划分为多个部分而形成的多个正常库BANK0-BANK15中的每一个设置的第一备用元件SWL,第二备用元件SWL 提供了与正常库不同的备用银行BANKSP,用于选择性地操作第一备用元件的多个第一备用解码器SRD0-SRD3,用于选择性地操作第二备用元件的多个第二备用解码器SRD0-SRD3, 控制电路FS0a-FS27a,RWLON1-RWLON2,SRDact0-SRDact3,用于选择性地将第二备用元件分配给多个正常库中的任意组。 利用上述结构,可以减小DRAM的有缺陷的存储单元的备用元件的总数,同时保持释放比。 结果,能够提高芯片上的冗余电路的面积效率。
    • 48. 发明授权
    • Semiconductor memory
    • 半导体存储器
    • US5982695A
    • 1999-11-09
    • US64047
    • 1998-04-22
    • Hideo Mukai
    • Hideo Mukai
    • G11C11/401G11C5/14G11C7/12G11C8/10G11C11/407G11C11/409G11C7/00G11C11/24
    • G11C5/147G11C5/145G11C7/12G11C8/10
    • A semiconductor memory includes memory cell array, a voltage boosting circuit, a potential generating circuit and a sense amplifier. The memory cell array is composed of a matrix arrangement of memory cells. Each memory cell is composed of a storage device which is selectively controlled by a word line control signal and a bit line control signal supplied to a word line and a bit line at a predetermined timing. The voltage boosting circuit boosts a potential on a word line selected by the word line control signal up to a first potential that is higher than an internal power source potential. The potential generating circuit sets the potential of the bit line selected by the bit line control signal. The potential of the bit line is set to a second potential that is higher than a potential that is lower than the first potential by a threshold of the memory cell. The sense amplifier is operated using the second potential as an operating power source. The sense amplifier amplifies a potential difference between a reference bit line and a read bit line to which data stored in the selectively controlled memory cell is transmitted.
    • 半导体存储器包括存储单元阵列,升压电路,电位发生电路和读出放大器。 存储单元阵列由存储单元的矩阵排列组成。 每个存储单元由存储装置组成,存储装置由字线控制信号和提供给字线和位线的位线控制信号在预定定时被选择地控制。 升压电路将由字线控制信号选择的字线上的电位升高到高于内部电源电位的第一电位。 电位发生电路设定由位线控制信号选择的位线的电位。 位线的电位被设置为比存储器单元的阈值低于第一电位的电位的第二电位。 使用第二电位作为工作电源来操作读出放大器。 读出放大器放大参考位线和存储在选择性控制的存储单元中的数据被发送到的读位线之间的电位差。